公开(公告)号：US07508081B2

公开(公告)日：2009-03-24

申请号：US11082112

申请日：2005-03-16

申请人： Takeshi Matsumura ,  Masaki Mizutani ,  Sadahito Misumi

发明人： Takeshi Matsumura ,  Masaki Mizutani ,  Sadahito Misumi

IPC分类号： H01L29/40

CPC分类号： H01L21/6836 ,  C09J7/20 ,  C09J2201/36 ,  C09J2201/606 ,  C09J2201/61 ,  C09J2203/326 ,  C09J2205/31 ,  C09J2433/00 ,  H01L24/27 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/09701 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/3512

摘要： The invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer (2) on a substrate material (1) and a die-bonding adhesive layer (3) on the pressure-sensitive adhesive layer (2), wherein the adhesion of the pressure-sensitive adhesive layer (2) to the die-bonding adhesive layer (3), as determined under the conditions of a peel angle of 15° and a peel point moving rate of 2.5 mm/sec. at 23° C., is different between a region (2a) corresponding to a work attachment region (3a) and a region (2b) corresponding to a part or the whole of the other region (3b), in the die-bonding adhesive layer (3), and satisfies the following relationship: adhesion of the pressure-sensitive adhesive layer (2a)

摘要翻译： 本发明涉及一种在基材（1）上具有压敏粘合剂层（2）和压敏粘合剂层（2）上的芯片粘合层（3）的切割芯片接合膜，其中 在剥离角度为15°，剥离移动速度为2.5mm / sec的条件下测定粘合剂层（2）与芯片粘接层（3）的粘合性。 在相对于工件附着区域（3a）的区域（2a）和与其他区域（3b）的一部分或全部对应的区域（2b）在23℃下不同，在芯片接合粘合剂 层（3），并且满足以下关系：粘合剂层（2a）的粘合性<粘合剂层（2b）的粘合性和粘合剂层（2a）对粘合剂层 芯片粘合层（3）不高于2.3N / 25mm。 因此，即使工作较薄，也可以提供切割/切断/芯片接合薄膜，其与切片粘合剂层一起在切割薄片时的保持性和切割的切片作业的脱模性之间的平衡优异。

公开(公告)号：US07449226B2

公开(公告)日：2008-11-11

申请号：US10849414

申请日：2004-05-19

申请人： Takeshi Matsumura ,  Masaki Mizutani ,  Sadahito Misumi

发明人： Takeshi Matsumura ,  Masaki Mizutani ,  Sadahito Misumi

IPC分类号： B32B3/02

CPC分类号： H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/3025 ,  Y10T156/1052 ,  Y10T156/1062 ,  Y10T156/107 ,  Y10T156/1077 ,  Y10T428/218 ,  Y10T428/31703 ,  H01L2924/00

摘要： The dicing die-bonding film of this invention comprises a pressure-sensitive adhesive layer on a supporting base material and a die-bonding adhesive layer on the pressure-sensitive adhesive layer, wherein a releasability in an interface between the pressure-sensitive adhesive layer and the die-bonding adhesive layer is different between an interface corresponding to a work-attaching region in the die-bonding adhesive layer and an interface corresponding to a part or the whole of the other region, and the releasability of the interface is higher than the releasability of the interface. According to this invention, there can be provided a dicing die-bonding film excellent in balance between retention in dicing a work and releasability in releasing its diced chipped work together with the die-bonding adhesive layer.

摘要翻译： 本发明的切割/芯片接合膜包括在支撑基材上的压敏粘合剂层和压敏粘合剂层上的芯片粘合层，其中在粘合剂层和粘合剂层之间的界面处的剥离性 芯片接合粘合剂层在与芯片粘合层中的工件附着区域相对应的界面与对应于其他区域的一部分或全部的界面不同，并且界面的剥离性高于 界面的脱模性。 根据本发明，可以提供一种在切割工件时的保持性和与切断粘合剂层一起释放其切割的切屑作业的脱模性之间的平衡优异的切割芯片接合薄膜。

