公开(公告)号：US08602607B2

公开(公告)日：2013-12-10

申请号：US12908948

申请日：2010-10-21

申请人： Mehmet Arik ,  Stanton Earl Weaver ,  Glenn Howard Kuenzler ,  Charles Franklin Wolfe, Jr. ,  Rajdeep Sharma

发明人： Mehmet Arik ,  Stanton Earl Weaver ,  Glenn Howard Kuenzler ,  Charles Franklin Wolfe, Jr. ,  Rajdeep Sharma

IPC分类号： B60Q1/06

CPC分类号： F21V15/012 ,  F21K9/23 ,  F21S8/02 ,  F21V23/006 ,  F21V29/507 ,  F21V29/63 ,  F21V29/763 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  Y10T29/49826

摘要： Lighting systems having unique configurations are provided. For instance, the lighting system may include a light source, a thermal management system and driver electronics, each contained within a housing structure. The light source is configured to provide illumination visible through an opening in the housing structure. The thermal management system includes a plurality of synthetic jets. The synthetic jets are arranged within the lighting system such that they are secured at contact points.

摘要翻译： 提供具有独特配置的照明系统。 例如，照明系统可以包括光源，热管理系统和驱动器电子器件，每个都包含在外壳结构内。 光源构造成通过壳体结构中的开口提供可见的照明。 热管理系统包括多个合成射流。 合成射流被布置在照明系统内，使得它们固定在接触点处。

公开(公告)号：US08564217B2

公开(公告)日：2013-10-22

申请号：US12822485

申请日：2010-06-24

申请人： Fei Han ,  Mehmet Arik ,  Trevor Wood ,  Charles Franklin Wolfe, Jr.

发明人： Fei Han ,  Mehmet Arik ,  Trevor Wood ,  Charles Franklin Wolfe, Jr.

IPC分类号： H01K1/62 ,  H05B1/00

CPC分类号： H01L23/467 ,  F21K9/23 ,  F21V29/63 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L2924/0002 ,  H01L2924/00

摘要： Apparatus and method are provided for reducing acoustical noise when cooling a device, such as a lamp system. The apparatus includes at least a set of a first synthetic jet and a second synthetic jet. The first and second synthetic jets are responsive to respective actuating signals having a phase difference (e.g., 180°) between one another chosen to reduce acoustic noise produced by the first and second synthetic jets when cooling the device.

摘要翻译： 提供了用于在冷却诸如灯系统的装置时降低声学噪声的装置和方法。 该装置至少包括一组第一合成射流和第二合成射流。 第一和第二合成射流响应于相应的致动信号，其具有彼此之间的相位差（例如，180°），其被选择为在冷却装置时减少由第一和第二合成射流产生的声音噪声。

公开(公告)号：US08496049B2

公开(公告)日：2013-07-30

申请号：US12421068

申请日：2009-04-09

申请人： Mehmet Arik ,  Tunc Icoz ,  Juan Manuel Rivas Davila ,  Charles Erklin Seeley ,  Yogen Vishwas Utturkar ,  Stanton Earl Weaver, Jr.

发明人： Mehmet Arik ,  Tunc Icoz ,  Juan Manuel Rivas Davila ,  Charles Erklin Seeley ,  Yogen Vishwas Utturkar ,  Stanton Earl Weaver, Jr.

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat sink with distributed jet cooling is provided. The heat sink includes a base for thermal connection to at least one heated object, an array of fins thermally coupled to the base, and at least one multi-orifice synthetic jet or multiple single orifice jets disposed on a side of the array of fins. A heat sink with distributed and integrated jet cooling is also provided and includes a base and an array of fins. Respective ones of at least a subset of the fins comprise a synthetic jet configured to eject an ambient fluid into an ambient environment of the fins and base. Another heat sink with distributed and integrated jet cooling is provided and includes a base, an array of fins and multiple synthetic jets coupled to respective ones of the fins. The synthetic jets are provided for at least a subset of the fins.

