公开(公告)号：US20070107872A1

公开(公告)日：2007-05-17

申请号：US11648632

申请日：2007-01-03

申请人： Ryuuji Miyazaki ,  Masumi Suzuki

发明人： Ryuuji Miyazaki ,  Masumi Suzuki

IPC分类号： H05K7/20

CPC分类号： H01L23/3736 ,  H01L23/367 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink for a semiconductor device comprises a base which has a first surface on which a plurality of heat-radiating fins are arranged, and a second surface which contacts the semiconductor device directly. A heat spreader is provided on the second surface of the base so that the heat spreader does not contact the semiconductor device directly.

摘要翻译： 用于半导体器件的散热器包括具有布置有多个散热翅片的第一表面的基座和与半导体器件直接接触的第二表面。 散热器设置在基座的第二表面上，使得散热器不直接接触半导体器件。

公开(公告)号：US06781846B1

公开(公告)日：2004-08-24

申请号：US09482518

申请日：2000-01-14

申请人： Masumi Suzuki ,  Minoru Hirano

发明人： Masumi Suzuki ,  Minoru Hirano

IPC分类号： H05K114

CPC分类号： H05K5/0269 ,  G06F1/203 ,  G06F2200/201

摘要： An IC card adapted to be removably inserted into a slot of an IC card mountable device, including a card housing formed like a substantially rectangular card with an inside space defined therein, the card housing having a plurality of openings through a wall of the card housing; a printed wiring board accommodated in the card housing; and a plurality of electronic components mounted on the printed wiring board.

摘要翻译： 一种适于可拆卸地插入到IC卡可安装装置的槽中的IC卡，包括形成为具有限定在其中的内部空间的大致矩形卡的卡壳体，卡壳体具有穿过卡壳体的壁的多个开口 ; 容纳在卡壳体中的印刷线路板; 以及安装在印刷电路板上的多个电子部件。

公开(公告)号：US06454362B1

公开(公告)日：2002-09-24

申请号：US09475773

申请日：1999-12-30

申请人： Tadashi Katsui ,  Keizo Takemura ,  Minoru Hirano ,  Masumi Suzuki ,  Yoshiaki Udagawa ,  Masuo Ohnishi ,  Kenichi Fujii

发明人： Tadashi Katsui ,  Keizo Takemura ,  Minoru Hirano ,  Masumi Suzuki ,  Yoshiaki Udagawa ,  Masuo Ohnishi ,  Kenichi Fujii

IPC分类号： H01H3514

CPC分类号： G06F1/203 ,  G06F1/206 ,  G06F2200/201 ,  Y02D10/16

摘要： A cooling device for a portable electronic comprises a radiation plate and a fin for radiating the heat from the CPU. When the plug of an external power. supply is attached to the body of the portable electronic, the CPU may operate at a high clock frequency. The cooling device achieves a high cooling performance by operating a ventilation fan directed to the fin, for example. When the plug is removed from the body of the portable electronic, the CPU may operate at a low clock frequency. Power consumption can be reduced, so that the electric power stored in the built-in battery can be saved. The duration time of the operation can be extended. Calorific power generated at the CPU can also be reduced, so that the cooling device is adapted to suppress the rise in the temperature of the CPU without operation of the ventilation fan.

摘要翻译： 用于便携式电子的冷却装置包括辐射板和用于从CPU辐射热量的翅片。 当外插电源时。 电源连接到便携式电子的主体，CPU可以以高时钟频率工作。 例如，冷却装置通过操作指向翅片的通风扇来实现高冷却性能。 当插头从便携式电子的主体移除时，CPU可以以低时钟频率工作。 可以降低功耗，从而可以节省存储在内置电池中的电力。 可以延长操作的持续时间。 也可以减少在CPU产生的热量，从而冷却装置适于在不使用通风扇的情况下抑制CPU的温度上升。

公开(公告)号：US06278609B1

公开(公告)日：2001-08-21

申请号：US08884131

申请日：1997-06-27

申请人： Masumi Suzuki ,  Akira Ueda

发明人： Masumi Suzuki ,  Akira Ueda

IPC分类号： H05K720

CPC分类号： G06F1/203

摘要： An electronic device having an IC card slot into which an IC card is removably inserted. The IC card slot has a slot side connector to which a card side connector of the IC card is electrically connected and a socket formed in an approximately U-shaped. The slot side connector is mounted on a bottom portion of the socket. Guide grooves for guiding side edge portions of the IC cards are formed in an inner surface portion of each of guide rail portions formed on both sides of the socket, and a plurality of heat radiation fins are formed on an outer surface portion of each guide rail portion. The socket is made of a metal material having a high thermal conductivity. Heat generated from the IC card is radiated via the guide rail portions and the heat radiation fins.