公开(公告)号：US20070141921A1

公开(公告)日：2007-06-21

申请号：US11642507

申请日：2006-12-20

申请人： Masaki Mizutani ,  Tomoyoshi Fukaya ,  Kazuaki Takeda ,  Tsutomu Tanaka

发明人： Masaki Mizutani ,  Tomoyoshi Fukaya ,  Kazuaki Takeda ,  Tsutomu Tanaka

IPC分类号： H01R13/514

CPC分类号： H01R13/4223 ,  H01R13/4362 ,  H01R13/501 ,  H01R13/514 ,  H01R13/518 ,  H01R13/6273 ,  H01R13/73

摘要： An auxiliary connector (14) has cavities (35) for receiving terminal fittings (13) and resilient locks (40) that deform in a deforming direction (DD) that extends along an arranging direction of the cavities (35). The locks (40) are configured for holding the terminal fittings (13) in the cavities (35). A retainer (39) is formed integrally with the auxiliary connector (14) via a hinge (75) at an opening edge of a retainer accommodating hole (73) in a side surface of the auxiliary connector (14) facing a direction intersecting the deforming direction (DD) of locks (40). The retainer (39) has locking protrusions (78) for redundantly locking the terminal fittings (13) in the cavities (35). The locking protrusions (78) of the retainer (39) are arranged at substantially the same positions for all cavities (35).

摘要翻译： 辅助连接器（14）具有用于接收沿着空腔（35）的布置方向延伸的变形方向（DD）的端子接头（13）和弹性锁（40）的空腔（35）。 锁（40）构造成用于将端子接头（13）保持在空腔（35）中。 保持器（39）通过铰链（75）与辅助连接器（14）一体地形成在辅助连接器（14）的侧表面中的保持器容纳孔（73）的开口边缘处，该侧面面向与变形相交的方向 锁的方向（DD）（40）。 保持器（39）具有用于将端子接头（13）冗余地锁定在空腔（35）中的锁定突起（78）。 保持器（39）的锁定突起（78）被布置在所有空腔（35）的基本相同的位置。

公开(公告)号：US06200830B1

公开(公告)日：2001-03-13

申请号：US09332949

申请日：1999-06-15

申请人： Satoshi Ito ,  Makoto Kuwamura ,  Masaki Mizutani ,  Hiroshi Noro

发明人： Satoshi Ito ,  Makoto Kuwamura ,  Masaki Mizutani ,  Hiroshi Noro

IPC分类号： H01L2144

CPC分类号： H01L21/563 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512

摘要： Described is a process for the fabrication of a semiconductor device, which comprises a step of simultaneously or successively mounting at least one semiconductor element having a connecting electrode portion onto each of both sides of an interconnection circuit substrate through an encapsulating resin layer and a step of connecting said at least one semiconductor element with an interconnection electrode on each of both sides of said interconnection circuit substrate by making use of the adhesive force of said encapsulating resin layer.

摘要翻译： 描述了一种用于制造半导体器件的方法，该方法包括通过封装树脂层同时或连续地将至少一个具有连接电极部分的半导体元件安装在互连电路基板的两侧上的步骤，以及步骤 通过利用所述封装树脂层的粘合力，将所述至少一个半导体元件与所述互连电路基板两侧的互连电极连接。

公开(公告)号：US5218880A

公开(公告)日：1993-06-15

申请号：US638575

申请日：1991-01-08

申请人： Masaki Mizutani

发明人： Masaki Mizutani

IPC分类号： F16F15/08 ,  F16H59/02 ,  F16H61/26

CPC分类号： F16H59/0208 ,  F16H61/26 ,  Y10T403/32049 ,  Y10T403/32591 ,  Y10T403/458 ,  Y10T74/20177

摘要： A joint is provided between a transmission operating member of a transmission and a control rod of a transmission gear control mechanism. The joint includes rigid stopper rings for rigidly stopping deformations of resilient deformable members in predetermined directions and thereby rigidly stopping movement of outer sleeves of an outer sleeve unit in the directions crossing joint pins at right angles. The stopper rings are fittingly interposed between the outer sleeves and channel-like end portions of the transmission operating member such that the transmission operating member and control rod are relatively less movable in the direction crossing their axial directions at right angles.

