-
公开(公告)号：US09997435B2
公开(公告)日：2018-06-12
申请号：US15243255
申请日：2016-08-22
发明人： John P. Karidis , Mark D. Schultz
IPC分类号： B23K31/02 , H01L23/473 , H01L21/48 , H01L23/467 , B23K1/00 , B23K101/14
CPC分类号： H01L23/473 , B23K1/0014 , B23K31/02 , B23K2101/14 , H01L21/4882 , H01L21/4885 , H01L23/3677 , H01L23/467 , H01L24/72 , H01L2924/01322 , H01L2924/00
摘要： A heat sink includes a plurality of layers being disposed substantially parallel with a surface of a heat source. The layers include a plurality of pin portions spaced apart from each other in a planar arrangement wherein the pin portions of the layers are stacked and bonded to form pin fins extending in a transverse direction relative to the heat source to sink heat. A compliant layer is disposed between the pin fins and a mechanical load. The compliant layer provides compliance such that the pin fins accommodate dimensional differences when interfacing with the heat source.
-
公开(公告)号：US09939210B2
公开(公告)日：2018-04-10
申请号：US14500541
申请日：2014-09-29
发明人： Mark D. Schultz
摘要： Heat sinks and methods of using the same include a top and bottom plate, at least one of which has a plurality of pin contacts flexibly connected to one another, where the plurality of pin contacts have vertical and lateral flexibility with respect to one another; and pin slice layers, each having multiple pin slices, arranged vertically between the top and bottom plates such that the plurality of pin slices form substantially vertical pins connecting the top and bottom plates.
-
公开(公告)号：US09894801B1
公开(公告)日：2018-02-13
申请号：US15339710
申请日：2016-10-31
IPC分类号： H05K7/20 , H01L23/473 , H01L23/427
CPC分类号： H05K7/20254 , H01L23/427 , H01L23/473 , H05K7/2049 , H05K7/20509
摘要： A cold plate, an electronic assembly including a cold plate, and a method for forming a cold plate are provided. The cold plate includes an interface plate and an opposing plate that form a plenum. The cold plate includes a plurality of active areas arranged for alignment over respective heat generating portions of an electronic assembly, and non-active areas between the active areas. A cooling fluid flows through the plenum. The plenum, at the non-active areas, has a reduced width and/or reduced height relative to the plenum at the active areas. The reduced width and/or height of the plenum, and exterior dimensions of cold plate, at the non-active areas allow the non-active areas to flex to accommodate surface variations of the electronics assembly. The reduced width and/or height non-active areas can be specifically shaped to fit between physical features of the electronics assembly.
-
公开(公告)号：US09875953B2
公开(公告)日：2018-01-23
申请号：US14744944
申请日：2015-06-19
IPC分类号： H05K7/20 , H01L23/04 , H01L23/427 , H01L23/367 , H01L23/473 , H01L23/373
CPC分类号： H01L23/427 , H01L23/3735 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit (IC) can be cooled by using a structure that includes two elements, such as integrated circuits (ICs) or electronic packages, in a stacked arrangement, with the elements having surfaces that face each other. The structure also includes a pair of fluidic channel boundaries, between the facing surfaces, where each fluidic channel boundary is formed by an arrangement of adjacent discrete connecting structures. The primary and secondary fluidic channel boundaries and the facing surfaces define a fluidic channel that is useful for promoting boiling of and directing the flow of a refrigerant between the two surfaces.
-
公开(公告)号：US09831151B1
公开(公告)日：2017-11-28
申请号：US15226971
申请日：2016-08-03
发明人： Mark D. Schultz
IPC分类号： H01L23/48 , H01L23/367 , H01L23/467 , H01L23/473 , H01L23/00
CPC分类号： H01L24/32 , H01L21/4882 , H01L23/42 , H01L23/467 , H01L23/473 , H01L2224/32245
摘要： A thermal interface includes a first thermal interface material (TIM) layer and a lid disposed on the first TIM layer. A second TIM layer is disposed on a surface of the lid opposite the first TIM layer. The second TIM layer is from about 75% to about 25% as wide as a width of the lid in at least one direction. A heat sink disposed on a surface of the second TIM layer opposite the lid.
-
公开(公告)号：US09702767B2
公开(公告)日：2017-07-11
申请号：US15393710
申请日：2016-12-29
CPC分类号： G01K7/427 , G01K7/02 , G01K15/005 , G01K2007/422
摘要： A method includes determining a relationship between indirect thermal data for a processor and a measured temperature associated with the processor, during a calibration process, obtaining the indirect thermal data for the processor during actual operation of the processor, and determining an actual significant temperature associated with the processor during the actual operation using the indirect thermal data for the processor during actual operation of the processor and the relationship.
