公开(公告)号：US20180326206A1

公开(公告)日：2018-11-15

申请号：US16045035

申请日：2018-07-25

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Richard L. Brendel

IPC: A61N1/08 ,  A61N1/37 ,  A61N1/375 ,  H01G4/35 ,  H05K1/18 ,  H01G4/06

CPC classification number: A61N1/08 ,  A61N1/086 ,  A61N1/3718 ,  A61N1/375 ,  A61N1/3754 ,  H01G4/06 ,  H01G4/35 ,  H01G4/40 ,  H01R13/7195 ,  H03H1/0007 ,  H03H7/1766 ,  H03H2001/0042 ,  H03H2001/0085 ,  H05K1/181 ,  H05K5/0095 ,  H05K9/00 ,  H05K999/99 ,  H05K2201/10015

Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises at least a first electrical connection material connected directly to the first gold braze, and at least an internal ground plate disposed within the circuit board substrate with the internal ground plate being electrically connected to both the first electrical connection material and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.

公开(公告)号：US20180304084A1

公开(公告)日：2018-10-25

申请号：US16004569

申请日：2018-06-11

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Keith W. Seitz ,  Thomas Marzano ,  Marc Gregory Martino

IPC: A61N1/375 ,  H02G3/22 ,  H01R43/00 ,  A61N1/05 ,  A61N1/08 ,  H01G4/40 ,  H01G4/35 ,  H01G4/30 ,  H01G4/12 ,  H01G4/005 ,  H01G2/10 ,  C22C29/12 ,  B23K35/30 ,  A61N1/372

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

Abstract: A hermetically sealed filtered feedthrough assembly attachable to an AIMD includes an insulator hermetically sealing a ferrule opening of an electrically conductive ferrule with a gold braze. A co-fired and electrically conductive sintered paste is disposed within and hermetically seals at least one via hole extending in the insulator. At least one capacitor is disposed on the device side. An active electrical connection electrically connects a capacitor active metallization and the sintered paste. A ground electrical connection electrically connects the gold braze to a capacitor ground metallization, wherein at least a portion of the ground electrical connection physically contacts the gold braze. The dielectric of the capacitor may be less than 1000 k. The ferrule may include an integrally formed peninsula portion extending into the ferrule opening spatially aligned with a ground passageway and metallization of an internally grounded feedthrough capacitor. The sintered paste may be of substantially pure platinum.

公开(公告)号：US20180197661A1

公开(公告)日：2018-07-12

申请号：US15863194

申请日：2018-01-05

Applicant: Greatbatch Ltd.

Inventor： Keith W. Seitz ,  Dallas J. Rensel ,  Brian P. Hohl ,  Jonathan Calamel ,  Xiaohong Tang ,  Robert A. Stevenson ,  Christine A. Frysz ,  Thomas Marzano ,  Jason Woods ,  Richard L. Brendel

IPC: H01B17/30 ,  A61N1/375 ,  C04B41/51 ,  C04B41/45 ,  C04B41/00 ,  C04B41/88 ,  H01B19/02

CPC classification number: H01B17/30 ,  A61N1/3754 ,  B22F7/04 ,  B22F7/08 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/19 ,  B23K26/21 ,  B23K26/32 ,  B23K2101/36 ,  B23K2103/14 ,  C04B41/0072 ,  C04B41/4578 ,  C04B41/5122 ,  C04B41/5177 ,  C04B41/5194 ,  C04B41/88 ,  H01B19/02

Abstract: A method of manufacturing a feedthrough dielectric body for an active implantable medical device includes the steps of: a) forming an alumina ceramic body in a green state, or, stacking upon one another discrete layers of alumina ceramic in a green state and pressing; b) forming at least one via hole straight through the alumina ceramic body; c) filling the at least one via hole with a ceramic reinforced metal composite paste; d) drying the alumina ceramic body and the ceramic reinforced metal composite paste; e) forming a second hole straight through the ceramic reinforced metal composite paste being smaller in diameter in comparison to the at least one via hole; f) filling the second hole with a substantially pure metal paste; g) sintering the alumina ceramic body, the ceramic reinforced metal composite paste and the metal paste; and h) hermetically sealing the feedthrough dielectric body to a ferrule.

