-
公开(公告)号:US09773774B1
公开(公告)日:2017-09-26
申请号:US15475327
申请日:2017-03-31
申请人: PDF Solutions, Inc.
发明人: Stephen Lam , Dennis Ciplickas , Tomasz Brozek , Jeremy Cheng , Simone Comensoli , Indranil De , Kelvin Doong , Hans Eisenmann , Timothy Fiscus , Jonathan Haigh , Christopher Hess , John Kibarian , Sherry Lee , Marci Liao , Sheng-Che Lin , Hideki Matsuhashi , Kimon Michaels , Conor O'Sullivan , Markus Rauscher , Vyacheslav Rovner , Andrzej Strojwas , Marcin Strojwas , Carl Taylor , Rakesh Vallishayee , Larg Weiland , Nobuharu Yokoyama
IPC分类号: H01L29/00 , H01L27/02 , H01L29/45 , H01L23/522 , H01L23/528 , H01L21/66 , H01L21/8234 , H01L27/088 , G06F17/50 , H01L29/06 , G06F11/07
CPC分类号: H01L27/0207 , G06F11/079 , G06F17/5045 , G06F17/5072 , G06F17/5081 , H01L21/823437 , H01L21/823475 , H01L22/20 , H01L22/30 , H01L22/32 , H01L22/34 , H01L23/5226 , H01L23/528 , H01L27/088 , H01L29/0684 , H01L29/45
摘要: A process for making and using a semiconductor wafer includes instantiating first and second designs of experiments (DOEs), each comprised of at least two fill cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The first DOE contains fill cells configured to enable non-contact (NC) detection of chamfer shorts, and the second DOE contains fill cells configured to enable NC detection of corner shorts. The process may further include obtaining NC measurements from the first and/or second DOE(s) and using such measurements, at least in part, to selectively perform additional processing, metrology or inspection steps on the wafer, and/or on other wafer(s) currently being manufactured.
-
公开(公告)号:US09761575B1
公开(公告)日:2017-09-12
申请号:US15395800
申请日:2016-12-30
申请人: PDF Solutions, Inc.
发明人: Stephen Lam , Dennis Ciplickas , Tomasz Brozek , Jeremy Cheng , Simone Comensoli , Indranil De , Kelvin Doong , Hans Eisenmann , Timothy Fiscus , Jonathan Haigh , Christopher Hess , John Kibarian , Sherry Lee , Marci Liao , Sheng-Che Lin , Hideki Matsuhashi , Kimon Michaels , Conor O'Sullivan , Markus Rauscher , Vyacheslav Rovner , Andrzej Strojwas , Marcin Strojwas , Carl Taylor , Rakesh Vallishayee , Larg Weiland , Nobuharu Yokoyama
CPC分类号: H01L22/20 , G01R31/303 , G06F11/079 , G06F17/5045 , G06F17/5068 , G06F17/5072 , G06F17/5081 , G06F2217/06 , H01L21/823437 , H01L21/823475 , H01L22/26 , H01L22/32 , H01L22/34 , H01L23/5226 , H01L23/528 , H01L27/0207 , H01L27/088 , H01L27/11803 , H01L27/11807 , H01L28/00 , H01L29/0649 , H01L29/0684 , H01L29/0847 , H01L29/41725 , H01L29/45 , H01L2027/11866 , H01L2027/11875 , H01L2027/11888
摘要: An IC includes logic cells, selected from a standard cell library, and fill cells, configured for compatibility with the standard logic cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The IC includes such NCEM-enabled fill cells configured to enable detection and/or measurement of a variety of short-circuit failure modes, including at least one chamfer-short-related failure mode, one AACNT-short-related failure mode, one GATE-short-related failure mode, and one TS-short-related failure mode.
-
公开(公告)号:US09761574B1
公开(公告)日:2017-09-12
申请号:US15392712
申请日:2016-12-28
申请人: PDF Solutions, Inc.
