Semiconductor Device Including an Edge Area and Method of Manufacturing a Semiconductor Device
    43.
    发明申请
    Semiconductor Device Including an Edge Area and Method of Manufacturing a Semiconductor Device 有权
    包括边缘区域的半导体器件和制造半导体器件的方法

    公开(公告)号:US20140001547A1

    公开(公告)日:2014-01-02

    申请号:US13539959

    申请日:2012-07-02

    摘要: A semiconductor device includes a doped layer which contains a first dopant of a first conductivity type. In the doped layer, a counter-doped zone is formed in an edge area that surrounds an element area of the semiconductor device. The counter-doped zone contains at least the first dopant and a second dopant of a second conductivity type, which is the opposite of the first conductivity type. A concentration of the second dopant is at least 20% and at most 100% of a concentration of the first dopant. The dopants in the counter-doped zone decrease charge carrier mobility and minority carrier lifetime such that the dynamic robustness of the semiconductor device is increased.

    摘要翻译: 半导体器件包括含有第一导电类型的第一掺杂剂的掺杂层。 在掺杂层中,在围绕半导体器件的元件区域的边缘区域中形成反掺杂区域。 反掺杂区至少包含与第一导电类型相反的第二导电类型的第一掺杂剂和第二掺杂剂。 第二掺杂剂的浓度为第一掺杂剂的浓度的至少20%且至多100%。 反掺杂区中的掺杂剂降低了载流子迁移率和少数载流子寿命,从而提高了半导体器件的动态鲁棒性。

    Semiconductor device with edge termination structure
    44.
    发明授权
    Semiconductor device with edge termination structure 有权
    具有边缘端接结构的半导体器件

    公开(公告)号:US08466492B1

    公开(公告)日:2013-06-18

    申请号:US13362005

    申请日:2012-01-31

    IPC分类号: H01L29/02

    摘要: A semiconductor device includes a semiconductor body including a first surface, an inner region and an edge region, a first doped device region of a first doping type in the inner region and the edge region, a second device region forming a device junction in the inner region with the first device region, and a plurality of at least two dielectric regions extending from the first surface into the semiconductor body. Two dielectric regions that are adjacent in a lateral direction of the semiconductor body are separated by a semiconductor mesa region. The semiconductor device further includes a resistive layer connected to the second device region and connected to at least one semiconductor mesa region.

    摘要翻译: 半导体器件包括半导体本体,其包括第一表面,内部区域和边缘区域,在内部区域和边缘区域中的第一掺杂型的第一掺杂器件区域,在内部形成器件结的第二器件区域 具有第一器件区域的区域,以及从第一表面延伸到半导体本体中的多个至少两个电介质区域。 在半导体本体的横向相邻的两个电介质区域被半导体台面区域隔开。 半导体器件还包括连接到第二器件区并连接到至少一个半导体台面区的电阻层。

    IGBT device and related device having robustness under extreme conditions
    50.
    发明授权
    IGBT device and related device having robustness under extreme conditions 有权
    IGBT器件及相关器件在极端条件下具有鲁棒性

    公开(公告)号:US07696600B2

    公开(公告)日:2010-04-13

    申请号:US11713226

    申请日:2007-03-02

    IPC分类号: H01L29/10 H01L29/72

    摘要: A semiconductor device in the form of an IGBT has a front side contact, a rear side contact, and a semiconductor volume disposed between the front side contact and the rear side contact. The semiconductor volume includes a field stop layer for spatially delimiting an electric field that can be formed in the semiconductor volume. The semiconductor volume further includes a plurality of semiconductor zones, the plurality of semiconductor zones spaced apart from each other and each inversely doped with respect to adjacent areas. The plurality of semiconductor zones are located within the field stop layer.

    摘要翻译: IGBT形式的半导体器件具有前侧触点,后侧触点和设置在前侧触点和后侧触点之间的半导体体。 半导体体积包括用于空间地限定可以形成在半导体体积中的电场的场停止层。 半导体体积还包括多个半导体区域,多个半导体区域彼此间隔开并且相对于相邻区域反向掺杂。 多个半导体区域位于场停止层内。