摘要翻译： 一种具有IC卡插槽的电子设备，IC卡被可拆卸地插入其中。 IC卡插槽具有插槽侧连接器，IC卡的卡侧连接器电连接到该插槽侧连接器和形成为大致U形的插座。 插槽侧连接器安装在插座的底部。 用于引导IC卡的侧边缘部分的引导槽形成在形成在插座的两侧上的每个导轨部分的内表面部分中，并且在每个导轨的外表面部分上形成有多个散热片 一部分。 插座由具有高导热性的金属材料制成。 从IC卡产生的热量经由导轨部分和散热片辐射。

公开(公告)号：US5763950A

公开(公告)日：1998-06-09

申请号：US598331

申请日：1996-02-08

申请人： Akihiko Fujisaki ,  Junichi Ishimine ,  Masumi Suzuki ,  Masahiro Miyo ,  Shunichi Kikuchi ,  Minoru Hirano ,  Hitoshi Nori

发明人： Akihiko Fujisaki ,  Junichi Ishimine ,  Masumi Suzuki ,  Masahiro Miyo ,  Shunichi Kikuchi ,  Minoru Hirano ,  Hitoshi Nori

IPC分类号： H01L23/36 ,  H01L23/367 ,  H01L23/433 ,  H01L23/467 ,  H01L23/473 ,  H01L29/06 ,  H01L23/34

CPC分类号： H01L23/3672 ,  H01L23/3677 ,  H01L23/433 ,  H01L23/4336 ,  H01L23/467 ,  H01L23/473 ,  H01L2224/16 ,  H01L29/0657 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/01068

摘要： A semiconductor element cooling apparatus adapted to cool at least one semiconductor element mounted on a circuit substrate. The semiconductor element cooling apparatus includes a first mechanism for generating a coolant flow by flowing a coolant over a top surface of the semiconductor element, and a second mechanism for obliquely obstructing the coolant flowing over the semiconductor element from an upstream side towards a downstream side of the coolant flow.

摘要翻译： 一种适于冷却安装在电路基板上的至少一个半导体元件的半导体元件冷却装置。 半导体元件冷却装置包括：第一机构，用于通过在半导体元件的顶表面上流动冷却剂来产生冷却剂流;以及第二机构，用于将流过半导体元件的冷却剂从上游侧向下游侧倾斜地阻塞 冷却液流动。

公开(公告)号：USD279127S

公开(公告)日：1985-06-04

申请号：US445041

申请日：1982-11-29

申请人： Masumi Suzuki

设计人： Masumi Suzuki

公开(公告)号：USD669485S1

公开(公告)日：2012-10-23

申请号：US29371835

申请日：2011-10-20

申请人： Masumi Suzuki

设计人： Masumi Suzuki

公开(公告)号：US07969739B2

公开(公告)日：2011-06-28

申请号：US12357735

申请日：2009-01-22

申请人： Yosuke Tsunoda ,  Masumi Suzuki

发明人： Yosuke Tsunoda ,  Masumi Suzuki

IPC分类号： H05K7/20 ,  F28F7/00 ,  H04M1/00

CPC分类号： G06F1/203 ,  G06F1/1616 ,  G06F1/162 ,  G06F1/1624 ,  G06F2200/203 ,  H04M1/0216

摘要： A portable electronic apparatus includes a first unit, a second unit, and a hinge unit. The first unit includes a first housing, a heat generating component inside the first housing, a first heat diffusing member disposed inside the first housing and diffusing heat from the heat generating component, and a heat dissipating part dissipating heat diffused by the first heat diffusing member to the outside of the first housing. The second unit includes a second housing, a second heat diffusing member disposed inside the second housing and diffusing heat inside the second housing, and a heat receiving part conducting heat from the heat dissipating part to the second heat diffusing member upon the heat receiving part being in contact with the heat dissipating part.

