公开(公告)号：US06200830B1

公开(公告)日：2001-03-13

申请号：US09332949

申请日：1999-06-15

申请人： Satoshi Ito ,  Makoto Kuwamura ,  Masaki Mizutani ,  Hiroshi Noro

发明人： Satoshi Ito ,  Makoto Kuwamura ,  Masaki Mizutani ,  Hiroshi Noro

IPC分类号： H01L2144

CPC分类号： H01L21/563 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01051 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/04953 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/3512

摘要： Described is a process for the fabrication of a semiconductor device, which comprises a step of simultaneously or successively mounting at least one semiconductor element having a connecting electrode portion onto each of both sides of an interconnection circuit substrate through an encapsulating resin layer and a step of connecting said at least one semiconductor element with an interconnection electrode on each of both sides of said interconnection circuit substrate by making use of the adhesive force of said encapsulating resin layer.

摘要翻译： 描述了一种用于制造半导体器件的方法，该方法包括通过封装树脂层同时或连续地将至少一个具有连接电极部分的半导体元件安装在互连电路基板的两侧上的步骤，以及步骤 通过利用所述封装树脂层的粘合力，将所述至少一个半导体元件与所述互连电路基板两侧的互连电极连接。

公开(公告)号：US06333206B1

公开(公告)日：2001-12-25

申请号：US09297980

申请日：1999-05-12

申请人： Satoshi Ito ,  Masaki Mizutani ,  Hiroshi Noro ,  Shinichiro Sudo ,  Takashi Fukushima ,  Makoto Kuwamura

发明人： Satoshi Ito ,  Masaki Mizutani ,  Hiroshi Noro ,  Shinichiro Sudo ,  Takashi Fukushima ,  Makoto Kuwamura

IPC分类号： H01L2144

CPC分类号： H01L24/29 ,  C08L63/00 ,  H01L21/563 ,  H01L23/293 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/29011 ,  H01L2224/29036 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/73103 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/81193 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83193 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  C08L2666/02 ,  C08L61/04 ,  C08L2666/08 ,  H01L2924/00014 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/014

摘要： The present invention provides a process for the production of a semiconductor device comprising a semiconductor element provided on a printed circuit board with a plurality of connecting electrode portions provided interposed therebetween, the gap between said printed circuit board and said semiconductor element being sealed with an underfill resin layer. In accordance with the present invention, (1) the underfill resin layer is formed by melting a lamellar solid resin provided interposed between said printed circuit board and said semiconductor element, and (2) the lamellar solid resin provided interposed between said printed circuit board and said semiconductor element is heated for a predetermined period of time until the temperature of the solid resin layer reaches a predetermined range where the two components are connected to each other under pressure under the following conditions (X) and (Y): (X) Supposing that the initial residual heat of reaction of the solid resin before heating is 100% as determined by a differential scanning calorimeter (DSC), the residual heat of reaction thereof is not more than 70% of the initial residual heat of reaction; and (Y) The temperature of the semiconductor element is predetermined higher than that of the printed circuit board, and the difference in temperature between them is not less than 50° C. In this manner, a production process which facilitates the resin sealing of the gap between the semiconductor element and the board and thus can inhibit warpage of the entire semiconductor device and a semiconductor device having an excellent reliability can be provided. In the present invention, the use of a sheet-like underfill material which gives an underfill resin layer having an elastic modulus in tension at 25° C. of from 300 to 15,000 MPa when hardened can provide a semiconductor device which exerts an excellent effect of relaxing the stress on the semiconductor element, printed circuit board and connecting electrode portions and thus exhibits a high reliability.

公开(公告)号：US20120153513A1

公开(公告)日：2012-06-21

申请号：US13405706

申请日：2012-02-27

申请人： Eiji Toyoda ,  Hiroshi Noro

发明人： Eiji Toyoda ,  Hiroshi Noro

IPC分类号： H01L23/29 ,  C09J163/00

CPC分类号： C09J163/00 ,  C08L33/00 ,  C08L2666/04 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/181 ,  Y10T428/254 ,  Y10T428/2852 ,  Y10T428/287 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

摘要： A thermosetting encapsulation adhesive sheet which is used for encapsulating a chip type device (1) having connection electrodes (bumps) (3) and mounted on a wiring circuit board (2). The thermosetting encapsulation adhesive sheet is composed of an epoxy resin composition having a viscosity of 5×104 to 5×106 Pa·s as measured at a temperature of 80 to 120° C. before thermosetting thereof. The thermosetting encapsulation adhesive sheet makes it possible to conveniently encapsulate a hollow device with an improved yield.