摘要翻译： 提供分布式喷射冷却的散热器。 散热器包括用于热连接到至少一个被加热物体的基座，热耦合到基座的翅片阵列，以及设置在翅片阵列侧面的至少一个多孔合成射流或多个单孔射流。 还提供了具有分布式和集成式射流冷却的散热器，并且包括底座和翅片阵列。 翅片的至少一个子集中的各个翼片包括配置成将周围流体喷射到翅片和底座的周围环境中的合成射流。 提供了具有分布式和集成的喷射式冷却的另一散热器，并且包括底座，翅片阵列和耦合到相应散热片的多个合成射流。 合成射流被提供用于鳍的至少一个子集。

公开(公告)号：US20130104595A1

公开(公告)日：2013-05-02

申请号：US13285375

申请日：2011-10-31

申请人： Jalal Hunain Zia ,  Douglas Carl Hofer ,  Vitali Victor Lissianski ,  Stephen Duane Sanborn ,  Mehmet Arik ,  Roger Allen Shisler ,  Paul Brian Wickersham

发明人： Jalal Hunain Zia ,  Douglas Carl Hofer ,  Vitali Victor Lissianski ,  Stephen Duane Sanborn ,  Mehmet Arik ,  Roger Allen Shisler ,  Paul Brian Wickersham

IPC分类号： F25J1/00

CPC分类号： F25J1/0027 ,  B01D53/002 ,  B01D2257/504 ,  B01D2258/0283 ,  F28D7/082 ,  F28D7/16 ,  F28F1/24

摘要： A heat exchange assembly for treating carbon dioxide (CO2) is described. The heat exchange assembly includes a housing that includes an inlet, an outlet, and an inner surface that defines a cavity extending between the inlet and the outlet. The housing is configured to receive solid CO2 through the inlet. At least one heat exchange tube extends through the housing. The heat exchange tube is oriented to contact solid CO2 to facilitate transferring heat from solid CO2 to a heat exchanger fluid being channeled through the heat exchange tube to facilitate converting at least a portion of solid CO2 into liquid CO2. The heat exchange assembly is configured to recover a refrigeration value from the solid CO2 and transfer at least a portion of the recovered refrigeration value to a flue gas.

公开(公告)号：US20120098424A1

公开(公告)日：2012-04-26

申请号：US12908948

申请日：2010-10-21

申请人： Mehmet Arik ,  Stanton Earl Weaver ,  Glenn Howard Kuenzler ,  Charles Franklin Wolfe, JR. ,  Rajdeep Sharma

发明人： Mehmet Arik ,  Stanton Earl Weaver ,  Glenn Howard Kuenzler ,  Charles Franklin Wolfe, JR. ,  Rajdeep Sharma

IPC分类号： H01K1/62 ,  H01J61/52

CPC分类号： F21V15/012 ,  F21K9/23 ,  F21S8/02 ,  F21V23/006 ,  F21V29/507 ,  F21V29/63 ,  F21V29/763 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  Y10T29/49826

摘要： Lighting systems having unique configurations are provided. For instance, the lighting system may include a light source, a thermal management system and driver electronics, each contained within a housing structure. The light source is configured to provide illumination visible through an opening in the housing structure. The thermal management system includes a plurality of synthetic jets. The synthetic jets are arranged within the lighting system such that they are secured at contact points.

摘要翻译： 提供具有独特配置的照明系统。 例如，照明系统可以包括光源，热管理系统和驱动器电子器件，每个都包含在外壳结构内。 光源构造成通过壳体结构中的开口提供可见的照明。 热管理系统包括多个合成射流。 合成射流被布置在照明系统内，使得它们固定在接触点处。

公开(公告)号：US20110316416A1

公开(公告)日：2011-12-29

申请号：US12822485

申请日：2010-06-24

申请人： Fei Han ,  Mehmet Arik ,  Trevor Wood ,  Charles Franklin Wolfe, JR.

发明人： Fei Han ,  Mehmet Arik ,  Trevor Wood ,  Charles Franklin Wolfe, JR.