发明人: Stephen Lam , Dennis Ciplickas , Tomasz Brozek , Jeremy Cheng , Simone Comensoli , Indranil De , Kelvin Doong , Hans Eisenmann , Timothy Fiscus , Jonathan Haigh , Christopher Hess , John Kibarian , Sherry Lee , Marci Liao , Sheng-Che Lin , Hideki Matsuhashi , Kimon Michaels , Conor O'Sullivan , Markus Rauscher , Vyacheslav Rovner , Andrzej Strojwas , Marcin Strojwas , Carl Taylor , Rakesh Vallishayee , Larg Weiland , Nobuharu Yokoyama
CPC分类号: H01L22/20 , G01R31/303 , G06F11/079 , G06F17/5045 , G06F17/5068 , G06F17/5072 , G06F17/5081 , G06F2217/06 , H01L21/823437 , H01L21/823475 , H01L22/26 , H01L22/32 , H01L22/34 , H01L23/5226 , H01L23/528 , H01L27/0207 , H01L27/088 , H01L27/11803 , H01L27/11807 , H01L28/00 , H01L29/0649 , H01L29/0684 , H01L29/0847 , H01L29/41725 , H01L29/45 , H01L2027/11866 , H01L2027/11875 , H01L2027/11888
摘要: An IC includes logic cells, selected from a standard cell library, and fill cells, configured for compatibility with the standard logic cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The IC includes such NCEM-enabled fill cells configured to enable detection and/or measurement of a variety of open-circuit and short-circuit failure modes, including at least one via-open-related failure mode, one GATECNT-short-related failure mode, one metal-short-related failure mode, and one AA-short-related failure mode.
-
公开(公告)号:US09761573B1
公开(公告)日:2017-09-12
申请号:US15371842
申请日:2016-12-07
申请人: PDF Solutions, Inc.
发明人: Stephen Lam , Dennis Ciplickas , Tomasz Brozek , Jeremy Cheng , Simone Comensoli , Indranil De , Kelvin Doong , Hans Eisenmann , Timothy Fiscus , Jonathan Haigh , Christopher Hess , John Kibarian , Sherry Lee , Marci Liao , Sheng-Che Lin , Hideki Matsuhashi , Kimon Michaels , Conor O'Sullivan , Markus Rauscher , Vyacheslav Rovner , Andrzej Strojwas , Marcin Strojwas , Carl Taylor , Rakesh Vallishayee , Larg Weiland , Nobuharu Yokoyama
IPC分类号: H01L29/00 , H01L27/02 , H01L21/66 , H01L29/417 , H01L23/528 , G06F17/50 , G06F11/07
CPC分类号: H01L22/26 , G01R31/2884 , G06F11/079 , G06F17/5045 , G06F17/5068 , G06F17/5072 , G06F17/5081 , H01L22/20 , H01L22/34 , H01L23/5226 , H01L23/528 , H01L27/0207 , H01L27/11803 , H01L27/11807 , H01L29/0649 , H01L29/0684 , H01L29/41725 , H01L29/45 , H01L2027/11866 , H01L2027/11875 , H01L2027/11885 , H01L2027/11887
摘要: An IC includes logic cells, selected from a standard cell library, and fill cells, configured for compatibility with the standard logic cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The IC includes such NCEM-enabled fill cells configured to enable detection and/or measurement of a variety of open-circuit and short-circuit failure modes, including at least one via-open-related failure mode, one AACNT-short-related failure mode, one GATECNT-short-related failure mode, and one TS-short-related failure mode.
-
公开(公告)号:US09741741B1
公开(公告)日:2017-08-22
申请号:US15371756
申请日:2016-12-07
申请人: PDF Solutions, Inc.
