Light-emitting device
    44.
    发明授权

    公开(公告)号:US09601657B2

    公开(公告)日:2017-03-21

    申请号:US13050444

    申请日:2011-03-17

    申请人: Chia-Liang Hsu

    发明人: Chia-Liang Hsu

    摘要: This disclosure discloses a light-emitting device. The light-emitting device comprises: a substrate; an intermediate layer formed on the substrate; a transparent bonding layer; a first semiconductor window layer bonded to the semiconductor layer through the transparent bonding layer; and a light-emitting stack formed on the first semiconductor window layer. The intermediate layer has a refractive index between the refractive index of the substrate and the refractive index of the first semiconductor window layer.

    Chip-bonding light emitting diode chip
    45.
    发明授权
    Chip-bonding light emitting diode chip 有权
    芯片贴片发光二极管芯片

    公开(公告)号:US08283683B2

    公开(公告)日:2012-10-09

    申请号:US12629030

    申请日:2009-12-01

    IPC分类号: H01L33/00

    摘要: A light emitting diode chip includes a permanent substrate having a holding space formed on the permanent substrate; an insulating layer and a metal layer sequentially formed on the permanent substrate and the holding spacer; a die having a eutectic layer and a light-emitting region and bonded to the metal layer within the holding space via the eutectic layer coupling to the metal layer; a filler structure filled between the holding space and the die; and an electrode formed on the die and in contact with the light-emitting region.

    摘要翻译: 发光二极管芯片包括永久性基板,其具有形成在永久基板上的保持空间; 绝缘层和顺序地形成在永久性基板和保持间隔物上的金属层; 具有共晶层和发光区域的管芯,并通过耦合到金属层的共晶层与保持空间内的金属层接合; 填充在所述保持空间和所述模具之间的填充结构; 以及形成在管芯上并与发光区域接触的电极。

    Light-emitting device and method for manufacturing the same
    46.
    发明申请
    Light-emitting device and method for manufacturing the same 审中-公开
    发光装置及其制造方法

    公开(公告)号:US20100001312A1

    公开(公告)日:2010-01-07

    申请号:US12458133

    申请日:2009-07-01

    申请人: Chia-Liang Hsu

    发明人: Chia-Liang Hsu

    IPC分类号: H01L33/00

    CPC分类号: H01L33/0079 H01L33/025

    摘要: A light-emitting device is disclosed. The light-emitting device comprises a substrate, wherein an ion implanted layer on the top surface of the substrate; a thin silicon film disposing on the ion implanted layer; and a light-emitting stack layer on the thin silicon film. This invention also discloses a method of manufacturing a light-emitting device comprising providing a substrate; forming an ion implanted layer on the top surface of the substrate; providing a light-emitting stack layer; forming a thin silicon film on the bottom surface of the light-emitting stack layer; and bonding the light-emitting stack layer to the substrate with the anodic bonding technique.

    摘要翻译: 公开了一种发光器件。 发光器件包括衬底,其中在衬底的顶表面上的离子注入层; 设置在离子注入层上的薄硅膜; 以及薄硅膜上的发光层叠层。 本发明还公开了一种制造发光器件的方法,包括提供衬底; 在所述基板的顶表面上形成离子注入层; 提供发光堆叠层; 在发光堆叠层的底面上形成薄的硅膜; 并通过阳极接合技术将发光层叠层结合到基板上。

    Light-emitting device
    47.
    发明申请
    Light-emitting device 有权
    发光装置

    公开(公告)号:US20080165539A1

    公开(公告)日:2008-07-10

    申请号:US12003880

    申请日:2008-01-03

    IPC分类号: F21V5/00

    摘要: This application relates to a light-emitting device comprising a light channel having an upper surface, a lower surface opposite to the upper surface, an inner surface intersecting with each of the upper and lower surface by different angles, and an escape surface; and a light-emitting element having a bottom surface substantially parallel to the inner surface and emitting light traveling inside the light channel toward the escape surface. In an embodiment, the escape surface of the light-emitting device is an inclined plane with lens array thereon.

    摘要翻译: 本申请涉及一种发光装置,包括具有上表面,与上表面相对的下表面的光通道,与上表面和下表面中的每一个以不同角度相交的内表面和逃逸表面; 以及发光元件,其具有基本上平行于内表面的底表面,并且发射在光通道内朝向逸出表面行进的光。 在一个实施例中,发光装置的逸出表面是其上具有透镜阵列的倾斜平面。

    Light-emitting device and method for manufacturing the same
    49.
    发明授权
    Light-emitting device and method for manufacturing the same 有权
    发光装置及其制造方法

    公开(公告)号:US08618572B2

    公开(公告)日:2013-12-31

    申请号:US13403334

    申请日:2012-02-23

    申请人: Chia-Liang Hsu

    发明人: Chia-Liang Hsu

    IPC分类号: H01L33/00

    CPC分类号: H01L33/0079 H01L33/025

    摘要: A light-emitting device is disclosed. The light-emitting device comprises a substrate, an ion implanted layer on the substrate, a light-emitting stack layer disposed on the ion implanted layer, and an adhesive layer connecting the substrate with the light-emitting stack layer, wherein the adhesive layer comprises a thin silicon film disposed between the ion implanted layer and the light-emitting layer. This invention also discloses a method of manufacturing a light-emitting device comprising the steps of forming a light-emitting stack layer, forming a thin silicon film on the light-emitting stack layer, providing a substrate, forming an ion implanted layer on the substrate, and providing an electrode potential difference to form an oxide layer between the thin silicon film and the ion implanted layer.

    摘要翻译: 公开了一种发光器件。 发光装置包括衬底,衬底上的离子注入层,设置在离子注入层上的发光层,以及将衬底与发光层叠层连接的粘合剂层,其中粘合层包括 设置在离子注入层和发光层之间的薄硅膜。 本发明还公开了一种制造发光器件的方法,包括以下步骤:形成发光叠层,在发光叠层上形成薄硅膜,提供衬底,在衬底上形成离子注入层 并且提供电极电位差以在薄硅膜和离子注入层之间形成氧化物层。

    Light-emitting semiconductor device and package thereof
    50.
    发明授权
    Light-emitting semiconductor device and package thereof 有权
    发光半导体器件及其封装

    公开(公告)号:US08242526B2

    公开(公告)日:2012-08-14

    申请号:US12550089

    申请日:2009-08-28

    申请人: Chia-Liang Hsu

    发明人: Chia-Liang Hsu

    IPC分类号: H01L33/00

    摘要: The present application discloses a light-emitting semiconductor device including a semiconductor light-emitting element, a transparent paste layer and a wavelength conversion structure. A first light emitted from the semiconductor light-emitting element enters the wavelength conversion structure to generate a second light which has a wavelength different from that of the first light. In addition, the present application also provides a light-emitting semiconductor device package.

    摘要翻译: 本申请公开了一种包括半导体发光元件,透明浆料层和波长转换结构的发光半导体器件。 从半导体发光元件发射的第一光进入波长转换结构以产生具有与第一光不同的波长的第二光。 此外,本申请还提供了一种发光半导体器件封装。