Heterojunction device comprising a semiconductor oxide and a resistivity-switching oxide or nitride
    41.
    发明授权
    Heterojunction device comprising a semiconductor oxide and a resistivity-switching oxide or nitride 有权
    异质结装置包括半导体氧化物和电阻率切换氧化物或氮化物

    公开(公告)号:US08592792B2

    公开(公告)日:2013-11-26

    申请号:US13553963

    申请日:2012-07-20

    IPC分类号: H01L29/04 H01L47/00

    摘要: A monolithic three dimensional memory array is provided that includes a first memory level formed above a substrate, and a second memory level monolithically formed above the first memory level. The first memory level includes a first plurality of substantially parallel, substantially coplanar conductors extending in a first direction, a second plurality of substantially parallel, substantially coplanar conductors extending in a second direction, the second direction different from the first direction, the second conductors above the first conductors, and a first plurality of devices. Each of the first plurality of devices is disposed between one of the first conductors and one of the second conductors, and includes a resistivity-switching binary metal oxide or nitride compound and a silicon, germanium, or silicon-germanium alloy resistor of a single conductivity type. Numerous other aspects are provided.

    摘要翻译: 提供了一种单片三维存储器阵列,其包括形成在衬底上方的第一存储器级和在第一存储器级上方单片地形成的第二存储器级。 第一存储器级包括在第一方向上延伸的第一多个基本上平行的基本上共面的导体,在第二方向上延伸的第二多个大致平行的基本上共面的导体,第二方向不同于第一方向,第二方向与第一方向不同 第一导体和第一多个装置。 第一多个器件中的每一个设置在第一导体中的一个和第二导体中的一个之间,并且包括电阻率切换二元金属氧化物或氮化物化合物以及具有单一导电性的硅,锗或硅 - 锗合金电阻器 类型。 提供了许多其他方面。

    Nonvolatile memory cell comprising a diode and a resistance-switching material
    42.
    发明授权
    Nonvolatile memory cell comprising a diode and a resistance-switching material 有权
    包括二极管和电阻切换材料的非易失性存储单元

    公开(公告)号:US08349664B2

    公开(公告)日:2013-01-08

    申请号:US12855462

    申请日:2010-08-12

    IPC分类号: H01L21/82

    摘要: In a novel nonvolatile memory cell formed above a substrate, a diode is paired with a reversible resistance-switching material, preferably a metal oxide or nitride such as, for example, NixOy, NbxOy, TixOy, HfxOy, AlxOy, MgxOy, CoxOy, CrxOy, VxOy, ZnxOy, ZrxOy, BxNy, and AlxNy. In preferred embodiments, the diode is formed as a vertical pillar disposed between conductors. Multiple memory levels can be stacked to form a monolithic three dimensional memory array. In some embodiments, the diode comprises germanium or a germanium alloy, which can be deposited and crystallized at relatively low temperatures, allowing use of aluminum or copper in the conductors. The memory cell of the present invention can be used as a rewriteable memory cell or a one-time-programmable memory cell, and can store two or more data states.

    摘要翻译: 在形成在衬底上方的新型非易失性存储单元中,二极管与可逆电阻切换材料配对,优选为金属氧化物或氮化物,例如NixOy,NbxOy,TixOy,HfxOy,AlxOy,MgxOy,CoxOy,CrxOy ,VxOy,ZnxOy,ZrxOy,BxNy和AlxNy。 在优选实施例中,二极管形成为设置在导体之间的垂直支柱。 可以堆叠多个存储器级别以形成单片三维存储器阵列。 在一些实施例中,二极管包括锗或锗合金,其可以在相对低的温度下沉积和结晶,从而允许在导体中使用铝或铜。 本发明的存储单元可以用作可重写存储单元或一次可编程存储单元,并且可以存储两个或多个数据状态。

    MIIM diodes having stacked structure
    45.
    发明授权
    MIIM diodes having stacked structure 有权
    具有堆叠结构的MIIM二极管

    公开(公告)号:US07969011B2

    公开(公告)日:2011-06-28

    申请号:US12240785

    申请日:2008-09-29

    IPC分类号: H01L23/48

    摘要: A metal-insulator diode is disclosed. In one aspect, the metal-insulator diode comprises first and second electrode and first and second insulators arraigned as follows. An insulating region has a trench formed therein. The trench has a bottom and side walls. The first electrode, which comprises a first metal, is on the side walls and over the bottom of the trench. A first insulator has a first interface with the first electrode. At least a portion of the first insulator is within the trench. A second insulator has a second interface with the first insulator. At least a portion of the second insulator is within the trench. The second electrode, which comprises a second metal, is in contact with the second insulator. The second electrode at least partially fills the trench.

