公开(公告)号：US20230163023A1

公开(公告)日：2023-05-25

申请号：US18054970

申请日：2022-11-14

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Sungjoo AN ,  Jungsoo YOON ,  Soyoung LEE ,  Keunwook SHIN

IPC: H01L21/764 ,  H01L21/768 ,  H01L27/11556 ,  H01L27/11582

CPC classification number: H01L21/764 ,  H01L21/7682 ,  H01L27/11556 ,  H01L27/11582

Abstract: A method of fabricating a semiconductor device including a two-dimensional material layer defining an air-gap, and the semiconductor device therefrom are provided. The method of fabricating a semiconductor device, includes forming a structure on a substrate, wherein the structure has an opening; loading the substrate into a process chamber; forming at least one two-dimensional material layer on an upper surface of the structure so as to overlie the opening and form an air-gap, wherein an upper portion of the air-gap is defined by the at least one two-dimensional material layer; and unloading the substrate from the process chamber.

公开(公告)号：US20230144003A1

公开(公告)日：2023-05-11

申请号：US17903259

申请日：2022-09-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junyoung CHOI ,  Youngmin KANG ,  Moonchul SHIN ,  Yeonggyu YOON ,  Seungjoon LEE ,  Joongyeon CHO ,  Myunghoon KWAK ,  Yongjin KWON ,  Soyoung LEE ,  Jookwan LEE ,  Junghyeob LEE

IPC: H04M1/02

CPC classification number: H04M1/0237 ,  H04M1/0268

Abstract: An electronic device may include a housing; a sliding frame, at least a portion of which is drawn out from the housing in a first direction, or at least a portion of which is retracted into the housing in a second direction; a flexible display including a first region visible from the outside, and a second region extending from the first region and varying in size; and a bending member disposed on a rear surface of the flexible display, the bending member including a plurality of bars arranged in a certain interval. The bending member may include a first bar including at least one first locking part protruding in an inner direction of the electronic device.

公开(公告)号：US20230050984A1

公开(公告)日：2023-02-16

申请号：US17884766

申请日：2022-08-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： Woosung CHUN ,  Seungki CHOI ,  Seunghui SUNWOO ,  Soyoung LEE ,  Hyunju HONG

IPC: H04M1/02 ,  G06F1/16

Abstract: An embodiment disclosed herein relate to a foldable electronic device for improving open convenience and a control method thereof. According to an embodiment, the disclosure may provide a foldable electronic device including: a hinge structure; a first housing connected to the hinge structure; a second housing connected to the hinge structure and foldable with respect to the first housing around the hinge structure; a flexible display; a first magnet disposed in a position adjacent to an edge of the first housing and including a magnetic substance arranged along the longitudinal direction of the first housing; and a second magnet disposed in a position adjacent to an edge of the second housing and corresponding to the first magnet, and including a magnetic substance arranged along the longitudinal direction of the second housing. Various other embodiments are also disclosed.

公开(公告)号：US20230043331A1

公开(公告)日：2023-02-09

申请号：US17971146

申请日：2022-10-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungsik PARK ,  Soyoung LEE

IPC: H05K1/14 ,  G06F1/16 ,  H01Q1/52 ,  H04M1/02 ,  H04B1/3883 ,  G06F1/20 ,  G06F1/26 ,  H01Q9/04 ,  H01R12/53 ,  H05K1/11

Abstract: An electronic device including an interposer is provided. The electronic device includes a first circuit board having a first connection terminal formed thereon, an application processor (AP) connected to the first connection terminal and deployed on the first circuit board, an interposer having a via formed therein and having a first surface attached to the first circuit board, the interposer at least partly surrounding at least a partial region of the first circuit board and a first end portion of the via being electrically connected to the first connection terminal, a second circuit board having a second connection terminal formed thereon and attached to a second surface of the interposer in an opposite direction to the first surface, the second connection terminal being electrically connected to a second end portion of the via and the second circuit board forming an inner space together with the first circuit board and the interposer, a communication processor (CP) connected to the second connection terminal and deployed on the second circuit board, and an antenna electrically connected to the CP.

公开(公告)号：US20220316052A1

公开(公告)日：2022-10-06

申请号：US17711147

申请日：2022-04-01

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sangwon KIM ,  Kyung-Eun BYUN ,  Yeonchoo CHO ,  Keunwook SHIN ,  Eunkyu LEE ,  Changseok LEE ,  Hyunjae SONG ,  Hyeonjin SHIN ,  Jungsoo YOON ,  Soyoung LEE ,  Hyunseok LIM

IPC: C23C16/26 ,  H01L29/45 ,  H01L21/285 ,  C23C16/511 ,  C23C16/505 ,  C23C16/02

Abstract: Provided are nanocrystalline graphene and a method of forming the same. The nanocrystalline graphene may include a plurality of grains formed by stacking a plurality of graphene sheets and has a grain density of about 500 ea/μm2 or higher and a root-mean-square (RMS) roughness in a range of about 0.1 or more to about 1.0 or less. When the nanocrystalline graphene has a grain density and a RMS roughness with these ranges, nanocrystalline graphene capable of covering the entirety of a large area on a substrate as a thin layer may be provided.