摘要翻译： 在变速器的变速器操作构件和变速器齿轮控制机构的控制杆之间设置接头。 该接头包括用于刚性地阻止弹性变形构件在预定方向上的变形的刚性止动环，从而刚性地阻止外套筒单元的外套筒沿垂直于关节销的方向的运动。 止动环安装在变速器操作构件的外套管和通道状端部之间，使得变速器操作构件和控制杆在与其轴向方向成直角的方向上相对较少移动。

公开(公告)号：US08877427B2

公开(公告)日：2014-11-04

申请号：US13207045

申请日：2011-08-10

申请人： Masaki Mizutani

发明人： Masaki Mizutani

IPC分类号： G03F7/038 ,  H05K1/02 ,  G11B5/48 ,  G03F7/004 ,  H05K3/28 ,  H05K1/05

CPC分类号： G11B5/486 ,  G03F7/0045 ,  G03F7/038 ,  G11B5/4833 ,  G11B5/484 ,  H05K1/056 ,  H05K3/287

摘要： A photosensitive resin composition contains a component (A) and at least one of a component (B) and a component (C). In addition, in the circuit board with metal support including: a metal support; a base insulating layer; a conductive layer formed of a wiring circuit pattern; and a cover insulating layer, at least one of the above-mentioned base insulating layer and cover insulating layer is made of the above-mentioned photosensitive resin composition. (A) a 1,4-dihydropyridine derivative represented by the following general formula (1) where R1 represents an alkyl group having 1 to 3 carbon atoms; and R2 and R3 each represent a hydrogen atom or an alkyl group having 1 or 2 carbon atoms and may be identical to or different from each other; (B) the following (x) and (y): (x) a carboxyl group-containing linear polymer; and (y) an epoxy resin (c) a linear polymer having a carboxyl group and an epoxy group.

摘要翻译： 感光性树脂组合物含有成分（A）和成分（B）和成分（C）中的至少一种。 此外，在具有金属支撑的电路板中，包括：金属支架; 基底绝缘层; 由布线电路图形成的导电层; 以及覆盖绝缘层，上述基底绝缘层和覆盖绝缘层中的至少一个由上述感光性树脂组合物构成。 （A）由以下通式（1）表示的1,4-二氢吡啶衍生物，其中R 1表示具有1至3个碳原子的烷基; 并且R 2和R 3各自表示氢原子或具有1或2个碳原子的烷基，并且可以彼此相同或不同; （B）以下（x）和（y）：（x）含羧基的线性聚合物; 和（y）环氧树脂（c）具有羧基和环氧基的线性聚合物。

公开(公告)号：US08591712B2

公开(公告)日：2013-11-26

申请号：US13406188

申请日：2012-02-27

申请人： Hiroyuki Hayashi ,  Masaki Mizutani ,  Takayuki Kitou

发明人： Hiroyuki Hayashi ,  Masaki Mizutani ,  Takayuki Kitou

IPC分类号： G01N27/407

CPC分类号： G01N27/4071

摘要： There is provided a gas sensor element, including a solid electrolyte layer, a pair of sensor electrodes arranged on a front side of the solid electrolyte layer, a pair of sensor leads arranged on a rear side of the solid electrolyte layer and connected to the respective sensor electrodes; and insulating layers, one of which is arranged between one of the sensor leads and the solid electrolyte layer and the other of which is arranged between the other sensor lead and the solid electrolyte layer. The sensor electrodes have rear end portions located on the insulating layers and overlapping front end portions of the sensor leads, respectively. The sensor leads are denser than the sensor electrodes and have front ends located in the same positions as or positions rear of front ends of the insulating layers, respectively. There is also provided a gas sensor with such a gas sensor element.

摘要翻译： 提供了一种气体传感器元件，包括固体电解质层，布置在固体电解质层前侧的一对传感器电极，一对传感器引线，布置在固体电解质层的后侧并连接到固体电解质层 传感器电极; 绝缘层，其中之一布置在传感器引线和固体电解质层中的一个之间，另一个布置在另一个传感器引线和固体电解质层之间。 传感器电极具有分别位于绝缘层上的后端部分和传感器引线的重叠前端部分。 传感器引线比传感器电极更致密，并且分别具有位于绝缘层的前端的相同位置或位于后端的前端。 还提供了具有这种气体传感器元件的气体传感器。