发明人: Stephen Lam , Dennis Ciplickas , Tomasz Brozek , Jeremy Cheng , Simone Comensoli , Indranil De , Kelvin Doong , Hans Eisenmann , Timothy Fiscus , Jonathan Haigh , Christopher Hess , John Kibarian , Sherry Lee , Marci Liao , Sheng-Che Lin , Hideki Matsuhashi , Kimon Michaels , Conor O'Sullivan , Markus Rauscher , Vyacheslav Rovner , Andrzej Strojwas , Marcin Strojwas , Carl Taylor , Rakesh Vallishayee , Larg Weiland , Nobuharu Yokoyama
IPC分类号: H01L29/00 , H01L27/118 , H01L23/528 , H01L23/522 , H01L27/02 , H01L29/45 , G01R31/28 , G06F17/50 , G06F11/07 , H01L29/06
CPC分类号: H01L22/26 , G01R31/2884 , G06F11/079 , G06F17/5045 , G06F17/5068 , G06F17/5072 , G06F17/5081 , H01L22/20 , H01L22/34 , H01L23/5226 , H01L23/528 , H01L27/0207 , H01L27/11803 , H01L27/11807 , H01L29/0649 , H01L29/0684 , H01L29/41725 , H01L29/45 , H01L2027/11866 , H01L2027/11875 , H01L2027/11885 , H01L2027/11887
摘要: An IC includes logic cells, selected from a standard cell library, and fill cells, configured for compatibility with the standard logic cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The IC includes such NCEM-enabled fill cells configured to enable detection and/or measurement of a variety of open-circuit and short-circuit failure modes, including at least one via-open-related failure mode, one AACNT-short-related failure mode, one GATE-short-related failure mode, and one GATECNT-short-related failure mode.
-
公开(公告)号:US09711421B1
公开(公告)日:2017-07-18
申请号:US15258432
申请日:2016-09-07
申请人: PDF Solutions, Inc.
发明人: Stephen Lam , Dennis Ciplickas , Tomasz Brozek , Jeremy Cheng , Simone Comensoli , Indranil De , Kelvin Doong , Hans Eisenmann , Timothy Fiscus , Jonathan Haigh , Christopher Hess , John Kibarian , Sherry Lee , Marci Liao , Sheng-Che Lin , Hideki Matsuhashi , Kimon Michaels , Conor O'Sullivan , Markus Rauscher , Vyacheslav Rovner , Andrzej Strojwas , Marcin Strojwas , Carl Taylor , Rakesh Vallishayee , Larg Weiland , Nobuharu Yokoyama
IPC分类号: H01L21/66
CPC分类号: H01L22/26 , G01R31/2884 , G06F11/079 , G06F17/5045 , G06F17/5068 , G06F17/5072 , G06F17/5081 , H01L22/20 , H01L22/34 , H01L23/5226 , H01L23/528 , H01L27/0207 , H01L27/11803 , H01L27/11807 , H01L29/0649 , H01L29/0684 , H01L29/41725 , H01L29/45 , H01L2027/11866 , H01L2027/11875 , H01L2027/11885 , H01L2027/11887
摘要: Improved processes for manufacturing wafers, chips, or dies utilize in-line data obtained from non-contact electrical measurements (“NCEM”) of fill cells that contain structures configured to target/expose a variety of open-circuit, short-circuit, leakage, or excessive resistance failure modes, including GATE-snake-open and/or GATE-snake-resistance failure modes. Such processes may involve evaluating Designs of Experiments (“DOEs”), comprised of multiple NCEM-enabled fill cells, in at least two variants, all targeted to the same failure mode(s).
-
公开(公告)号:US11668746B2
公开(公告)日:2023-06-06
申请号:US17750405
申请日:2022-05-23
申请人: PDF SOLUTIONS, INC.
发明人: Indranil De , Marian Mankos , Dennis Ciplickas , Christopher Hess , Jeremy Cheng , Balasubramanian Murugan , Qi Hu
IPC分类号: G01R31/306 , G01R31/302 , G01R31/265
CPC分类号: G01R31/306 , G01R31/2653 , G01R31/3025
摘要: Systems, devices, and methods for performing a non-contact electrical measurement (NCEM) on a NCEM-enabled cell included in a NCEM-enabled cell vehicle may be configured to perform NCEMs while the NCEM-enabled cell vehicle is moving. The movement may be due to vibrations in the system and/or movement of a movable stage on which the NCEM-enabled cell vehicle is positioned. Position information for an electron beam column producing the electron beam performing the NCEMs and/or for the moving stage may be used to align the electron beam with targets on the NCEM-enabled cell vehicle while it is moving.
-
公开(公告)号:US11081477B1
公开(公告)日:2021-08-03
申请号:US16458087
申请日:2019-06-30
申请人: PDF Solutions, Inc.