IPC分类号： H01K1/62 ,  B05B1/00 ,  F28D15/00

CPC分类号： H01L23/467 ,  F21K9/23 ,  F21V29/63 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L2924/0002 ,  H01L2924/00

摘要： Apparatus and method are provided for reducing acoustical noise when cooling a device, such as a lamp system. The apparatus includes at least a set of a first synthetic jet and a second synthetic jet. The first and second synthetic jets are responsive to respective actuating signals having a phase difference (e.g., 180°) between one another chosen to reduce acoustic noise produced by the first and second synthetic jets when cooling the device.

摘要翻译： 提供了用于在冷却诸如灯系统的装置时降低声学噪声的装置和方法。 该装置至少包括一组第一合成射流和第二合成射流。 第一和第二合成射流响应于相应的致动信号，其具有彼此之间的相位差（例如，180°），其被选择为在冷却装置时减少由第一和第二合成射流产生的声音噪声。

公开(公告)号：US08006917B2

公开(公告)日：2011-08-30

申请号：US12198240

申请日：2008-08-26

申请人： Mehmet Arik ,  Stanton Earl Weaver ,  Charles Erklin Seeley ,  Yogen Vishwas Utturkar

发明人： Mehmet Arik ,  Stanton Earl Weaver ,  Charles Erklin Seeley ,  Yogen Vishwas Utturkar

IPC分类号： B05B1/08

CPC分类号： F15D1/00 ,  B05B17/0607 ,  F28F13/02 ,  H01L23/467 ,  H01L2924/00 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10T29/494

摘要： A synthetic jet includes a first backer structure and a first actuator coupled to the first backer structure to form a first composite unit. The synthetic jet also includes a second backer structure, and a second actuator coupled to the second backer structure to form a second composite unit. A wall member is coupled to and positioned between the first and second backer structures to form a cavity. The first composite unit has an orifice formed therethrough and the orifice is fluidically coupled to the cavity and fluidically coupled to an environment external to the cavity.

摘要翻译： 合成射流包括第一支撑结构和耦合到第一支撑结构的第一致动器，以形成第一复合单元。 合成射流还包括第二支撑结构，以及耦合到第二支撑结构以形成第二复合单元的第二致动器。 壁构件联接到第一和第二支撑结构之间并定位在第一和第二支撑结构之间以形成空腔。 第一复合单元具有穿过其形成的孔，并且孔流体地联接到空腔并且流体耦合到空腔外部的环境。

公开(公告)号：US07990705B2

公开(公告)日：2011-08-02

申请号：US12118435

申请日：2008-05-09

申请人： Jeffrey Russell Bult ,  Mehmet Arik ,  William Dwight Gerstler ,  Yogen Utturkar

发明人： Jeffrey Russell Bult ,  Mehmet Arik ,  William Dwight Gerstler ,  Yogen Utturkar

IPC分类号： H05K7/20 ,  B05B1/08 ,  F04B17/00 ,  F28F7/00

CPC分类号： F15D1/08 ,  H01L23/4735 ,  H01L2924/0002 ,  H05K7/20909 ,  H01L2924/00

摘要： A method and system for increasing cooling of an enclosure is provided. The component enclosure includes one or more sidewalls defining a volume, the sidewalls are configured to substantially surround a heat generating component positioned within the volume. The component enclosure further includes a synthetic jet assembly positioned adjacent at least one of the sidewalls. The synthetic jet assembly includes at least one synthetic jet ejector having a jet port. The jet port is aligned at least one of perpendicularly, parallelly, and obliquely with a surface of the at least one sidewall. The synthetic jet assembly is configured to direct a jet of fluid through the port at least one of substantially parallel to the surface, perpendicularly onto the surface, and obliquely toward the surface.

