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公开(公告)号：US11614497B2
公开(公告)日：2023-03-28
申请号：US16702077
申请日：2019-12-03
Applicant: International Business Machines Corporation
Inventor： Matthew Doyle , James Busby , Edward N. Cohen , John R. Dangler , Gerald Bartley , Michael Fisher , Arthur Higby , David Clifford Long , Mark J. Jeanson , Darryl Becker
Abstract: An electronic system can be used to monitor temperature. The electronic system can include a characterized dielectric located adjacent to a plurality of heat-producing electronic devices. The electronic system can also include a leakage measurement circuit that is electrically connected to the characterized dielectric. The leakage measurement circuit can be configured to measure current leakage through the characterized dielectric. The leakage measurement circuit can also be configured to convert a leakage current measurement into a corresponding output voltage. A response device, electrically connected to the leakage measurement circuit can be configured to, in response to the output voltage exceeding a voltage threshold corresponding to a known temperature, initiate a response action.
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公开(公告)号：US20230052436A1
公开(公告)日：2023-02-16
申请号：US17444916
申请日：2021-08-12
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Matthew Doyle , John R. Dangler , Layne A. Berge , Jason J. Bjorgaard , Matthew A. Walther , Kyle Schoneck , Thomas W. Liang
Abstract: A system and method for slowing a vehicle. Road conditions around the vehicle are monitored, and determined if those road conditions are hazardous. An engine control unit is informed of the hazardous road conditions and alters the operation of the engine control unit in response to the hazardous road conditions. When an operator of the vehicle desires to slow the vehicle down, an indication is received indicating the intent to slow the vehicle down. The vehicle is then slowed based upon the altered operation of the engine control unit by applying a vacuum to increase a manifold vacuum of the engine.
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公开(公告)号：US11493565B2
公开(公告)日：2022-11-08
申请号：US16702160
申请日：2019-12-03
Applicant: International Business Machines Corporation
Inventor： Matthew Doyle , James Busby , Edward N. Cohen , John R. Dangler , Michael Fisher , Arthur Higby , David Clifford Long
Abstract: An electronic system can include an electronic module and a trace circuit that provides a perimeter that encloses the electronic module. A sensing circuit within the electronic system can be configured to detect a discontinuity in the perimeter. In response to detecting the discontinuity in the perimeter, the sensing circuit can initiate, from a response device, a response signal.
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公开(公告)号：US20220322540A1
公开(公告)日：2022-10-06
申请号：US17216863
申请日：2021-03-30
Applicant: International Business Machines Corporation
Inventor： Matthew Doyle , Thomas W. Liang , Layne A. Berge , John R. Dangler , Jason J. Bjorgaard , Kyle Schoneck , Matthew A. Walther
Abstract: A ball-grid-array component of a ball-grid array assembly is analyzed prior to reflow. A predicted warping pattern of the ball-grid-array component that is likely to occur during reflow is predicted based on the analyzing. A solder ball ball-grid-array defect that could be caused by the predicted warping pattern is predicted. An initial via suction pattern to mitigate the ball-grid-array defect is assigned. A vacuum head is applied to a via in the ball-grid-array assembly. The solder ball is located at the opposite end of the via from the vacuum head. Suction is applied to the via based on the via suction pattern. The suction draws a portion of the solder ball into the via during reflow.
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45.发明授权公开(公告)号：US11382210B1
公开(公告)日：2022-07-05
申请号：US17124621
申请日：2020-12-17
Applicant: International Business Machines Corporation
Inventor： John R. Dangler , Arthur J Higby , Philipp K Buchling Rego , David Clifford Long , James Busby , Matthew Doyle , Edward N. Cohen , Michael Fisher , William Santiago-Fernandez
Abstract: A uniform thickness flex circuit is taught that uses more than one dielectric layer. A first dielectric layer is more flexible and capable of reliably bending at a radius of curvature at which a second dielectric layer cannot be reliably bent. The second dielectric layer has at least one more desirable electrical characteristic than the first dielectric area, for example leakage. Use of the uniform thickness flex circuit to protect sensitive material in an electronic enclosure is also described.
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Patent Agency Ranking
公开(公告)号：US20220005449A1
公开(公告)日：2022-01-06
申请号：US16919864
申请日：2020-07-02
Applicant: International Business Machines Corporation
Inventor： Layne A. Berge , Jason J. Bjorgaard , John R. Dangler , Matthew Doyle , Thomas W. Liang , Kyle Schoneck , Matthew A. Walther , Jeffrey N. Judd , Henry Michael Newshutz , Matthew S Kelly
IPC: G10K11/175 , H04R1/10
Abstract: A system and method to prevent eavesdropping by a device. An anti-eavesdrop component is installed on the device. The anti-eavesdrop component is configured to actively prevent the device from capturing audio from the environment. In response to installing the anti-eavesdrop component, the device recognizes the anti-eavesdrop component as a primary audio input for the device. The anti-eavesdrop component then proceeds to block the device from capturing outside audio by injecting noise or otherwise interfering with the primary audio input.
