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公开(公告)号：US11178757B2
公开(公告)日：2021-11-16
申请号：US16029114
申请日：2018-07-06
Applicant: International Business Machines Corporation
Inventor： Bruce J. Chamberlin , Matthew S. Kelly , Scott B. King , Joseph Kuczynski
Abstract: A process of manufacturing a multiple-layer printed circuit board includes selectively applying a dielectric resin to a region of a circuitized core layer. The process also includes partially curing the dielectric resin prior to performing a lamination cycle to form the multiple-layer printed circuit board that includes the circuitized core layer.
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公开(公告)号：US11059120B2
公开(公告)日：2021-07-13
申请号：US16177565
申请日：2018-11-01
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Matthew S. Kelly , Joseph Kuczynski , Scott B. King , Bruce J. Chamberlin , Matthew Doyle
IPC: B23K3/08 , H05K3/34 , B23K1/00 , B23K101/42
Abstract: Fabrication of a reliable circuit board assembly with soldered, plated through-hole structures is facilitated by characterizing plating of a plated through-hole of the circuit board using time-domain reflectance to obtain a base reflectance measurement, and applying solder to the plated through-hole. Based on applying the solder, the plating of the plated through-hole of the circuit board is re-characterized using time-domain reflectance to obtain a new reflectance value. Based on a deviation between the new reflectance measurement and the base reflectance measurement exceeding a threshold, dissolution, at least in part, of the plating of the plated through-hole due to applying the solder is identified.
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公开(公告)号：US09662732B2
公开(公告)日：2017-05-30
申请号：US15188299
申请日：2016-06-21
Applicant: International Business Machines Corporation
Inventor： Stephen M. Hugo , Matthew S. Kelly
IPC: B23K1/00 , B23K1/20 , H05K7/20 , B23K3/08 , B23K31/12 , B23K31/02 , H05K3/34 , B23K1/08 , B23K3/06
CPC classification number: B23K3/08 , B23K1/0016 , B23K1/085 , B23K3/0653 , B23K31/02 , B23K31/12 , B23K2101/42 , H05K3/3447 , H05K3/3468 , H05K2203/044 , H05K2203/1509 , H05K2203/306
Abstract: A method, apparatus, and computer program product for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.
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公开(公告)号：US20160044791A1
公开(公告)日：2016-02-11
申请号：US14454839
申请日：2014-08-08
Applicant: International Business Machines Corporation
Inventor： Stephen M. Hugo , Matthew S. Kelly
CPC classification number: B23K3/08 , B23K1/0016 , B23K1/085 , B23K3/0653 , B23K31/02 , B23K31/12 , B23K2101/42 , H05K3/3447 , H05K3/3468 , H05K2203/044 , H05K2203/1509 , H05K2203/306
Abstract: A method, apparatus, and computer program product for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.
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公开(公告)号：US09232664B2
公开(公告)日：2016-01-05
申请号：US14102994
申请日：2013-12-11
Applicant: International Business Machines Corporation
Inventor： Stephen M. Hugo , Matthew S. Kelly
CPC classification number: H05K3/3447 , B23K1/085 , B23K3/0653 , H05K1/0292 , H05K3/3468 , H05K13/04 , H05K2201/09127 , H05K2203/044
Abstract: A structure including a circuit board including a plane and a pin-in-hole component; and a heat transfer device, where the heat transfer device is thermally connected to the plane at a leading edge of the circuit board, the heat transfer device transfers heat from a wave of molten solder to the plane.
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Patent Agency Ranking
公开(公告)号：US20140183250A1
公开(公告)日：2014-07-03
申请号：US14102994
申请日：2013-12-11
Applicant: International Business Machines Corporation
Inventor： Stephen M. Hugo , Matthew S. Kelly
IPC: H05K13/04
CPC classification number: H05K3/3447 , B23K1/085 , B23K3/0653 , H05K1/0292 , H05K3/3468 , H05K13/04 , H05K2201/09127 , H05K2203/044
Abstract: A structure including a circuit board including a plane and a pin-in-hole component; and a heat transfer device, where the heat transfer device is thermally connected to the plane at a leading edge of the circuit board, the heat transfer device transfers heat from a wave of molten solder to the plane.