摘要翻译： 一种用于封装具有连接电极（凸块）（3）并安装在布线电路板（2）上的芯片型器件（1）的热固性封装粘合片。 热固性封装粘合片由在热硬化之前在80〜120℃的温度下测定的粘度为5×10 4〜5×10 6 Pa·s的环氧树脂组合物构成。 热固性包封粘合片使得可以以提高的产率方便地包封中空装置。

公开(公告)号：US07521122B2

公开(公告)日：2009-04-21

申请号：US10876651

申请日：2004-06-28

申请人： Hiroshi Noro ,  Koji Akazawa ,  Masayuki Yamamoto ,  Yasuhiko Yamamoto

发明人： Hiroshi Noro ,  Koji Akazawa ,  Masayuki Yamamoto ,  Yasuhiko Yamamoto

IPC分类号： B32B27/00 ,  H01L21/00

CPC分类号： B32B27/08 ,  B32B27/26 ,  B32B27/38 ,  B32B2457/00 ,  H01L21/56 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/3114 ,  H01L23/3157 ,  H01L24/27 ,  H01L24/29 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68363 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/3025 ,  Y10T29/49002 ,  Y10T428/12528 ,  Y10T428/24802 ,  Y10T428/24942 ,  Y10T428/265 ,  Y10T428/31551 ,  Y10T428/31565 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/01028 ,  H01L2924/00 ,  H01L2924/3512

摘要： A laminated sheet for adhering to a circuit side of a projected electrode-mounting wafer in a step of grinding a backside of the wafer, wherein the laminated sheet comprises at least a layer (layer A) contacting with the circuit side, made of a thermosetting resin, a layer (layer B) directly laminated on the layer A, made of a thermoplastic resin having a tensile modulus of from 1 to 300 MPa at 40° to 80° C., and an outermost layer (layer C) made of a thermoplastic resin which is non-plastic at a temperature of at least 25° C.; A method for manufacturing a semiconductor device, comprising the steps of grinding a backside of a projected electrode-mounting wafer wherein the laminated sheet is adhered to a circuit side of the wafer, removing other layers besides the layer A of the laminated sheet, and cutting the wafer into individual chips; and a semiconductor device obtainable by the method.

摘要翻译： 一种用于在研磨晶片背面的步骤中粘附到突出的电极安装晶片的电路侧的层压片，其中所述层叠片材至少包括与电路侧接触的层（层A），其由热固性 树脂，直接层压在层A上的由在40℃至80℃下的拉伸模量为1至300MPa的热塑性树脂制成的层（层B）和由 在至少25℃的温度下是非塑性的热塑性树脂; 一种制造半导体器件的方法，包括以下步骤：研磨投影电极安装晶片的背面，其中所述层压片粘附到所述晶片的电路侧，除去所述层压片的层A之外的其它层，以及切割 晶圆成为单芯片; 以及可通过该方法获得的半导体器件。

公开(公告)号：US20080286562A1

公开(公告)日：2008-11-20

申请号：US12119896

申请日：2008-05-13

申请人： Eiji Toyoda ,  Hiroshi Noro

发明人： Eiji Toyoda ,  Hiroshi Noro

IPC分类号： B32B5/02

CPC分类号： C09J163/00 ,  C08L33/00 ,  C08L2666/04 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/181 ,  Y10T428/254 ,  Y10T428/2852 ,  Y10T428/287 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

摘要： A thermosetting encapsulation adhesive sheet which is used for encapsulating a chip type device (1) having connection electrodes (bumps) (3) and mounted on a wiring circuit board (2). The thermosetting encapsulation adhesive sheet is composed of an epoxy resin composition having a viscosity of 5×104 to 5×106 Pa·s as measured at a temperature of 80 to 120° C. before thermosetting thereof. The thermosetting encapsulation adhesive sheet makes it possible to conveniently encapsulate a hollow device with an improved yield.

