-
公开(公告)号：US20180012700A1
公开(公告)日：2018-01-11
申请号：US15619974
申请日：2017-06-12
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sang Jong LEE , Su Bong JANG , Han KIM , Min Ki JUNG
Abstract: A coil component may include a body including a plurality of insulating layers having coil patterns disposed on the plurality of insulating layers. The coil pattern may include a coil portion, a leading portion disposed on one side of the insulating layer, and a connection portion connecting the coil portion and the leading portion, a pattern line of the coil portion may have an arc shape, and the connection portion may be formed in a tangent line direction of the coil portion from one end of the leading portion.
-
公开(公告)号：US20170338039A1
公开(公告)日：2017-11-23
申请号：US15404357
申请日：2017-01-12
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seung Mo LIM , Hyun Ho SHIN , Sang Jong LEE , Yun Sung KANG , Woong Do JUNG , Sung Sun KIM
Abstract: A thin film capacitor includes: a body formed by alternately stacking first and second electrode layers, with dielectric layers therebetween on a substrate. A plurality of first vias are disposed in the body and electrically connected to the first electrode layers. A plurality of second vias are disposed in the body, electrically connected to the second electrode layers, and disposed alternately with the first vias. A first connection electrode is disposed on an upper surface of the body and connected to the plurality of first vias, a second connection electrode is disposed on the upper surface of the body and connected to the plurality of second vias, and first and second electrode pads are disposed on the first and second connection electrodes, respectively, and formed to not overlap the plurality of first and second vias.
-
公开(公告)号：US20240332199A1
公开(公告)日：2024-10-03
申请号：US18226988
申请日：2023-07-27
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Chi Hyeon JEONG , Seong Hwan LEE , Hyun Sang KWAK , Min Cheol PARK , Sang Jong LEE
IPC: H01L23/538 , H01L21/48
CPC classification number: H01L23/5385 , H01L21/4846 , H01L23/5386 , H01L24/13 , H01L24/16 , H01L25/0655 , H01L2224/13111 , H01L2224/13124 , H01L2224/13147 , H01L2224/16227 , H01L2924/014
Abstract: A printed circuit board includes a substrate having an upper surface at which a plurality of first pads are disposed, and an interconnect structure including an encapsulant, a plurality of second pads disposed at an upper surface of the encapsulant, and a plurality of metal wires disposed in the encapsulant and respectively connected to at least one of the plurality of second pads, the interconnect structure disposed on an upper side of the substrate. At least a portion of an upper surface of each of the plurality of first and second pads is exposed in an upward direction from the upper surface of each of the substrate and the encapsulant.
-
公开(公告)号：US20230307179A1
公开(公告)日：2023-09-28
申请号：US17851542
申请日：2022-06-28
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Min Cheol PARK , Sang Jong LEE , Hyung Joon KIM , Hyun Sang KWAK , Chi Hyeon JEONG , Seong Hwan LEE
CPC classification number: H01G4/005 , H01G4/30 , H01G4/228 , H01G4/1227 , H05K1/182 , H05K2201/10015
Abstract: A multilayer capacitor includes: a body including a capacitance region in which at least one first internal electrode and at least one second internal electrode are alternately laminated in a first direction with at least one dielectric layer interposed therebetween; and first and second external electrodes spaced apart from each other and respectively disposed on first and second surfaces of the body, the first and second surfaces opposing each other. The body further includes a first via electrode, connecting the at least one first internal electrode and the first external electrode to each other in the first direction, and a second via electrode connecting the at least one second internal electrode and the second external electrode to each other in the first direction.
-
公开(公告)号：US20230217111A1
公开(公告)日：2023-07-06
申请号：US18079246
申请日：2022-12-12
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae Ho YUN , Sang Jong LEE , Han KIM
IPC: H04N23/68 , H02K41/035 , H04N23/54
CPC classification number: H04N23/687 , H02K41/0354 , H04N23/54 , G03B13/34
Abstract: A sensor actuator includes a first movable body on which an image sensor having an imaging plane is disposed, a second movable body spaced apart from the first movable body in a direction perpendicular to the imaging plane, a fixed body accommodating the first movable body and the second movable body, and a driver configured to provide driving force to the first movable body, wherein the first movable body and the second movable body move together in a direction parallel to the imaging plane, and the first movable body rotates relative to the second movable body.
