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公开(公告)号：US07289321B2
公开(公告)日：2007-10-30
申请号：US10989923
申请日：2004-11-16
IPC分类号： H05K7/20
CPC分类号： H05K7/20172
摘要： The present invention provides a ventilated casing for an electronic device. The ventilated casing includes a housing which has a ventilation inlet and a ventilation outlet. The ventilated casing also includes a high speed fan for moving air from the ventilation inlet to the ventilation outlet to dissipate heat that in use is generated by electronic components positioned in the housing. The fan has a blade, a motor and an air guiding portion positioned near the blade. The ventilated casing further includes a suspension for suspending the fan relative to the housing and for damping transmission of vibration originating from the fan.
摘要翻译： 本发明提供一种用于电子设备的通风外壳。 通风外壳包括具有通风口和通风口的外壳。 通风外壳还包括用于将空气从通风入口移动到通风出口的高速风扇，以散发在使用中由位于壳体中的电子部件产生的热量。 风扇具有叶片，马达和位于叶片附近的空气引导部分。 通风外壳还包括用于使风扇相对于壳体悬挂并用于阻止来自风扇的振动的传递的悬架。
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公开(公告)号：US6058011A
公开(公告)日：2000-05-02
申请号：US249039
申请日：1999-02-12
摘要： A computer system that includes a chassis and a removable module configured to be housed inside the chassis. The chassis includes an interface plate incorporated therewith. The interface plate is perforated to allow air to flow through the interface plate and along peripheral cards attached to the interface plate. The air that flows along the peripheral cards then flows through perforations in a cover that is used to secure the peripheral cards into their associated card slots. The cover then directs the air into a primary air passage used to exhaust air pulled through the chassis.
摘要翻译： 一种包括机架和可移动模块的计算机系统，其被配置为容纳在机架内。 底盘包括与其结合的接口板。 接口板穿孔以允许空气流过界面板并且沿着连接到界面板的外围卡片流动。 沿着外围卡流动的空气然后流过用于将外围卡固定到其相关卡槽中的盖子中的穿孔。 盖子然后将空气引导到用于排出通过底盘拉出的空气的主空气通道中。
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公开(公告)号：US08051671B2
公开(公告)日：2011-11-08
申请号：US11242436
申请日：2005-10-03
IPC分类号： F25D23/12
CPC分类号： H05K7/20745
摘要： In certain embodiments, an air-pressurizing device is positioned to discharge a computer system. A supply conduit pneumatically couples a cooled-air discharge conditioning system with an inlet of the air-pressurizing device.
摘要翻译： 在某些实施例中，空气加压装置被定位成排出计算机系统。 供应管道将冷却空气排放调节系统与空气加压装置的入口气动连接。
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公开(公告)号：US20110116225A1
公开(公告)日：2011-05-19
申请号：US13054061
申请日：2008-07-24
CPC分类号： G06F1/20
摘要： In at least some embodiments, an apparatus includes a pressurized air source and a tube coupled to the pressurized air source. The apparatus also includes an electronic component that is spot-cooled by moving air between the pressurized air source and the electronic component via the tube.
摘要翻译： 在至少一些实施例中，设备包括加压空气源和耦合到加压空气源的管。 该装置还包括通过经由管在加压空气源和电子部件之间移动空气而被点冷却的电子部件。
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公开(公告)号：US20130174597A1
公开(公告)日：2013-07-11
申请号：US13347958
申请日：2012-01-11
申请人： Tahir Cader , Ernesto Ferrer , Matthew R. Slaby , Wade D. Vinson
发明人： Tahir Cader , Ernesto Ferrer , Matthew R. Slaby , Wade D. Vinson
IPC分类号： F25B13/00
CPC分类号： F24F13/04 , F24F11/84 , F24F13/08 , F24F13/15 , F24F2013/221 , H05K7/20145 , H05K7/20745 , Y02B30/542 , Y10T137/0318
摘要： Mixing gases within an adiabatic cooling unit can include allowing a first gas at a first temperature to enter a mixing chamber on a non-exposed side of an adiabatic cooling media and utilizing a first baffle to direct the first gas in a direction away from the adiabatic cooling media. Mixing gases within an adiabatic cooling unit can also include allowing a second gas at a second temperature to enter the mixing chamber on an exposed side of the adiabatic cooling media and allowing the first gas and the second gas to mix in the mixing chamber creating a mixed gas. Furthermore, mixing gases within an adiabatic cooling unit can include creating an inlet with the first baffle and a second baffle to direct the mixed gas away from the adiabatic cooling media and allowing the mixed gas to enter through the exposed side of the adiabatic cooling media.