    摘要翻译: 公开了一种金属绝缘体二极管。 在一个方面,金属绝缘体二极管包括第一和第二电极以及第一和第二绝缘体,如下所述。 绝缘区域中形成有沟槽。 沟槽有一个底部和侧壁。 第一电极包括第一金属,位于沟槽的侧壁和底部的上方。 第一绝缘体具有与第一电极的第一界面。 第一绝缘体的至少一部分在沟槽内。 第二绝缘体具有与第一绝缘体的第二接口。 第二绝缘体的至少一部分在沟槽内。 包括第二金属的第二电极与第二绝缘体接触。 第二电极至少部分地填充沟槽。

    Dual insulating layer diode with asymmetric interface state and method of fabrication
    46.
    发明授权
    Dual insulating layer diode with asymmetric interface state and method of fabrication 有权
    具有非对称界面状态和制造方法的双重绝缘层二极管

    公开(公告)号:US07897453B2

    公开(公告)日:2011-03-01

    申请号:US12336410

    申请日:2008-12-16

    IPC分类号: H01L21/8234

    摘要: An integrated circuit including vertically oriented diode structures between conductors and methods of fabricating the same are provided. The diode is a metal-insulator diode having a first metal layer, a first insulating layer, a second insulating layer and a second metal layer. At least one asymmetric interface state is provided at the intersection of at least two of the layers to increase the ratio of the diode's on-current to its reverse bias leakage current. In various examples, the asymmetric interface state is formed by a positive or negative sheet charge that alters the barrier height and/or electric field at one or more portions of the diode. Two-terminal devices such as passive element memory cells can utilize the diode as a steering element in series with a state change element. The devices can be formed using pillar structures at the intersections of upper and lower conductors.

    摘要翻译: 提供了一种在导体之间包括垂直取向的二极管结构的集成电路及其制造方法。 二极管是具有第一金属层,第一绝缘层,第二绝缘层和第二金属层的金属绝缘体二极管。 在至少两个层的交叉处提供至少一个非对称界面状态,以增加二极管的导通电流与其反向偏置漏电流的比率。 在各种示例中,非对称界面状态由改变二极管的一个或多个部分处的势垒高度和/或电场的正或负片电荷形成。 诸如无源元件存储单元的两端器件可以将二极管用作与状态改变元件串联的转向元件。 可以在上下导体的交点处使用支柱结构形成装置。

    Dual Insulating Layer Diode With Asymmetric Interface State And Method Of Fabrication
    49.
    发明申请
    Dual Insulating Layer Diode With Asymmetric Interface State And Method Of Fabrication 有权
    双绝缘层二极管与不对称接口状态及制作方法

    公开(公告)号:US20100148324A1

    公开(公告)日:2010-06-17

    申请号:US12336410

    申请日:2008-12-16

    IPC分类号: H01L29/868

    摘要: An integrated circuit including vertically oriented diode structures between conductors and methods of fabricating the same are provided. The diode is a metal-insulator diode having a first metal layer, a first insulating layer, a second insulating layer and a second metal layer. At least one asymmetric interface state is provided at the intersection of at least two of the layers to increase the ratio of the diode's on-current to its reverse bias leakage current. In various examples, the asymmetric interface state is formed by a positive or negative sheet charge that alters the barrier height and/or electric field at one or more portions of the diode. Two-terminal devices such as passive element memory cells can utilize the diode as a steering element in series with a state change element. The devices can be formed using pillar structures at the intersections of upper and lower conductors.

    摘要翻译: 提供了一种在导体之间包括垂直取向的二极管结构的集成电路及其制造方法。 二极管是具有第一金属层,第一绝缘层,第二绝缘层和第二金属层的金属绝缘体二极管。 在至少两个层的交叉处提供至少一个非对称界面状态,以增加二极管的导通电流与其反向偏置漏电流的比率。 在各种示例中,非对称界面状态由改变二极管的一个或多个部分处的势垒高度和/或电场的正或负片电荷形成。 诸如无源元件存储单元的两端器件可以将二极管用作与状态改变元件串联的转向元件。 可以在上下导体的交点处使用支柱结构形成装置。

    Large capacity one-time programmable memory cell using metal oxides
    50.
    发明授权
    Large capacity one-time programmable memory cell using metal oxides 失效
    大容量一次性可编程存储单元,使用金属氧化物

    公开(公告)号:US07706169B2

    公开(公告)日:2010-04-27

    申请号:US12005277

    申请日:2007-12-27

    申请人: Tanmay Kumar

    发明人: Tanmay Kumar

    IPC分类号: G11C11/00

    摘要: A method of programming a nonvolatile memory device includes (i) providing a nonvolatile memory cell comprising a diode in series with at least one metal oxide, (ii) applying a first forward bias to change a resistivity state of the metal oxide from a first state to a second state; (iii) applying a second forward bias to change a resistivity state of the metal oxide from a second state to a third state; and (iv) applying a third forward bias to change a resistivity state of the metal oxide from a third state to a fourth state. The fourth resistivity state is higher than the third resistivity state, the third resistivity state is lower than the second resistivity state, and the second resistivity state is lower than the first resistivity state.

    摘要翻译: 非易失性存储器件的编程方法包括:(i)提供包括与至少一种金属氧化物串联的二极管的非易失性存储单元,(ii)施加第一正向偏压以从第一状态改变金属氧化物的电阻率状态 到第二个状态 (iii)施加第二正向偏压以将金属氧化物的电阻率状态从第二状态改变到第三状态; 和(iv)施加第三正向偏压以将金属氧化物的电阻率状态从第三状态改变到第四状态。 第四电阻率状态高于第三电阻率状态,第三电阻率状态低于第二电阻率状态,第二电阻率状态低于第一电阻率状态。