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公开(公告)号：US10991683B2
公开(公告)日：2021-04-27
申请号：US16486559
申请日：2018-03-06
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Norwin von Malm , Andreas Plössl
Abstract: A method of manufacturing an optoelectronic component includes: A) providing a substrate, B) providing a metallic liquid arranged in a structured manner and in direct mechanical contact on the substrate and including at least one first metal, C) providing semiconductor chips each having a metallic termination layer on their rear side, the metallic termination layer including at least one second metal different from the first metal, and D) self-organized arranging the semiconductor chips on the metallic liquid so that the first metal and the second metal form at least one intermetallic compound having a higher re-melting temperature than the melting temperature of the metallic liquid, wherein the intermetallic compound is a connecting layer between the substrate and the semiconductor chips.
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42.发明申请公开(公告)号：US20200161512A1
公开(公告)日：2020-05-21
申请号：US16196775
申请日：2018-11-20
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Darshan Kundaliya , Norwin von Malm , Jeffery J. Serre
IPC: H01L33/50 , H01L25/075
Abstract: A ceramic conversion element, a light-emitting device and a method for producing a ceramic conversion element are disclosed. In an embodiment a ceramic conversion element includes a central region with a structured top surface including a plurality of structure elements and a frame surrounding the central region, the frame having a planar top surface, wherein the central region and the frame are formed as one piece, and wherein the ceramic conversion element is configured to convert primary radiation into secondary radiation of a different wavelength range.
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公开(公告)号：US20190386182A1
公开(公告)日：2019-12-19
申请号：US16480732
申请日：2018-01-25
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Britta Göötz , Norwin von Malm
Abstract: A radiation-emitting device includes a semiconductor layer sequence having an active layer that emits a primary radiation during operation, a decoupling surface on a surface of the semiconductor layer sequence, a wavelength conversion layer on a side of the semiconductor layer sequence facing away from the decoupling surface, containing at least one conversion material that converts the primary radiation into secondary radiation, and a mirror layer on the side of the wavelength conversion layer facing away from the semiconductor layer sequence, wherein the at least one conversion material is electrically conductive and/or embedded in an electrically conductive matrix material.
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公开(公告)号：US10475778B2
公开(公告)日：2019-11-12
申请号：US15578240
申请日：2016-05-24
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Alexander F. Pfeuffer , Norwin von Malm , Stefan Grötsch , Andreas Plößl
IPC: H01L29/04 , H01L25/18 , H01L33/08 , H01L33/62 , H01L33/64 , H01L25/00 , H01L27/12 , H01L27/15 , H01L33/00 , H01L33/22 , H01L33/32
Abstract: An optoelectronic component and a method for producing an optoelectronic component are disclosed. In an embodiment the optoelectronic component includes a semiconductor chip subdivided into a plurality of pixels, the pixels being arranged next to one another in a lateral direction and being configured to be activated individually and independently and a metallic connecting element having an upper side and an underside, the connecting element including a contiguous metallic connecting layer, which is completely passed through by a plurality of first metallic through-connections arranged next to one another in the lateral direction, wherein the first through-connections are electrically insulated and spaced from the connecting layer by insulating regions, wherein each first through-connection is unambiguously assigned to one pixel, is electrically-conductively connected to this pixel and forms a first electrical contact to this pixel, and wherein the semiconductor chip is connected by the connecting element to a carrier.
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公开(公告)号：US10411168B2
公开(公告)日：2019-09-10
申请号：US14779818
申请日：2014-03-24
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Joachim Reill , Frank Singer , Norwin von Malm , Matthias Sabathil
Abstract: An optoelectronic semiconductor component includes a semiconductor chip having a semiconductor layer sequence including an active region that generates radiation; a radiation exit surface running parallel to the active region; a mounting side surface that fixes the semiconductor component and runs obliquely or perpendicularly to the radiation exit surface and at which at least one contact area for external electrical contacting is accessible; a molded body molded onto the semiconductor chip in places and forming the mounting side surface at least in regions; and a contact track arranged on the molded body and electrically conductively connecting the semiconductor chip to the at least one contact area.