公开(公告)号：US09656064B2

公开(公告)日：2017-05-23

申请号：US14316896

申请日：2014-06-27

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Warren S. Dabney ,  Christine A. Frysz ,  Richard L. Brendel

IPC: A61N1/00 ,  A61N1/08 ,  A61N1/05 ,  H01F17/02 ,  H03H1/00

Abstract: A multilayer helical wave filter having a primary resonance at a selected RF diagnostic or therapeutic frequency or frequency range, includes an elongated conductor forming at least a portion of an implantable medical lead. The elongated conductor includes a first helically wound segment having at least one planar surface, a first end and a second end, which forms a first inductive component, and a second helically wound segment having at least one planar surface, a first end and a second end, which forms a second inductive element. The first and second helically wound segments are wound in the same longitudinal direction and share a common longitudinal axis. Planar surfaces of the helically wound segments face one another, and a dielectric material is disposed between the facing planar surfaces of the helically wound segments and between adjacent coils of the helically wound segments, thereby forming a capacitance.

公开(公告)号：US20170087356A1

公开(公告)日：2017-03-30

申请号：US15375315

申请日：2016-12-12

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Richard L. Brendel

IPC: A61N1/08 ,  A61N1/375 ,  H03H1/00 ,  A61N1/37

CPC classification number: A61N1/08 ,  A61N1/086 ,  A61N1/3718 ,  A61N1/375 ,  A61N1/3754 ,  A61N2001/086 ,  H01G4/06 ,  H01G4/35 ,  H01G4/40 ,  H01R13/7195 ,  H03H1/0007 ,  H03H7/1766 ,  H03H2001/0042 ,  H03H2001/0085 ,  H05K1/181 ,  H05K5/0095 ,  H05K9/00 ,  H05K2201/10015

Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the Insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the capacitor. A ground path electrically extends between the ground end metallization of the chip capacitor and the ferrule. There is also an active path electrically extending between the active end metallization of the chip capacitor and the lead wire. The active path comprises at least a first electrical connection material connected directly to both the second gold braze and the lead wire, and the first electrical connection material is electrically connected to the active end metallization of the chip capacitor.

公开(公告)号：US20170087354A1

公开(公告)日：2017-03-30

申请号：US15373139

申请日：2016-12-08

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Richard L. Brendel

IPC: A61N1/08 ,  H01G4/40 ,  H01G4/35 ,  A61N1/375 ,  H03H1/00 ,  H03H7/01 ,  H05K1/18 ,  A61N1/37 ,  H01R13/7195 ,  H05K5/00

CPC classification number: A61N1/08 ,  A61N1/086 ,  A61N1/3718 ,  A61N1/375 ,  A61N1/3754 ,  A61N2001/086 ,  H01G4/06 ,  H01G4/35 ,  H01G4/40 ,  H01R13/7195 ,  H03H1/0007 ,  H03H7/1766 ,  H03H2001/0042 ,  H03H2001/0085 ,  H05K1/181 ,  H05K5/0095 ,  H05K9/00 ,  H05K2201/10015

Abstract: An EMI/energy dissipating filter for an active implantable medical device (AIMD) is described. The filter comprises a first gold braze hermetically sealing the insulator to a ferrule that is configured to be mounted in an opening in a housing for the AIMD. A lead wire is hermetically sealed in a passageway through the insulator by a second gold braze. A circuit board substrate is disposed adjacent the insulator. A two-terminal chip capacitor disposed adjacent to the circuit board has an active end metallization that is electrically connected to the active electrode plates and a ground end metallization that is electrically connected to the at least one ground electrode plates of the chip capacitor. There is a ground path electrically extending between the ground end metallization of the chip capacitor and the ferrule. The ground path comprises at least a first electrical connection material connected directly to the first gold braze, and at least an internal ground plate disposed within the circuit board substrate with the internal ground plate being electrically connected to both the first electrical connection material and the ground end metallization of the chip capacitor. An active path electrically extends between the active end metallization of the chip capacitor and the lead wire.

公开(公告)号：US09492659B2

公开(公告)日：2016-11-15

申请号：US14182569

申请日：2014-02-18

Applicant: Greatbatch Ltd.