-
公开(公告)号：US09678289B1
公开(公告)日：2017-06-13
申请号：US14956484
申请日：2015-12-02
发明人： Mark D. Schultz , Shurong Tian
IPC分类号： G02B6/42
CPC分类号： G02B6/4269 , G02B6/4242 , G02B6/4244 , G02B6/4245 , G02B6/4267
摘要： An optical coupling system includes a substrate, an electronic die comprising a plurality of coupling holes for passing light, an optical element die attached to a bottom surface of the electronic die, the electronic die attached to the substrate such that the electronic die covers a cavity in the substrate and the optical element die resides within the cavity of the substrate. The system may also include a thermally conductive lid that covers and contacts the electronic die and the substrate and has a coupling aperture that enables light that passes through the coupling holes to pass through the thermally conductive lid. The system may also include an optical cable coupler comprising a coupling section that laterally fits within the coupling aperture and a body section disposed above the coupling section that is laterally larger than the coupling section. A method for providing the above system is also disclosed herein.
-
公开(公告)号：US09370122B2
公开(公告)日：2016-06-14
申请号：US13738961
申请日：2013-01-10
CPC分类号： H05K7/20009 , G06F3/044 , G06F2203/04108 , G06F2203/04805 , H05K7/20772
摘要： A cooling structure including a thermally conducting central element having a channel formed therein, the channel being configured for flow of cooling fluid there through, a first pressure plate, and a first thermally conductive resilient member disposed between the thermally conducting central element and the first pressure plate, wherein the first pressure plate, the first thermally conductive resilient member, and the thermally conducting central element form a first heat transfer path.
摘要翻译： 一种冷却结构，包括具有形成在其中的通道的导热中心元件，所述通道构造成用于通过其流动冷却流体，第一压力板和设置在导热中心元件与第一压力之间的第一导热弹性构件 板，其中第一压力板，第一导热弹性构件和导热中心元件形成第一传热路径。
-
公开(公告)号：US20160128232A1
公开(公告)日：2016-05-05
申请号：US14744944
申请日：2015-06-19
IPC分类号： H05K7/20 , H01L23/04 , H01L23/427 , H01L23/367 , H01L23/473
CPC分类号： H01L23/427 , H01L23/3735 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit (IC) can be cooled by using a structure that includes two elements, such as integrated circuits (ICs) or electronic packages, in a stacked arrangement, with the elements having surfaces that face each other. The structure also includes a pair of fluidic channel boundaries, between the facing surfaces, where each fluidic channel boundary is formed by an arrangement of adjacent discrete connecting structures. The primary and secondary fluidic channel boundaries and the facing surfaces define a fluidic channel that is useful for promoting boiling of and directing the flow of a refrigerant between the two surfaces.
摘要翻译： 集成电路（IC）可以通过使用包括诸如集成电路（IC）或电子封装的两个元件的结构以堆叠布置而被冷却，元件具有彼此面对的表面。 该结构还包括在相对表面之间的一对流体通道边界，其中每个流体通道边界由相邻离散连接结构的布置形成。 主要和次要流体通道边界和相对表面限定了流体通道，其可用于促进制冷剂在两个表面之间的沸腾并引导制冷剂的流动。
-
公开(公告)号：US20140192476A1
公开(公告)日：2014-07-10
申请号：US13738961
申请日：2013-01-10
CPC分类号： H05K7/20009 , G06F3/044 , G06F2203/04108 , G06F2203/04805 , H05K7/20772
摘要： A cooling structure including a thermally conducting central element having a channel formed therein, the channel being configured for flow of cooling fluid there through, a first pressure plate, and a first thermally conductive resilient member disposed between the thermally conducting central element and the first pressure plate, wherein the first pressure plate, the first thermally conductive resilient member, and the thermally conducting central element form a first heat transfer path.
摘要翻译： 一种冷却结构，包括具有形成在其中的通道的导热中心元件，所述通道构造成用于通过其流动冷却流体，第一压力板和设置在导热中心元件与第一压力之间的第一导热弹性构件 板，其中第一压力板，第一导热弹性构件和导热中心元件形成第一传热路径。
-
-
-
-
-
-
-
-
-
搜索结果
87 条记录 (耗时 0.025 秒)