公开(公告)号：US08525037B2

公开(公告)日：2013-09-03

申请号：US13325815

申请日：2011-12-14

申请人： Masaki Mizutani

发明人： Masaki Mizutani

IPC分类号： H05K1/02

CPC分类号： G11B5/4853 ,  G11B5/484 ,  G11B5/486 ,  H05K1/056 ,  H05K1/189 ,  H05K2201/0191 ,  H05K2201/09081 ,  Y10T29/49126

摘要： A suspension board with circuit includes a gimbal portion. The gimbal portion includes a tongue portion formed at the inner side of the opening for being mounted with a slider mounted with a magnetic head for being electrically connected to the conductive layer, an outrigger portion formed at the outer side of the opening to support the tongue portion, and a passing portion passing through the opening of the gimbal portion and/or an outer side region of the outrigger portion. The passing portion includes the conductive layer and the insulating layer covering the conductive layer. The thickness of a lower half portion of the insulating layer in the passing portion is the same as that of an upper half portion thereof.

摘要翻译： 具有电路的悬挂板包括万向节部分。 万向节部分包括在开口的内侧形成的舌部，用于安装有安装有用于电连接到导电层的磁头的滑块，形成在开口的外侧以支撑舌头的外伸支架部分 并且穿过通过万向架部分的开口和/或外伸支架部分的外侧区域的通过部分。 通过部分包括导电层和覆盖导电层的绝缘层。 通过部分中的绝缘层的下半部分的厚度与其上半部分的厚度相同。

公开(公告)号：US08372903B2

公开(公告)日：2013-02-12

申请号：US12849896

申请日：2010-08-04

申请人： Masaki Mizutani ,  Toshikazu Baba ,  Yoshihiro Kawamura

发明人： Masaki Mizutani ,  Toshikazu Baba ,  Yoshihiro Kawamura

IPC分类号： C08K5/5399

摘要： A halogen-free and flame-resistant photosensitive resin composition is provided, which has properties necessary for a solder resist (insulative property, solder heat resistance, alkali developability and the like) and is capable of forming a film that is excellent in folding endurance even after an IR reflow process. A flexible circuit board employing the photosensitive resin composition and a circuit board production method are also provided. The photosensitive resin composition comprises: (A) a linear polymer of an ethylenically unsaturated compound comprising a carboxyl-containing ethylenically unsaturated compound; (B) an epoxy resin; (C) a polymerizable compound containing an ethylenically unsaturated group; (D) a photopolymerization initiator; and a cyclic phosphazene (E) represented by the following general formula (1):

公开(公告)号：US08287706B2

公开(公告)日：2012-10-16

申请号：US12873120

申请日：2010-08-31

申请人： Tatsuhiko Muraoka ,  Masaki Mizutani

发明人： Tatsuhiko Muraoka ,  Masaki Mizutani

IPC分类号： G01N27/407

CPC分类号： G01N27/4071

摘要： A laminated gas sensor element including a detection element including a solid electrolyte body having a pair of electrodes formed thereon laminated together with a heater element. A porous protection layer is formed on at least a distal end portion of the laminated gas sensor element which is to be exposed to a gas to be measured. The surface of the porous protection layer has 10 or more small pores each having a diameter of 1 μm to 5 μm inclusive and an aspect ratio of 0.5 to 2.0 inclusive within an area measuring 50 μm×50 μm, and one to less than 20 large pores each having a diameter of 8 μm to 20 μm inclusive and an aspect ratio of 0.5 to 2.0 inclusive within an area measuring 100 μm×100 μm. Also disclosed is a method for manufacturing the laminated gas sensor.

摘要翻译： 一种层叠气体传感器元件，包括检测元件，该检测元件包括固体电解质体，该固体电解质体上形成有与加热器元件层叠在一起的一对电极。 在要被测量的气体暴露于层叠气体传感器元件的至少前端部分上形成多孔保护层。 多孔保护层的表面具有10个以上的小孔，其在直径为1μm〜5μm的范围内，纵横比为0.5以上且2.0以下，在50μm×50μm以下，1〜 在100μm×100μm的面积内，其直径为8μm〜20μm，宽度比为0.5〜2.0。 还公开了层压气体传感器的制造方法。