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Patent Agency Ranking
公开(公告)号：US10388836B2
公开(公告)日：2019-08-20
申请号：US15302029
申请日：2015-03-18
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Ion Stoll , Norwin von Malm
Abstract: A light-emitting device includes a light-emitting semiconductor component that emits first light in a first wavelength range during operation A wavelength conversion element converts the first light at least partly into second light in a second wavelength range is arranged in the beam path of the first light. The second wavelength range differs from the first wavelength range. The wavelength conversion element includes nanoparticles containing organic luminescent molecules in a basic material formed from an SiO2-based material. A method for producing a light-emitting device is furthermore specified.
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47.发明授权公开(公告)号：US10236426B2
公开(公告)日：2019-03-19
申请号：US15473918
申请日：2017-03-30
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Britta Göötz , Wolfgang Mönch , Norwin von Malm
Abstract: An optoelectronic semiconductor component and a method for producing an optoelectronic semiconductor component are disclosed. In an embodiment, the component includes a carrier, a multi-pixel semiconductor chip that emits electromagnetic radiation during operation, wherein the semiconductor chip is arranged on the carrier, and wherein the semiconductor chip has a plurality of individually activatable pixels capable of generating primary radiation and a wavelength conversion element for at least partially converting the primary radiation emitted from the semiconductor chip into electromagnetic secondary radiation, wherein an active zone of the multi-pixel semiconductor chip extends continuously over the plurality of pixels, and wherein the wavelength conversion element is implemented in one piece.
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公开(公告)号：US09917077B2
公开(公告)日：2018-03-13
申请号：US14773830
申请日：2014-03-05
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Norwin von Malm , Alexander Martin
IPC: H01L25/16 , H01L27/15 , H01L33/40 , H01L23/538 , H01L29/786 , H01L33/50 , H01L33/38 , H01L33/44
CPC classification number: H01L25/167 , H01L23/5386 , H01L27/156 , H01L29/78672 , H01L33/382 , H01L33/405 , H01L33/44 , H01L33/505 , H01L2924/0002 , H01L2924/00
Abstract: A display device includes at least one semiconductor body, which has a semiconductor layer sequence, which has an active region provided for producing radiation and forms a plurality of pixels. The device also includes a driver circuit that has a plurality of switches, which are each provided for controlling at least one pixel. A first metallization layer and/or the second metallization layer are electroconductively connected to at least one of the pixels. The first metallization layer and the second metallization layer are arranged overlapping one another in such a manner that, in a plan view onto the display device, the driver circuit is covered with at least one of the metallization layers at every point which overlaps with one of the pixels or is arranged between two adjacent pixels.
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公开(公告)号：US09847467B2
公开(公告)日：2017-12-19
申请号：US15030652
申请日：2014-10-27
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Dominik Scholz , Norwin von Malm , Stefan Illek
CPC classification number: H01L33/62 , H01L25/167 , H01L33/0079 , H01L33/0095 , H01L2924/0002 , H01L2933/0066 , H01L2924/00
Abstract: A method of producing a contact element for an optoelectronic component includes providing an auxiliary carrier with a sacrificial layer arranged on a top side of the auxiliary carrier; providing a carrier structure having a top side and a rear side situated opposite the top side, wherein an insulation layer is arranged at the rear side of the carrier structure; connecting the sacrificial layer to the insulation layer by an electrically conductive connection layer; creating at least one blind hole extending from the top side of the carrier structure as far as the insulation layer; opening the insulation layer in a region of the at least one blind hole; arranging an electrically conductive material in the at least one blind hole; detaching the auxiliary carrier by separating the sacrificial layer; and patterning the electrically conductive connection layer.
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公开(公告)号：US20170352700A1
公开(公告)日：2017-12-07
申请号：US15663936
申请日：2017-07-31
Applicant: OSRAM Opto Semiconductors GmbH
Inventor： Norwin von Malm
CPC classification number: H01L27/156 , H01L27/124 , H01L27/1259 , H01L27/15 , H01L33/005 , H01L33/20 , H01L33/382 , H01L33/50 , H01L33/505 , H01L33/62 , H01L2933/0066
Abstract: A display device with a semiconductor layer sequence includes an active region provided for generating radiation and a plurality of pixels. The display device also includes a carrier. The active region is arranged between a first semiconductor layer and a second semiconductor layer. The semiconductor layer sequence includes a recess, which extends from a major face of the semiconductor layer sequence facing the carrier through the active region into the first semiconductor layer and is provided for electrical contacting of the first semiconductor layer. The carrier includes a number of switches, which are each provided for controlling at least one pixel.
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