Inventor： Xiaohong Tang ,  William C. Thiebolt ,  Christine A. Frysz ,  Keith W. Seitz ,  Robert A. Stevenson ,  Richard L. Brendel ,  Thomas Marzano ,  Jason Woods ,  Dominick J. Frustaci ,  Steven W. Winn

IPC: H01R43/00 ,  A61N1/08 ,  A61N1/05 ,  H01G4/35 ,  H01G2/10 ,  H01G4/005 ,  H01G4/12 ,  H01G4/40 ,  H02G3/22 ,  A61N1/372 ,  A61N1/375 ,  C22C29/12

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

Abstract: A co-fired hermetically sealed feedthrough is attachable to an active implantable medical device. The feedthrough comprises an alumina dielectric substrate comprising at least 96 or 99% alumina. A via hole is disposed through the alumina dielectric substrate from a body fluid side to a device side. A substantially closed pore, fritless and substantially pure platinum fill is disposed within the via hole forming a platinum filled via electrically conductive between the body fluid side and the device side. A hermetic seal is between the platinum fill and the alumina dielectric substrate, wherein the hermetic seal comprises a tortuous and mutually conformal interface between the alumina dielectric substrate and the platinum fill.

Abstract translation: 共同燃烧的密封馈通可附接到主动植入式医疗装置。 馈通包括包含至少96或99％的氧化铝的氧化铝介电衬底。 通孔穿过氧化铝电介质基板从体液侧设置到器件侧。 在通孔内设置基本封闭的无孔和基本上纯的铂填充物，其在体液侧和装置侧之间形成通过导电的铂填充通孔。 铂填充物和氧化铝电介质基底之间的气密密封，其中气密密封包括在氧化铝电介质基底和铂填充物之间的曲折且相互共形的界面。

公开(公告)号：US09427596B2

公开(公告)日：2016-08-30

申请号：US14826229

申请日：2015-08-14

Applicant: Greatbatch Ltd.

Inventor： Jason Woods ,  Richard L. Brendel ,  Robert A. Stevenson ,  Christopher Michael Williams ,  Robert Naugler ,  Christine A. Frysz

IPC: A61N1/00 ,  A61N1/375 ,  H02G15/013 ,  H01G4/35 ,  H01G4/40 ,  H01G2/02 ,  H01G4/228 ,  H01R13/7195 ,  H03H1/00

CPC classification number: A61N1/3754 ,  H01G2/02 ,  H01G4/228 ,  H01G4/35 ,  H01G4/40 ,  H01R13/7195 ,  H02G15/013 ,  H03H1/00 ,  H03H2001/0042 ,  H03H2001/0085

Abstract: A hermetically sealed filtered feedthrough assembly for an AIMD includes an electrically conductive ferrule with an electrically conductive extension at least partially extending into the ferrule opening. An electrically non-conductive insulator hermetically seals the ferrule opening. An electrically conductive pathway is hermetically sealed and disposed through the insulator between a body fluid and device side. A filter capacitor is located on the device side. A first low impedance electrical coupling is between a first metallization of the filter capacitor and the pathway. A ground conductor is disposed through the filter capacitor in non-conductive relation with the at least one active and ground electrode plates, where the ground conductor is electrically coupled to the extension of the ferrule. An oxide-resistant metal addition is disposed on the device side and electrically couples the ground conductor to the second metallization of the filter capacitor.

Abstract translation: 用于AIMD的气密密封的过滤馈通组件包括具有至少部分延伸到套圈开口中的导电延伸部的导电套圈。 非导电绝缘体气密地密封套圈开口。 导电通路密封并通过绝缘体设置在体液和器件侧之间。 滤波电容器位于器件侧。 第一低阻抗电耦合在滤波电容器的第一金属化和通路之间。 接地导体与所述至少一个有源和接地电极板以非导电关系设置穿过所述滤波电容器，其中所述接地导体电耦合到所述套圈的延伸部。 在器件侧设置耐氧化金属添加剂，并将接地导体电耦合到滤波电容器的第二金属化。

