Abstract:
A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.
Abstract:
Composite heat sink structures and methods of fabrication are provided, with the composite heat sink structures including: a thermally conductive base having a main heat transfer surface to couple to, for instance, at least one electronic component to be cooled; a compressible, continuous sealing member; and a sealing member retainer compressing the compressible, continuous sealing member against the thermally conductive base; and an in situ molded member. The in situ molded member is molded over and affixed to the thermally conductive base, and is molded over and secures in place the sealing member retainer. A coolant-carrying compartment resides between the thermally conductive base and the in situ molded member, and a coolant inlet and outlet are provided in fluid communication with the coolant-carrying compartment to facilitate liquid coolant flow through the compartment.
Abstract:
Conduit connectors for liquid manifolds and methods of fabrication are provided. In one embodiment, a conduit connector is recessed, at least in part, within a liquid manifold, and includes a conduit-receiving opening or socket and at least one releasable retention component. The conduit-receiving opening is disposed within the liquid manifold and in fluid communication with at least one liquid-carrying channel of the liquid manifold. The releasable retention component(s) is selectively operative to threadlessly secure in a fluid-tight manner a conduit within the conduit-receiving opening in fluid communication with the at least one liquid-carrying channel of the liquid manifold to facilitate flow of liquid through the liquid-carrying channel(s), or to release the conduit from the conduit-receiving opening of the conduit connector. The releasable retention component(s) resides at least partially within the liquid manifold when operatively holding the conduit within the conduit-receiving opening.
Abstract:
Cooling apparatuses and methods of fabrication are provided which facilitate immersion-cooling of an electronic component(s). The cooling apparatus includes a drawer-level enclosure sized to reside within an electronics rack. The drawer-level enclosure includes a compartment which accommodates one or more electronic components to be cooled. A dielectric fluid is disposed within the compartment. The dielectric fluid includes a liquid dielectric which at least partially immerses the electronic component(s) within the compartment(s). A hinged, liquid-cooled heat sink is also disposed within the compartment of the enclosure. The heat sink operatively facilitates cooling the one or more electronic components via the dielectric fluid within the compartment, and is rotatable between an operational position overlying the electronic component(s), and a service position which allows access to the electronic component(s).
Abstract:
Tapering couplers and coupling methods for connecting fluid flow components are provided. In one embodiment, the tapering coupler includes a housing with a first opening and a second opening in fluid communication through the housing. The first opening is sized for a first fluid flow component to couple to the housing, and the second opening for a second fluid flow component. The first and second fluid flow components include first and second fluid-carrying channels of different diameter, with the first fluid-carrying channel having a first channel diameter that is larger than the second channel diameter of the second fluid-carrying channel. A tapering element is associated with the housing and extends into the first fluid-carrying channel. The tapering element includes a tapering fluid-carrying channel which tapers in a direction back towards the housing, for instance, from about the first channel diameter to about the second channel diameter.
Abstract:
Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings.
Abstract:
Cooling apparatuses, cooled electronic modules, and methods of fabrication are provided which facilitate heat transfer from one or more electronic components to a coolant. The cooling apparatus includes a coolant-cooled heat sink with a thermally conductive structure having a coolant-carrying compartment including a varying cross-sectional coolant flow area through which coolant flows in a direction substantially parallel to a main heat transfer surface of the structure coupled to the electronic component(s). The coolant-cooled heat sink includes a coolant inlet and a coolant outlet in fluid communication with the coolant-carrying compartment, and the coolant flow area of the coolant-carrying compartment decreases, at least in part, in a direction of coolant flow through the coolant-carrying compartment. The decreasing coolant flow area facilitates an increasing effective heat transfer coefficient between the main heat transfer surface and the coolant by, at least in part, accelerating the coolant flow within the coolant-carrying compartment.
Abstract:
A cooled electronic system and cooling method are provided, wherein a field-replaceable bank of electronic components is cooled by an apparatus which includes an enclosure at least partially surrounding and forming a compartment about the electronic components, a fluid disposed within the compartment, and a heat sink associated with the enclosure. The field-replaceable bank extends, in part, through the enclosure to facilitate operative docking of the electronic components into one or more respective receiving sockets of the electronic system. The electronic components of the field-replaceable bank are, at least partially, immersed within the fluid to facilitate immersion-cooling of the components, and the heat sink facilitates rejection of heat from the fluid disposed within the compartment. In one embodiment, multiple thermal conductors project from an inner surface of the enclosure into the compartment to facilitate transfer of heat from the fluid to the heat sink.
Abstract:
Formed hose configurations are provided which include an innermost elastomer layer, a first fiber-reinforcement region, and multiple second fiber-reinforcement regions. The first fiber-reinforcement region has a first fiber-reinforcement density, and is disposed, at least in part, at a bend region of the formed hose, and the multiple second fiber-reinforcement regions have a second fiber-reinforcement density, and are disposed at least at the first and second end regions of the formed hose. The second fiber-reinforcement density is greater than the first fiber-reinforcement density, and results in the first and second ends of the formed hose being less radially-deformable than the bend region of the hose. This facilitates providing a mechanical fluid-tight connection with a hose barb fitting when the formed hose is slid over the hose barb fitting, absent any clamp over the formed hose and hose barb fitting connection.
Abstract:
Fabrication of formed hoses is provided which include an innermost elastomer layer, a first fiber-reinforcement region, and multiple second fiber-reinforcement regions. The first fiber-reinforcement region has a first fiber-reinforcement density, and is disposed, at least in part, at a bend region of the formed hose, and the multiple second fiber-reinforcement regions have a second fiber-reinforcement density, and are disposed at least at the first and second end regions of the formed hose. The second fiber-reinforcement density is greater than the first fiber-reinforcement density, and results in the first and second ends of the formed hose being less radially-deformable than the bend region of the hose. This facilitates providing a mechanical fluid-tight connection with a hose barb fitting when the formed hose is slid over the hose barb fitting, absent any clamp over the formed hose and hose barb fitting connection.