发明人: Stephen Lam , Dennis Ciplickas , Tomasz Brozek , Jeremy Cheng , Simone Comensoli , Indranil De , Kelvin Doong , Hans Eisenmann , Timothy Fiscus , Jonathan Haigh , Christopher Hess , John Kibarian , Sherry Lee , Marci Liao , Sheng-Che Lin , Hideki Matsuhashi , Kimon Michaels , Conor O'Sullivan , Markus Rauscher , Vyacheslav Rovner , Andrzej Strojwas , Marcin Strojwas , Carl Taylor , Rakesh Vallishayee , Larg Weiland , Nobuharu Yokoyama , Matthew Moe
IPC分类号: H01L21/26 , H01L21/66 , H01L29/00 , H01L27/02 , H01L23/528 , H01L27/088 , H01L23/522 , H01L21/3213 , H01L29/08 , H01L29/45 , H01L21/8234 , H01J37/26 , H03K19/0944 , G01R31/28 , G06F30/39
摘要: An IC that includes a contiguous standard cell area with a 4×3 e-beam pad that is compatible with advanced manufacturing processes and an associated e-beam testable structure.
-
公开(公告)号:US10593604B1
公开(公告)日:2020-03-17
申请号:US15090267
申请日:2016-04-04
申请人: PDF Solutions, Inc.
发明人: Stephen Lam , Dennis Ciplickas , Tomasz Brozek , Jeremy Cheng , Simone Comensoli , Indranil De , Kelvin Doong , Hans Eisenmann , Timothy Fiscus , Jonathan Haigh , Christopher Hess , John Kibarian , Sherry Lee , Marci Liao , Sheng-Che Lin , Hideki Matsuhashi , Kimon Michaels , Conor O'Sullivan , Markus Rauscher , Vyacheslav Rovner , Andrzej Strojwas , Marcin Strojwas , Carl Taylor , Rakesh Vallishayee , Larg Weiland , Nobuharu Yokoyama
IPC分类号: H01L21/66 , H01L27/02 , G06K9/03 , G06K9/62 , G01R31/307 , G01N21/956 , H01L23/544 , G01R31/28 , G01N21/66 , G06T7/00
摘要: Improved processes for manufacturing wafers, chips, or dies utilize in-line data obtained from non-contact electrical measurements (“NCEM”) of fill cells that contain structures configured target/expose a variety of open-circuit, short-circuit, leakage, or excessive resistance failure modes. Such processes may involve evaluating Designs of Experiments (“DOEs”), comprised of multiple NCEM-enabled fill cells, in at least two variants, all targeted to the same failure mode(s).
-
公开(公告)号:US10269786B1
公开(公告)日:2019-04-23
申请号:US15473649
申请日:2017-03-30
申请人: PDF Solutions, Inc.
发明人: Stephen Lam , Dennis Ciplickas , Tomasz Brozek , Jeremy Cheng , Simone Comensoli , Indranil De , Kelvin Doong , Hans Eisenmann , Timothy Fiscus , Jonathan Haigh , Christopher Hess , John Kibarian , Sherry Lee , Marci Liao , Sheng-Che Lin , Hideki Matsuhashi , Kimon Michaels , Conor O'Sullivan , Markus Rauscher , Vyacheslav Rovner , Andrzej Strojwas , Marcin Strojwas , Carl Taylor , Rakesh Vallishayee , Larg Weiland , Nobuharu Yokoyama
IPC分类号: H01L23/58 , H01L29/10 , H01L27/118 , H01L27/02 , H01L29/45 , H01L23/522 , H01L23/528 , H01L21/66 , H01L21/8234 , H01L27/088
摘要: An IC includes first and second designs of experiments (DOES), each comprised of at least two fill cells. The fill cells contain structures configured to obtain in-line data via non-contact electrical measurements (“NCEM”). The first DOE contains fill cells configured to enable non-contact (NC) detection of tip-to-side shorts, and the second DOE contains fill cells configured to enable NC detection of corner shorts.
-
-
-
-
-
-
-
-
-