公开(公告)号：US20160008595A1

公开(公告)日：2016-01-14

申请号：US14864959

申请日：2015-09-25

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Thomas Marzano ,  Keith W. Seitz ,  Steven W. Winn ,  Christine A. Frysz ,  Richard L. Brendel ,  Jason Woods ,  Dominick J. Frustaci ,  Xiaohong Tang ,  William C. Thiebolt

IPC: A61N1/08 ,  H02G3/22 ,  H01G4/40 ,  H01G4/005 ,  H01G4/12 ,  H01G4/35

CPC classification number: A61N1/3754 ,  A61N1/05 ,  A61N1/08 ,  A61N1/372 ,  A61N1/375 ,  B23K35/3013 ,  C22C29/12 ,  H01G2/103 ,  H01G4/005 ,  H01G4/12 ,  H01G4/30 ,  H01G4/35 ,  H01G4/40 ,  H01R43/00 ,  H02G3/22 ,  Y10T156/1052

Abstract: A co-connected hermetic feedthrough, feedthrough capacitor, and leadwire assembly includes a dielectric substrate with a via hole disposed through the dielectric substrate from a body fluid side to a device side. A conductive fill is disposed within the via forming a hermetic seal and is electrically conductive between the body fluid side and the device side. A feedthrough capacitor is attached to the dielectric substrate and includes a capacitor dielectric substrate, an unfilled capacitor via hole including an inner metallization, a set of capacitor active electrode plates electrically coupled to the inner metallization, an outer metallization disposed and a set of capacitor ground electrode plates electrically coupled to the outer metallization. A conductive leadwire is disposed within the unfilled capacitor via hole. An electrical joint connects the conductive fill, the capacitor inner metallization along with the capacitor active electrode plates and the conductive leadwire.

Abstract translation: 一个共同连接的密封馈通电源，馈通电容器和引线组件包括具有通孔的电介质基片，其通过介电基片从体液侧设置到器件侧。 导电填料设置在通孔内形成气密密封，并且在体液侧和装置侧之间导电。 馈通电容器附接到电介质基板，并且包括电容器电介质基板，包括内部金属化的未填充的电容器通孔，电耦合到内部金属化的一组电容器有源电极板，设置的外部金属化和一组电容器接地 电极板电耦合到外部金属化。 导电引线设置在未填充的电容器通孔内。 电接头将导电填充物，电容器内部金属化以及电容器有源电极板和导电引线连接。

公开(公告)号：US09014808B2

公开(公告)日：2015-04-21

申请号：US14187297

申请日：2014-02-23

Applicant: Greatbatch Ltd.

Inventor： Robert A. Stevenson ,  Christine A. Frysz ,  Jason Woods ,  Richard L. Brendel ,  Robert S. Johnson ,  Dominick J. Frustaci ,  Warren S. Dabney ,  Keith W. Seitz ,  Thomas Marzano ,  John E. Roberts ,  William C. Thiebolt ,  Christopher M. Williams ,  Buehl E. Truex

IPC: H01G4/35 ,  A61N1/08 ,  A61N1/37 ,  A61N1/375 ,  H03H1/00 ,  A61N1/05

CPC classification number: A61N1/08 ,  A61N1/05 ,  A61N1/3718 ,  A61N1/3754 ,  H01G4/35 ,  H03H1/0007

Abstract: An RF filter for an active medical device (AMD), for handling RF power induced in an associated lead from an external RF field at a selected MRI frequency or range frequencies includes a capacitor having a capacitance of between 100 and 10,000 picofarads, and a temperature stable dielectric having a dielectric constant of 200 or less and a temperature coefficient of capacitance (TCC) within the range of plus 400 to minus 7112 parts per million per degree centigrade. The capacitor's dielectric loss tangent in ohms is less than five percent of the capacitor's equivalent series resistance (ESR) at the selected MRI RF frequency or range of frequencies.

Abstract translation: 用于在选定的MRI频率或范围频率处理来自外部RF场的相关引线中感应的RF功率的用于主动医疗装置（AMD）的RF滤波器包括具有100至10,000皮​​法之间的电容的电容器，以及温度 介电常数为200以下，电容温度系数（TCC）在400〜71212ppm /摄氏度范围内的稳定电介质。 电容器的介电损耗角正切欧姆小于所选MRI射频频率或频率范围内电容器等效串联电阻（ESR）的百分之五。