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公开(公告)号：US11059120B2
公开(公告)日：2021-07-13
申请号：US16177565
申请日：2018-11-01
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Matthew S. Kelly , Joseph Kuczynski , Scott B. King , Bruce J. Chamberlin , Matthew Doyle
IPC: B23K3/08 , H05K3/34 , B23K1/00 , B23K101/42
Abstract: Fabrication of a reliable circuit board assembly with soldered, plated through-hole structures is facilitated by characterizing plating of a plated through-hole of the circuit board using time-domain reflectance to obtain a base reflectance measurement, and applying solder to the plated through-hole. Based on applying the solder, the plating of the plated through-hole of the circuit board is re-characterized using time-domain reflectance to obtain a new reflectance value. Based on a deviation between the new reflectance measurement and the base reflectance measurement exceeding a threshold, dissolution, at least in part, of the plating of the plated through-hole due to applying the solder is identified.
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公开(公告)号：US11054442B2
公开(公告)日：2021-07-06
申请号：US16583494
申请日：2019-09-26
Applicant: International Business Machines Corporation
Inventor： Layne A. Berge , Matthew Doyle , Kyle Schoneck , Thomas W. Liang , Matthew A. Walther , Jason J. Bjorgaard , John R. Dangler
IPC: G01R31/02 , G01R1/04 , G01R31/28 , G01R19/252 , G01R31/30
Abstract: Electrical current flow in a ball grid array (BGA) package can be measured by an apparatus including an integrated circuit (IC) electrically connected to the BGA package. Solder balls connect the BGA package to a printed circuit board (PCB). A current sense mesh can be placed between adjacent solder balls and is attached to the upper surface of the PCB. The solder balls are electrically connected to supply current from the PCB through the BGA package to the IC. A MUX/Sequencer can sequentially connect wires of the current sense mesh to an amplifier. The amplifier can amplify a voltage induced on the current sense mesh by current flow into the BGA package. A sensing analog-to-digital converter (ADC) is electrically connected to convert a voltage at the output of the amplifier into digital output signals.
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公开(公告)号：US20210096177A1
公开(公告)日：2021-04-01
申请号：US16583521
申请日：2019-09-26
Applicant: International Business Machines Corporation
Inventor： Layne A. Berge , Matthew Doyle , Kyle Schoneck , Thomas W. Liang , Matthew A. Walther , Jason J. Bjorgaard , John R. Dangler
IPC: G01R31/28
Abstract: Electrical current flow in a ball grid array (BGA) package can be measured by an apparatus including an integrated circuit (IC) electrically connected to the BGA package. Solder balls connect the BGA package to a printed circuit board (PCB). A current sense loop can be fabricated on a wiring plane of the PCB to encircle a current supply via that supplies current to an IC mounted on the BGA package. A MUX/Sequencer can sequentially connect wires of the current sense loop to an amplifier. The amplifier can amplify a voltage induced on the current sense mesh by current flow into the BGA package. A sensing analog-to-digital converter (ADC) is electrically connected to convert a voltage at the output of the amplifier into digital output signals.
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公开(公告)号：US20210096168A1
公开(公告)日：2021-04-01
申请号：US16583464
申请日：2019-09-26
Applicant: International Business Machines Corporation
Inventor： Layne A. Berge , Matthew Doyle , Kyle Schoneck , Thomas W. Liang , Matthew A. Walther , Jason J. Bjorgaard , John R. Dangler
IPC: G01R31/28 , H01L23/00 , H01L25/065 , H01L21/48 , H01L23/498 , G01R19/25
Abstract: Electrical current flow in a ball grid array (BGA) package can be measured by an apparatus including an integrated circuit (IC) electrically connected to the BGA package. Solder balls connect the BGA package to a printed circuit board (PCB) and are arranged to provide a contiguous channel for a current sense wire. A subset of solder balls is electrically connected to supply current from the PCB through the BGA package to the IC. The current sense wire is attached to the upper surface of the PCB, within the contiguous channel, and surrounds the subset of solder balls. An amplifier is electrically connected to the current sense wire ends to amplify a voltage induced on the current sense wire by current flow into the BGA package. A sensing analog-to-digital converter (ADC) is electrically connected to convert a voltage at the output of the amplifier into digital output signals.
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