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公开(公告)号：US10818005B2
公开(公告)日：2020-10-27
申请号：US16293599
申请日：2019-03-05
Applicant: KLA—Tencor Corporation
Inventor： Jingshan Zhong , Bjorn Brauer , Lisheng Gao
IPC: G06T7/00 , G06F30/398
Abstract: Methods and systems for determining a layer on which a defect detected on a wafer is located are provided. One method includes detecting defects on a wafer by directing light to the wafer at first and second angles of incidence and determining locations of the defects on the wafer based on the output corresponding to the defects. For one of the defects detected in the output generated for one spot illuminated on the wafer with the light directed to the wafer at the first and second angles, the method includes comparing the locations of the one of the defects determined based on the output generated with the light directed to the one spot on the wafer at the first and second angles. The method further includes determining a layer of the wafer on which the one of the defects is located based on results of the comparing.
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公开(公告)号：US20200240928A1
公开(公告)日：2020-07-30
申请号：US16845681
申请日：2020-04-10
Applicant: KLA-Tencor Corporation
Inventor： Eugene Shifrin , Bjorn Brauer , Sumit Sen , Ashok Mathew , Sreeram Chandrasekaran , Lisheng Gao
IPC: G01N21/95 , H01L21/66 , G01N21/956
Abstract: Defects from a hot scan can be saved, such as on persistent storage, random access memory, or a split database. The persistent storage can be patch-based virtual inspector virtual analyzer (VIVA) or local storage. Repeater defect detection jobs can determined and the wafer can be inspected based on the repeater defect detection jobs. Repeater defects can be analyzed and corresponding defect records to the repeater defects can be read from the persistent storage. These results may be returned to the high level defect detection controller.
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公开(公告)号：US10698325B2
公开(公告)日：2020-06-30
申请号：US16400756
申请日：2019-05-01
Applicant: KLA-TENCOR CORPORATION
Inventor： Bjorn Brauer
Abstract: Alignment can be monitored by positioning at least one alignment verification location per alignment frame. The alignment verification location is a coordinate within the alignment frame. A distance between each of the alignment verification locations and a closest instance of an alignment target is determined. An alignment score can be determined based on the distance. The alignment score can include a number of the alignment frames between the alignment verification location and the alignment target. If the alignment score is below a threshold, then alignment setup can be performed.
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Patent Agency Ranking
公开(公告)号：US10600175B2
公开(公告)日：2020-03-24
申请号：US15858264
申请日：2017-12-29
Applicant: KLA-Tencor Corporation
Inventor： Bjorn Brauer , Benjamin Murray , Shishir Suman , Lisheng Gao
Abstract: Systems and methods of a two-pass inspection methodology that dynamically creates micro care areas for inspection of repeater defects. Micro care areas can be formed around each location of a repeater defect. After inspection, additional repeater defects in the micro care areas can be identified. Attributes of the repeater defects can be compared and any repeater defects with attributes that deviate from an expected group attribute distribution can be classified as nuisance.
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公开(公告)号：US10395358B2
公开(公告)日：2019-08-27
申请号：US15804980
申请日：2017-11-06
Applicant: KLA-Tencor Corporation
Inventor： Bjorn Brauer , Eugene Shifrin , Ashok Mathew , Chetana Bhaskar , Lisheng Gao , Santosh Bhattacharyya , Hucheng Lee , Benjamin Murray
Abstract: Systems and methods for detecting defects on a reticle are provided. One system includes computer subsystem(s) that include one or more image processing components that acquire images generated by an inspection subsystem for a wafer, a main user interface component that provides information generated for the wafer and the reticle to a user and receives instructions from the user, and an interface component that provides an interface between the one or more image processing components and the main user interface. Unlike currently used systems, the one or more image processing components are configured for performing repeater defect detection by applying a repeater defect detection algorithm to the images acquired by the one or more image processing components, and the repeater defect detection algorithm is configured to detect defects on the wafer using a hot threshold and to identify the defects that are repeater defects.
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公开(公告)号：US10186028B2
公开(公告)日：2019-01-22
申请号：US15352664
申请日：2016-11-16
Applicant: KLA-Tencor Corporation
Inventor： Bjorn Brauer , James A. Smith
Abstract: Gray level histograms for a test image and a reference image are adjusted by histogram scaling. Parameters from the histogram scaling are applied to the test image and the reference image. After the parameters are applied, the reference image and the test image are compared to produce a difference image, such as by subtracting the reference image from the test image. Noise in the difference image can be reduced, which improves defect identification in the difference image. In addition, noisy structures in the difference image which are elongated in vertical or horizontal direction can be found. If the noise exceeds a certain threshold, the structures may not be inspected.
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公开(公告)号：US20190019280A1
公开(公告)日：2019-01-17
申请号：US15646808
申请日：2017-07-11
Applicant: KLA-Tencor Corporation
Inventor： Ravichander Rao , Gary Taan , Andreas Russ , Bjorn Brauer , Roger Davis , Bryant Mantiply , Swati Ramanathan , Karen Biagini
CPC classification number: G06T7/001 , G01N21/8851 , G01N2021/8887 , G06T2207/20056 , G06T2207/30148 , G06T2207/30164
Abstract: Systems and methods for tool health monitoring and matching through integrated real-time data collection, event prioritization, and automated determination of matched states through image analysis are disclosed. Data from the semiconductor production tools can be received in real-time. A control limit impact (CLI) of the parametric data and the defect attributes data can be determined and causation factors can be prioritized. Image analysis techniques can compare images and can be used to judge tool matching, such as by identifying one of the states at which the two or more of the semiconductor manufacturing tools match.
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公开(公告)号：US20180130199A1
公开(公告)日：2018-05-10
申请号：US15804980
申请日：2017-11-06
Applicant: KLA-Tencor Corporation
Inventor： Bjorn Brauer , Eugene Shifrin , Ashok Mathew , Chetana Bhaskar , Lisheng Gao , Santosh Bhattacharyya , Hucheng Lee , Benjamin Murray
CPC classification number: G06T7/0006 , G01N21/9501 , G01N2021/95676 , G05B19/41875 , G06T7/0004 , G06T7/001 , G06T2207/10061 , G06T2207/10152 , G06T2207/20076 , G06T2207/20224 , G06T2207/30148
Abstract: Systems and methods for detecting defects on a reticle are provided. One system includes computer subsystem(s) that include one or more image processing components that acquire images generated by an inspection subsystem for a wafer, a main user interface component that provides information generated for the wafer and the reticle to a user and receives instructions from the user, and an interface component that provides an interface between the one or more image processing components and the main user interface. Unlike currently used systems, the one or more image processing components are configured for performing repeater defect detection by applying a repeater defect detection algorithm to the images acquired by the one or more image processing components, and the repeater defect detection algorithm is configured to detect defects on the wafer using a hot threshold and to identify the defects that are repeater defects.
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