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公开(公告)号：US12174241B2
公开(公告)日：2024-12-24
申请号：US18147878
申请日：2022-12-29
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Matthew Doyle , Jeffrey N. Judd , Mark J. Jeanson , Timothy J. Tofil , Matthew S. Kelly , Henry Michael Newshutz
Abstract: An apparatus for tin whisker isolation and detection includes a substrate having a plurality of pads for connecting to an electronic component placed on the substrate, and a shield placed on a surface of the substrate. The shield includes a plurality of cavities aligned over the plurality of pads. A plurality of sensing components each associated with one of the plurality of cavities are configured for sensing an electrically conductive growth from a corresponding pad of the plurality of pads. A plurality of circuit connections are each configured to connect one of the sensing components to detection circuitry. The detection circuitry is configured to receive one or more sensing signals from one or more of the sensing components and detect an electrically conductive growth from the corresponding pad based on the one or more sensing signals.
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公开(公告)号：US20220012917A1
公开(公告)日：2022-01-13
申请号：US16923120
申请日：2020-07-08
Applicant: International Business Machines Corporation
Inventor： Matthew S. Kelly , Sebastien Gilbert , Oswaldo Chacon
IPC: G06T7/90 , G06T7/11 , G06T7/00 , G01N21/956 , H05K13/08
Abstract: A method comprises obtaining a plurality of 2-dimensional gray scale images of a portion of a printed circuit board assembly. Each 2-dimensional gray scale image corresponds to one of a plurality of parallel planes intersecting the portion of the printed circuit board assembly at respective different locations. The method further comprises converting the plurality of 2-dimensional gray scale images into a color image. Each of the plurality of 2-dimensional gray scale images corresponds to and is used as input for a respective color channel of the color image. The method further comprises analyzing the color image to detect variation in color that indicates a defect; and outputting an alert indicating the defect in response to detecting the variation in color.
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公开(公告)号：US10932363B2
公开(公告)日：2021-02-23
申请号：US16536539
申请日：2019-08-09
Applicant: International Business Machines Corporation
Inventor： Bruce J. Chamberlin , Matthew S. Kelly , Scott B. King , Joseph Kuczynski
IPC: H05K1/03 , C08J5/24 , C03C25/34 , C08J5/08 , C09D171/12
Abstract: A process of improving resistance to conductive anodic filament (CAF) formation is disclosed. The process includes dissolving a base resin material, a lubricant material, and a coupling agent in a solvent to form a functionalized sizing agent solution. The process also includes applying the functionalized sizing agent solution to individual glass fibers following a glass fiber formation process. The process further includes removing the solvent via a thermal process that partially converts the base resin material. The thermal process results in formation of coated glass fibers having a flowable resin coating that is compatible with a pre-impregnated (prepreg) matrix material utilized to form a prepreg material for manufacturing a printed circuit board. During one or more printed circuit board manufacturing operations, the flowable resin coating flows to fill voids between the individual glass fibers that represent CAF formation pathways.
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公开(公告)号：US10768245B2
公开(公告)日：2020-09-08
申请号：US16144585
申请日：2018-09-27
Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
Inventor： Matthew S. Kelly , Joseph Kuczynski , Scott B. King , Bruce Chamberlin
Abstract: A compliant pin system includes a pin having a compliant section including a first leg and an opposing second leg. A first plurality of contact members extend along the first leg. A second plurality of contact members extend along the second leg. A pin validation system is operatively connected to the first plurality of contact members and the second plurality of contact members. The pin validation system detects a presence of an electrical signal passing between corresponding pairs of the first plurality of contact members and the second plurality of contact members to determine an integrity of the compliant pin.
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