摘要翻译： 便携式电子设备包括第一单元，第二单元和铰链单元。 第一单元包括第一壳体，第一壳体内部的发热部件，设置在第一壳体内部的第一热扩散部件，并且散热来自发热部件的热量，散热部，散热由第一热扩散部件 到第一个房屋的外面。 第二单元包括第二壳体，设置在第二壳体内部并在第二壳体内扩散热量的第二热扩散构件，以及在热接收部分上从散热部分传导热量到第二热扩散构件的热接收部分 与散热部接触。

公开(公告)号：US07828047B2

公开(公告)日：2010-11-09

申请号：US12003542

申请日：2007-12-28

申请人： Ryuuji Miyazaki ,  Masumi Suzuki ,  Minoru Hirano

发明人： Ryuuji Miyazaki ,  Masumi Suzuki ,  Minoru Hirano

IPC分类号： F28D15/00

CPC分类号： H01L23/427 ,  F28D15/0266 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling unit has a heat receiving unit that receives heat from a body radiating heat; a radiator disposed at a distance from the heat receiving unit and radiating recovered heat; a liquid coolant transporting heat generated at the heat receiving unit to the radiator; and a hollow tube disposed so that the liquid coolant circulates between the heat receiving unit and the radiator, a circulating flow of the liquid coolant formed by an elevating force of air bubbles generated from the heat received at the heat receiving unit, the radiator having an air pocket forming one part of the circulation path of the liquid coolant together with the hollow tube and capable of collecting the air bubbles.

摘要翻译： 冷却单元具有从体内散发热量的热量接收单元， 散热器，其设置在与所述受热单元一定距离处，并且散热回收的热量; 将在所述热接收单元处产生的热量的热量输送到所述散热器; 以及中空管，其设置成使得所述液体冷却剂在所述受热单元和所述散热器之间循环，所述液体冷却剂的循环流由通过在所述受热单元处接收的热产生的气泡的升高力而形成，所述散热器具有 空气袋与中空管一起形成液体冷却剂的循环路径的一部分并且能够收集气泡。

公开(公告)号：US07823615B2

公开(公告)日：2010-11-02

申请号：US11636523

申请日：2006-12-11

申请人： Masumi Suzuki

发明人： Masumi Suzuki

IPC分类号： B60C9/00 ,  B60C9/18 ,  B60C9/22 ,  B60C9/28

CPC分类号： B60C9/2204 ,  B60C9/005 ,  B60C2009/2219 ,  B60C2009/2261 ,  Y10T152/10765 ,  Y10T152/10783 ,  Y10T152/10801

摘要： A tire (2) includes a belt (12) provided on a carcass (10) and a band (14) for covering the belt (12). The band (14) includes a full band (36) and a pair of edge bands (38) provided in the vicinity of a shoulder and positioned on an outside in a radial direction of the full band (36). The full band (36) has a first band cord (40) wound spirally in a substantially circumferential direction. The edge band (38) has a second band cord (44) wound spirally in the substantially circumferential direction. A modulus of the second band cord (44) is higher than that of the first band cord (40). In the tire (2), it is preferable that an outer end (50) of the full band (36) should be provided on an outside of an outer end (48) of the belt (12) in an axial direction. An outer end (52) of the edge band (38) is identical to the outer end (48) of the belt (12) or is provided on an inside thereof.

摘要翻译： 轮胎（2）包括设置在胎体（10）上的带（12）和用于覆盖带（12）的带（14）。 所述带（14）包括设置在肩部附近并位于所述全带（36）的径向方向上的外侧的全带（36）和一对边缘带（38）。 全带（36）具有在大致圆周方向上螺旋地卷绕的第一带束线（40）。 边缘带（38）具有在基本圆周方向上螺旋地卷绕的第二带束线（44）。 第二带状帘线（44）的模量高于第一带状帘线（40）的模量。 在轮胎（2）中，优选的是，全带（36）的外端（50）应沿轴向设置在带（12）的外端（48）的外侧。 边缘带（38）的外端（52）与带（12）的外端（48）相同或者设置在其内侧。