-
Patent Agency Ranking
公开(公告)号：US20230209198A1
公开(公告)日：2023-06-29
申请号：US17984601
申请日：2022-11-10
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sang Jong LEE , Su Bong JANG , Hee Soo YOON , Tae Ho YUN , Ju Ho KIM
CPC classification number: H04N5/23287 , H04N5/23258 , H04N5/2253 , H04N5/2254
Abstract: A sensor shifting actuator includes a sensor substrate on which an image sensor having an imaging surface is disposed; a base configured to accommodate the sensor substrate; and a driver configured to drive the image sensor in a first direction and a second direction, parallel to the imaging surface. The sensor substrate includes a movable portion on which the image sensor is disposed, a fixed portion coupled to the base, and a connection portion disposed between the movable portion and the fixed portion. Depending on a movement direction of the image sensor in the first direction or the second direction, the movable portion and the connection portion relatively move with respect to the fixed portion, or the movable portion relatively moves with respect to the connection portion.
-
公开(公告)号：US20230209159A1
公开(公告)日：2023-06-29
申请号：US17967973
申请日：2022-10-18
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Su Bong JANG , Sang Jong LEE , Hee Soo YOON , Tae Ho YUN , Seung Jae SONG
IPC: H04N5/225
CPC classification number: H04N5/2253
Abstract: A camera module is provided. The camera module includes a fixed body which has an internal space; a first movable body movably disposed on the fixed body; a substrate disposed on the first movable body, and on which an image sensor is mounted; a yoke disposed on one of the fixed body and the first movable body; a coil disposed on the other of the fixed body and the first movable body, and disposed to face the yoke; and an elastic member connected to the fixed body and the first movable body, and configured to provide a restorative force to the first movable body.
-
公开(公告)号：US20210183578A1
公开(公告)日：2021-06-17
申请号：US16849612
申请日：2020-04-15
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Sang Jong LEE , Su Bong JANG , Hee Soo YOON
Abstract: A multilayer capacitor and a board on which the multilayer capacitor is mounted provide increased capacitor effective area. The multilayer capacitor includes a capacitor body having first and second dielectric layers each with first and second internal electrodes, first and second external electrodes disposed on a surface of the capacitor body, a first via electrode connecting the first internal electrodes to the first external electrode, and a second via electrode connecting the second internal electrodes to the second external electrode. The first and second dielectric layers are alternately stacked in the first direction such that the first internal electrode of the first dielectric layer overlaps the second internal electrode of the second dielectric layer in a first direction, and the second internal electrode of the first dielectric layer overlaps the first internal electrode of the second dielectric layer in the first direction.
-
公开(公告)号：US20210175613A1
公开(公告)日：2021-06-10
申请号：US17177545
申请日：2021-02-17
Applicant: Samsung Electro-Mechanics.,Co., Ltd.
Inventor： Seong Hee CHOI , Sang Jong LEE , Sung Yong AN , Jae Yeong KIM , Ju Hyoung PARK
Abstract: An antenna module includes: a board having a first surface including a ground region and a feed region; and chip antennas mounted on the first surface, each of the chip antennas including a first antenna and a second antenna. The first antenna and the second antenna each include a ground portion bonded to the ground region, and a radiation portion bonded to the feed region. A length of a radiating surface of the first antenna is greater than a mounting height of the first antenna, and a mounting height of the second antenna is greater than a length of a radiating surface of the second antenna. A horizontal spacing distance between the radiation portion of the first antenna and the ground region is greater than a horizontal spacing distance between the radiation portion of the second antenna and the ground region.
-
公开(公告)号：US20200091583A1
公开(公告)日：2020-03-19
申请号：US16506289
申请日：2019-07-09
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seong Hee CHOI , Sang Jong LEE
Abstract: A chip antenna module includes: a substrate including a feed wiring layer to provide a feed signal, a feeding via connected to the feed wiring layer, and a dummy via separated from the feed wiring layer; and a chip antenna disposed on a first surface of the substrate and including a body portion formed of a dielectric substance, a radiating portion that extends from a first surface of the body portion and is connected to the feeding via and the dummy via, and a grounding portion that extends from a second surface of the body portion opposite the first surface of the body portion.
-
-
-
-
-
-
-
-
-
Search Results
57
records
(took 0.024 seconds)