摘要翻译： 一种用于封装具有连接电极（凸块）（3）并安装在布线电路板（2）上的芯片型器件（1）的热固性封装粘合片。 热固性包封粘合片由在80至120℃的温度下测得的粘度为5×10 4至5×10 6 Pa的环氧树脂组合物组成。 在其热固之前。 热固性包封粘合片使得可以以提高的产率方便地包封中空装置。

公开(公告)号：US08922031B2

公开(公告)日：2014-12-30

申请号：US13405706

申请日：2012-02-27

申请人： Eiji Toyoda ,  Hiroshi Noro

发明人： Eiji Toyoda ,  Hiroshi Noro

IPC分类号： B32B7/12 ,  C09J163/00 ,  C08L33/00

CPC分类号： C09J163/00 ,  C08L33/00 ,  C08L2666/04 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/181 ,  Y10T428/254 ,  Y10T428/2852 ,  Y10T428/287 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

摘要： A thermosetting encapsulation adhesive sheet which is used for encapsulating a chip type device (1) having connection electrodes (bumps) (3) and mounted on a wiring circuit board (2). The thermosetting encapsulation adhesive sheet is composed of an epoxy resin composition having a viscosity of 5×104 to 5×106 Pa·s as measured at a temperature of 80 to 120° C. before thermosetting thereof. The thermosetting encapsulation adhesive sheet makes it possible to conveniently encapsulate a hollow device with an improved yield.

摘要翻译： 一种用于封装具有连接电极（凸块）（3）并安装在布线电路板（2）上的芯片型器件（1）的热固性封装粘合片。 热固性封装粘合片由在热硬化之前在80〜120℃的温度下测定的粘度为5×10 4〜5×10 6 Pa·s的环氧树脂组合物构成。 热固性包封粘合片使得可以以提高的产率方便地包封中空装置。

公开(公告)号：US08575227B2

公开(公告)日：2013-11-05

申请号：US13179703

申请日：2011-07-11

申请人： Yukiko Higo ,  Hiroshi Noro

发明人： Yukiko Higo ,  Hiroshi Noro

IPC分类号： C08J3/28 ,  H05B6/68

CPC分类号： G02B1/04 ,  C08G59/687 ,  C08G65/105 ,  C08G65/18 ,  C08G65/22 ,  C08L63/00 ,  C08L71/02 ,  G02B1/041

摘要： The present invention relates to a photocurable resin composition including an epoxy resin, an oxetane compound and a photopolymerization initiator, in which the epoxy resin includes the following ingredient (A), and the oxetane compound includes the following ingredient (B), and the ingredient (A) is contained in an amount of from 60 to 95% by weight and the ingredient (B) is contained in an amount of from 5 to 40% by weight relative to 100% by weight of a total resin amount in the resin composition: (A) an epoxy resin having at least two epoxy groups in one molecule thereof and being liquid at room temperature; and (B) an oxetane compound represented by the following general formula (I) in which n is an integer of from 1 to 6.

摘要翻译： 本发明涉及包含环氧树脂，氧杂环丁烷化合物和光聚合引发剂的光固化性树脂组合物，其中环氧树脂包括以下成分（A），氧杂环丁烷化合物包括以下成分（B），其成分 （A）的含量为60〜95重量％，成分（B）的含量相对于树脂组合物中树脂总量的100重量％为5〜40重量％ （A）在一分子中具有至少两个环氧基并在室温下为液体的环氧树脂; 和（B）由以下通式（I）表示的氧杂环丁烷化合物，其中n为1至6的整数。

公开(公告)号：US08557891B2

公开(公告)日：2013-10-15

申请号：US13179625

申请日：2011-07-11

申请人： Yukiko Higo ,  Hiroshi Noro

发明人： Yukiko Higo ,  Hiroshi Noro

IPC分类号： C08F2/42 ,  C08J3/28 ,  B32B27/38

CPC分类号： G02B1/04 ,  B82Y10/00 ,  B82Y40/00 ,  C08G59/226 ,  C08G65/18 ,  C08L63/00 ,  C08L2205/05 ,  C08L2312/06 ,  G02B1/041 ,  G03F7/0002 ,  G03F7/0005 ,  G03F7/038 ,  Y10T428/31504 ,  Y10T428/31511 ,  C08L71/02