公开(公告)号：US20210313169A1

公开(公告)日：2021-10-07

申请号：US17208216

申请日：2021-03-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyunjae SONG ,  Kaoru YAMAMOTO ,  Changhyun KIM ,  Shuji MORIYA ,  Jungsoo YOON ,  Soyoung LEE ,  Changseok LEE

IPC: H01L21/02 ,  H01L21/428 ,  H01L21/3213 ,  H01J37/32

Abstract: Provided are apparatuses for manufacturing semiconductor devices. An apparatus includes a reaction chamber having a stage to be loaded on a substrate, wherein set plasma is formed over the stage, a plurality of gas supply lines connected to the reaction chamber, flow controllers formed on the plurality of gas supply lines, respectively, to control the amount of a gas supplied to the reaction chamber, and a gas splitter configured to supply a mixed gas to the flow controllers. The apparatus may be a thin film deposition apparatus using plasma and further include a flow control unit connected to the gas splitter and a gas supply source connected to the flow control unit.

公开(公告)号：US20210219437A1

公开(公告)日：2021-07-15

申请号：US17056242

申请日：2019-05-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongyoun KIM ,  Kyungmoon SEOL ,  Minsung LEE ,  Jinwoo JUNG ,  Soyoung LEE ,  Jaebong CHUN

IPC: H05K5/00 ,  H05K5/02 ,  H05K7/14

Abstract: Various embodiments of the present invention relate to an electronic device which employs a flexible display and, even when a housing is changed in size or shape, can keep an antenna at the same characteristic. The electronic device may comprise: a first side surface member, on one surface of which a plurality of conductive parts and at least one first non-conductive part disposed between the plurality of conductive parts are arranged; a second side surface member movable toward the one side of the first side surface member; a flexible display, the width of the exposed portion of which can be adjusted on the basis of the movement of the second side surface member; and a wireless communication circuit electrically connected to at least one of the plurality of conductive parts and configured to transmit or receive an RF signal, wherein the second side surface member comprises a sliding cover surface disposed to face the one surface of the first side surface member, and the sliding cover surface has at least one second non-conductive part formed on a portion thereof facing the first non-conductive part, when the overlap between the second side surface member and the first side surface member is largest, and the sliding cover surface is formed not to face the first non-conductive part when the overlap between the second side surface member and the first side surface member is smallest or there is no overlap therebetween. Various other embodiments of the present invention may be additionally provided.

公开(公告)号：US20210143362A1

公开(公告)日：2021-05-13

申请号：US17156672

申请日：2021-01-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Moohyun BAEK ,  Jaeyoung SHIN ,  Youngsoo CHUN ,  Seungmin CHOI ,  Byounguk YOON ,  Soyoung LEE

IPC: H01L51/52 ,  G06F3/041 ,  H01L51/00 ,  H01L27/32

Abstract: An electronic device includes a housing including a recess; an internal structure disposed in the recess; and a display disposed in the recess and supported by the internal structure, where the display includes a display panel including a first region and a second region, where the second region forms at least part of an edge of the display panel; and a flexible polymer layer forming an outer surface of the display panel, where the flexible polymer layer includes a first portion covering the first region and the second region, and a second portion extending from the first portion, enclosing the at least part of the edge of the display panel, and extending inward. Thereby, foreign material can be prevented from entering into the display. Various other embodiments are possible.

公开(公告)号：US20210032279A1

公开(公告)日：2021-02-04

申请号：US16872504

申请日：2020-05-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Soyoung LEE ,  Hiroshi NIHEI ,  Masashi SHIRAI ,  Jaesoon LIM ,  Younjoung CHO

IPC: C07F15/06 ,  H01L21/285 ,  H01L21/768 ,  C23C16/44 ,  C23C16/02 ,  C23C16/18

Abstract: A method of selectively forming a cobalt metal layer includes supplying a cobalt compound represented by Chemical Formula (1) onto a substrate that includes a wiring line of a late transition metal and an isolation film adjacent thereto, and supplying a reducing gas to selectively form a cobalt metal layer on the wiring line,

公开(公告)号：US20180151943A1

公开(公告)日：2018-05-31

申请号：US15817394

申请日：2017-11-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Woosup LEE ,  Hyunjeong LEE ,  Bumjin CHO ,  Hongil KWON ,  Gaeun LEE ,  Soyoung LEE ,  Changho LEE ,  Chihyun CHO ,  Jaebong CHUN

IPC: H01Q1/22 ,  H05K5/00

CPC classification number: H01Q1/2283 ,  H01Q1/243 ,  H01Q5/35 ,  H01Q7/00 ,  H01Q9/0421 ,  H01Q13/106 ,  H04B1/3827 ,  H04M1/0202 ,  H04M2250/04 ,  H05K5/0017

Abstract: Embodiments of the present disclosure relate to an electronic device including a housing antenna formed from a conductive material. At least parts of a side member and a rear cover that constitute the housing of the electronic device are used as an antenna. Accordingly, radiation patterns generated by this antenna are formed on the rear surface of the electronic device as well as at the upper portion of the electronic device. It is therefore possible to perform wireless communication with higher accuracy. Other embodiments are also possible.