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    Semiconductor package
    41.
    发明授权
    Semiconductor package 有权

    公开(公告)号：US11069666B2

    公开(公告)日：2021-07-20

    申请号：US16454907

    申请日：2019-06-27

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Chui Kyu Kim ,  Dae Hyun Park ,  Jung Ho Shim ,  Jae Hyun Lim ,  Mi Ja Han ,  Sang Jong Lee ,  Han Kim

    IPC: H01L25/16 ,  H01L23/00 ,  H01L23/31 ,  H01L23/522 ,  H01L23/528

    Abstract: A semiconductor package includes a frame having a through-hole, and a first semiconductor chip disposed in the through-hole of the frame and having an active surface on which a connection pad is disposed, an inactive surface opposing the active surface, and a side surface connecting the active and inactive surfaces. A first encapsulant covers at least a portion of each of the inactive surface and the side surface of the first semiconductor chip. A connection structure has a first surface having disposed thereon the active surface of the first semiconductor chip, and includes a redistribution layer electrically connected to the connection pad of the first semiconductor chip. A first passive component is disposed on a second surface of the connection structure opposing the first surface, the first passive component being electrically connected to the redistribution layer and having a thickness greater than a thickness of the first semiconductor chip.

    Inductor
    42.
    发明授权
    Inductor 有权

    公开(公告)号：US10796836B2

    公开(公告)日：2020-10-06

    申请号：US16128997

    申请日：2018-09-12

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Seung Jae Song ,  Min Ki Jung ,  Han Kim ,  Seung Hee Hong

    IPC: H01F27/28 ,  H01F17/00

    Abstract: An inductor includes a body including insulating layers stacked therein, in which coil patterns are respectively disposed on the insulating layers, and first and second external electrodes disposed on an external surface of the body, wherein the coil patterns are connected to each other by a plurality of coil connecting portions, and opposing ends thereof are connected to the first and second external electrodes through coil lead portions, respectively, to form a coil, the coil patterns include outer coil patterns disposed in an outer portion of the body and inner coil patterns disposed in an inner portion, a first coil connecting portion connects the outer coil patterns and a second coil connecting portion connects one coil pattern of the outer coil patterns and another coil pattern of the inner coil patterns, and the first and second coil connecting portions are disposed in a staggered manner.

    Fan-out semiconductor package including stacked chips
    43.
    发明授权
    Fan-out semiconductor package including stacked chips 有权

    公开(公告)号：US10734324B2

    公开(公告)日：2020-08-04

    申请号：US16171114

    申请日：2018-10-25

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Yun Tae Lee ,  Eun Jung Jo ,  Han Kim

    IPC: H01L23/538 ,  H01L23/31 ,  H01L23/00 ,  H01L25/18 ,  H01L25/065

    Abstract: A fan-out semiconductor package includes a core member having a first through-hole and including wiring layers; a first semiconductor chip disposed in the first through-hole and having first connection pads formed on a lower side of the first semiconductor chip; a first encapsulant covering the core member and the first semiconductor chip; a connection member disposed below the core member and the first semiconductor chip and including redistribution layers; a first stack chip disposed on the first encapsulant and electrically connected to the wiring layers through a first connection conductor; and a second encapsulant disposed on the first encapsulant and covering the first stack chip. The first semiconductor chip includes DRAM and/or a controller, the first stack chip includes a stack type NAND flash, and the first connection pads of the first semiconductor chip are electrically connected to the wiring layers through the redistribution layers.

    Coil component
    46.
    发明授权
    Coil component 有权

    公开(公告)号：US10580559B2

    公开(公告)日：2020-03-03

    申请号：US15619974

    申请日：2017-06-12

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sang Jong Lee ,  Su Bong Jang ,  Han Kim ,  Min Ki Jung

    IPC: H01F5/00 ,  H01F17/00 ,  H01F27/32 ,  H01F27/29 ,  H03H7/38

    Abstract: A coil component may include a body including a plurality of insulating layers having coil patterns disposed on the plurality of insulating layers. The coil pattern may include a coil portion, a leading portion disposed on one side of the insulating layer, and a connection portion connecting the coil portion and the leading portion, a pattern line of the coil portion may have an arc shape, and the connection portion may be formed in a tangent line direction of the coil portion from one end of the leading portion.

    INDUCTOR
    47.
    发明申请
    INDUCTOR 审中-公开

    公开(公告)号：US20190355508A1

    公开(公告)日：2019-11-21

    申请号：US16190993

    申请日：2018-11-14

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sung Jun Lim ,  Yeong Min Jeong ,  Kyung Ho Lee ,  Han Kim ,  Sang Jong Lee ,  Su Bong Jang

    IPC: H01F27/28 ,  H01F27/30

    Abstract: An inductor includes a body in which a plurality of insulating layers on which a plurality of coil patterns are arranged are stacked, and first and second external electrodes disposed on an external surface of the body, wherein the plurality of coil patterns are connected through coil connecting portions and include coil patterns disposed on an outer side and coil patterns disposed on an inner side thereof, a coil pattern disposed on the inner side adjacent to the coil pattern disposed on the outer side includes two coil connecting portions spaced apart from each other and facing each other in a length direction of the body, and a dummy electrode pattern is further disposed in a void portion between two coil connecting portions.

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