摘要： The present invention relates to a photocurable resin composition including an epoxy resin, an oxetane compound and a photopolymerization initiator, in which the epoxy resin includes the following ingredients (A) and (B) in combination, and the oxetane compound includes the following ingredient (C): (A) an epoxy resin having at least two epoxy groups in one molecule thereof and being liquid at 60° C. or higher; (B) a solid epoxy resin having at least two epoxy groups in one molecule thereof and having a refractive index of 1.6 or more by itself; and (C) an oxetane compound represented by the following general formula (1) in which n is an integer of 1 to 6.

摘要翻译： 本发明涉及包含环氧树脂，氧杂环丁烷化合物和光聚合引发剂的光固化树脂组合物，其中环氧树脂组合包括以下成分（A）和（B），氧杂环丁烷化合物包括以下成分（ C）：（A）在其一分子中具有至少两个环氧基并在60℃以上为液体的环氧树脂; （B）在其一分子中具有至少两个环氧基且其折射率本身为1.6以上的固体环氧树脂; 和（C）由以下通式（1）表示的氧杂环丁烷化合物，其中n为1至6的整数。

公开(公告)号：US20090281018A1

公开(公告)日：2009-11-12

申请号：US12085997

申请日：2007-01-24

申请人： Keiichi Onoda ,  Masakazu Furukawa ,  Kazuyoshi Ozaki ,  Hiroshi Noro ,  Yasumitsu Sakuma

发明人： Keiichi Onoda ,  Masakazu Furukawa ,  Kazuyoshi Ozaki ,  Hiroshi Noro ,  Yasumitsu Sakuma

IPC分类号： C11D3/39 ,  C11D3/20

CPC分类号： C11D3/3907 ,  C11D3/2041 ,  C11D3/2065 ,  C11D3/2068 ,  C11D3/3935 ,  C11D11/0082 ,  D06L4/12

摘要： The present invention relates to a bleaching activator granule containing (a) a bleaching activator and (b) a specified alcohol which is liquid at room temperature (25° C.).

摘要翻译： 本发明涉及含有（a）漂白活化剂和（b）在室温（25℃）下为液体的特定醇的漂白活化剂颗粒。

公开(公告)号：US06916538B2

公开(公告)日：2005-07-12

申请号：US10392836

申请日：2003-03-21

申请人： Hiroshi Noro ,  Mitsuaki Fusumada

发明人： Hiroshi Noro ,  Mitsuaki Fusumada

IPC分类号： C08G59/18 ,  H01L21/56 ,  H01L23/29 ,  B32B27/38 ,  C08L63/00

CPC分类号： C08G59/188 ,  H01L21/563 ,  H01L23/293 ,  H01L2224/29007 ,  H01L2224/73204 ,  H01L2224/83192 ,  H01L2924/01025 ,  H01L2924/01079 ,  Y10T428/12528 ,  Y10T428/31511

摘要： A thermosetting resin composition which contains: (A) an epoxy resin having at least two epoxy groups per molecule; (B) a hardener; (C) a compound represented by the following general formula (1) or (2); and (D) a microcapsule type hardening accelerator containing microcapsules each having a structure made up of a core containing a hardening accelerator and a shell covering the core and containing a polymer having a structural unit represented by the following general formula (3), and which, when examined by differential scanning calorimetry at a heating rate of 10° C./min, shows an exothermic peak due to reaction in the range of from 180 to 250° C., and a semiconductor device obtained through sealing with the composition are described.

摘要翻译： 一种热固性树脂组合物，其包含：（A）每分子具有至少两个环氧基的环氧树脂; （B）硬化剂; （C）由以下通式（1）或（2）表示的化合物： 和（D）含有微胶囊的微胶囊型硬化促进剂，其具有由包含硬化促进剂的芯和覆盖芯的外壳构成的结构，并且含有具有由以下通式（3）表示的结构单元的聚合物， ，通过差示扫描量热法以10℃/分钟的加热速率检测时，由于反应在180〜250℃的范围内显示出放热峰，并且描述了通过密封该组合物获得的半导体器件 。