摘要翻译： 绝热冷却单元内的混合气体可包括允许第一温度下的第一气体进入绝热冷却介质的未暴露侧的混合室，并利用第一挡板将第一气体沿远离绝热的方向引导 冷却介质。 绝热冷却单元内的混合气体还可以包括允许在第二温度下的第二气体进入绝热冷却介质的暴露侧上的混合室，并允许第一气体和第二气体在混合室中混合，形成混合 加油站。 此外，在绝热冷却单元内混合气体可包括产生具有第一挡板的入口和第二挡板以将混合气体引导离开绝热冷却介质并允许混合气体通过绝热冷却介质的暴露侧进入。
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公开(公告)号：US07817430B2
公开(公告)日：2010-10-19
申请号：US12138189
申请日：2008-06-12
申请人： David W. Sherrod , Wade D. Vinson , Michael E. Taylor , Arthur G. Volkmann , Troy A Della Fiora , George D. Megason , Chong Sin Tan , Alan B. Doerr
发明人： David W. Sherrod , Wade D. Vinson , Michael E. Taylor , Arthur G. Volkmann , Troy A Della Fiora , George D. Megason , Chong Sin Tan , Alan B. Doerr
CPC分类号： H05K7/20736 , H05K7/20181
摘要： An electronic module enclosure has a frame with an airflow opening. A gate positioned within airflow opening pivots between open and closed positions, allowing a maximum and minimum amount of airflow, respectively, through the airflow opening.
摘要翻译： 电子模块外壳具有带气流开口的框架。 位于气流开口内的门在打开和关闭位置之间枢转，允许分别通过气流开口的最大和最小量的气流。
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公开(公告)号：US07813120B2
公开(公告)日：2010-10-12
申请号：US12138625
申请日：2008-06-13
申请人： Wade D. Vinson , David W. Sherrod
发明人： Wade D. Vinson , David W. Sherrod
CPC分类号： H05K7/20736
摘要： An enclosure houses electronic modules in a front region and a rear region. Airflow can be transferred through electronic modules in the front region and into a plenum. An airflow path in the enclosure transfers airflow from the front region of the enclosure to electronic modules housed in the rear region of the enclosure. Airflow is transferred through the electronic modules in the rear region and into the plenum.
摘要翻译： 外壳在前部区域和后部区域中容纳电子模块。 气流可以通过前部区域中的电子模块传送到集气室。 外壳中的气流将气流从外壳的前部区域转移到容纳在外壳后部区域的电子模块。 气流通过后部区域中的电子模块传送到集气室。
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公开(公告)号：US07599761B2
公开(公告)日：2009-10-06
申请号：US11038723
申请日：2005-01-19
IPC分类号： G05D23/00
CPC分类号： G05D23/19 , G06F1/20 , G06F2200/201 , H05K7/20781
摘要： Systems associated with moving heat out of a computer are described. One exemplary system embodiment includes a large heat exchanger, large, quiet, automatically redundant fans, automatically redundant pumps, and a leak containment apparatus. The example system may also include logics for selectively controlling air flow, liquid flow, and flow paths.
摘要翻译： 描述了将从热计算机移出热量的系统。 一个示例性系统实施例包括大型热交换器，大型，安静的，自动冗余的风扇，自动冗余泵以及泄漏容纳装置。 示例系统还可以包括用于选择性地控制空气流，液体流动和流动路径的逻辑。
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公开(公告)号：US07327571B2
公开(公告)日：2008-02-05
申请号：US11220049
申请日：2005-09-06
IPC分类号： H05K7/20
CPC分类号： G06F1/20 , G06F1/206 , H01L23/34 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： Systems and methods for implementing thermal load balancing are disclosed. In an exemplary embodiment, a thermal load balancing system for a multiprocessor computer having a plurality of processors may comprise a heat sink network having a plurality of local heat sinks. The local heat sinks are thermally coupled to separate processors in the multiprocessor computer. At least one heat pipe thermally couples each of the plurality of local heat sinks in the heat sink network.
摘要翻译： 公开了用于实现热负荷平衡的系统和方法。 在示例性实施例中，用于具有多个处理器的多处理器计算机的热负载平衡系统可以包括具有多个局部散热器的散热器网络。 局部散热器热耦合到多处理器计算机中的分离处理器。 至少一个热管热耦合散热器网络中的多个局部散热器中的每一个。
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公开(公告)号：US07126821B2
公开(公告)日：2006-10-24
申请号：US10990181
申请日：2004-11-16
IPC分类号： H05K7/20
CPC分类号： H05K7/20172
摘要： The present invention provides a ventilated casing for an electronic device. The ventilated casing includes a housing which has a ventilation inlet and a ventilation outlet. The ventilated casing also includes a high speed fan for moving air from the ventilation inlet to the ventilation outlet to dissipate heat that in use is generated by electronic components positioned in the housing. The fan has a blade, a motor and an air guiding portion positioned near the blade. The air guiding portion has a first mode resonance frequency that is greater than the rotational frequency of the fan.
摘要翻译： 本发明提供一种用于电子设备的通风外壳。 通风外壳包括具有通风口和通风口的外壳。 通风外壳还包括用于将空气从通风入口移动到通风出口的高速风扇，以散发在使用中由位于壳体中的电子部件产生的热量。 风扇具有叶片，马达和位于叶片附近的空气引导部分。 空气引导部分具有大于风扇旋转频率的第一模式共振频率。
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