摘要翻译： 提供了一种用于增加外壳冷却的方法和系统。 部件外壳包括限定一个体积的一个或多个侧壁，该侧壁被配置为基本上围绕定位在该体积内的发热部件。 组件外壳还包括邻近至少一个侧壁定位的合成射流组件。 合成射流组件包括具有喷射口的至少一个合成射流喷射器。 喷射口与至少一个侧壁的表面垂直，平行和倾斜地至少一个排列。 合成射流组件构造成将流体射流引导通过端口至少一个基本上平行于表面垂直于表面并且倾斜地朝向表面。

公开(公告)号：US20110162823A1

公开(公告)日：2011-07-07

申请号：US12683826

申请日：2010-01-07

申请人： Rajdeep Sharma ,  Stanton Earl Weaver, JR. ,  Charles Erklin Seeley ,  Mehmet Arik ,  Tunc Icoz ,  Charles Franklin Wolfe, JR. ,  Yogen Vishwas Utturkar

发明人： Rajdeep Sharma ,  Stanton Earl Weaver, JR. ,  Charles Erklin Seeley ,  Mehmet Arik ,  Tunc Icoz ,  Charles Franklin Wolfe, JR. ,  Yogen Vishwas Utturkar

IPC分类号： F28D15/00 ,  F28F7/00 ,  F28F13/12 ,  B21D53/02

CPC分类号： H05K7/20154 ,  F21K9/23 ,  F21V29/507 ,  F21V29/63 ,  F21V29/83 ,  F21Y2115/10 ,  H01L23/467 ,  H01L2924/0002 ,  H05K7/20172 ,  H05K7/20409 ,  Y10T29/4935 ,  H01L2924/00

摘要： An apparatus for removing heat comprises a heat sink having a cavity, and a synthetic jet stack comprising at least one synthetic jet mounted within the cavity. At least one rod and at least one engaging structure to provide a rigid positioning of the at least one synthetic jet with respect to the at least one rod. The synthetic jet comprises at least one orifice through which a fluid is ejected.

摘要翻译： 一种用于去除热量的装置包括具有空腔的散热器和包括安装在该空腔内的至少一个合成射流的合成喷射叠层。 至少一个杆和至少一个接合结构，以提供至少一个合成射流相对于至少一个杆的刚性定位。 合成射流包括至少一个孔口，流体被喷射通过该孔口。

公开(公告)号：US07969734B2

公开(公告)日：2011-06-28

申请号：US11649173

申请日：2007-01-03

申请人： Mehmet Arik ,  Chellappa Balan ,  Todd Garrett Wetzel ,  Stephen Adam Solovitz ,  Charles Max Byrd ,  Stanton Earl Weaver, Jr.

发明人： Mehmet Arik ,  Chellappa Balan ,  Todd Garrett Wetzel ,  Stephen Adam Solovitz ,  Charles Max Byrd ,  Stanton Earl Weaver, Jr.

IPC分类号： H05K7/20

CPC分类号： F28F3/04 ,  F04B43/04 ,  F04B43/046 ,  F04D29/582 ,  F28D1/05316 ,  F28D15/00 ,  F28D2021/0031 ,  F28F2260/02 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S165/908 ,  H01L2924/00

摘要： Disclosed is a system for cooling an electronics package. The system includes a fluid pump and a microcooler assembly. The system utilizes one or more cooling layers interspersed with layers of electronics in the electronics package. Each cooling layer has an array of cooling channels formed in a substrate, an input manifold through which cooling fluid is provided for distribution through the array of cooling channels, and an output manifold which collects fluid from the array of cooling channels. The elements of the cooling system are integrated by conduits including a package conduit for passage of fluid from the fluid pump to the electronics package, a cooler conduit for passage of fluid from the electronics package to the microcooler assembly, and a pump conduit for passage of fluid from the microcooler assembly to the fluid pump. Also disclosed is a method for cooling the electronics package.

摘要翻译： 公开了一种用于冷却电子封装的系统。 该系统包括流体泵和微冷却器组件。 该系统利用在电子封装中散布有电子层的一个或多个冷却层。 每个冷却层具有形成在衬底中的冷却通道阵列，通过冷却通道阵列提供冷却流体的输入歧管，以及从冷却通道阵列收集流体的输出歧管。 冷却系统的元件通过导管集成，导管包括用于将流体从流体泵通到电子封装的封装导管，用于将流体从电子封装件通至微型冷却器组件的冷却器导管，以及用于通过 从微冷却器组件到流体泵的流体。 还公开了一种用于冷却电子封装的方法。