Photoresist stripping solution
    41.
    发明授权
    Photoresist stripping solution 有权
    光阻剥离溶液

    公开(公告)号:US08114825B2

    公开(公告)日:2012-02-14

    申请号:US12585973

    申请日:2009-09-30

    IPC分类号: C11D7/50

    摘要: Disclosed is a photoresist stripping solution consisting essentially of (a) a quaternary ammonium hydroxide (e.g., tetramethylammonium hydroxide), (b) at least one water-soluble organic solvent selected from glycols and glycol ethers (e.g., propylene glycol, ethylene glycol, diethylene glycol monobutyl ether), and (c) a non-amine water-soluble organic solvent (e.g., dimethyl sulfoxide, N-methyl-2-pyrrolidone). The photoresist stripping solution of the invention has an excellent photoresist strippability, not causing damage of swelling/coloration to acrylic transparent films used in production of liquid-crystal panels and not causing damage to electrode materials. In particular, it has an excellent photoresist strippability to remove even a thick-film negative photoresist (photosensitive dry film) used in production of semiconductor chip packages (especially, wafer-level chip size packages, W-CSP), not causing damage to copper.

    摘要翻译: 公开了一种基本上由(a)季铵氢氧化物(例如四甲基氢氧化铵),(b)至少一种选自二醇和二醇醚的水溶性有机溶剂(例如丙二醇,乙二醇,二乙烯)的光致抗蚀剂剥离溶液 乙二醇单丁醚)和(c)非胺水溶性有机溶剂(例如二甲基亚砜,N-甲基-2-吡咯烷酮)。 本发明的光致抗蚀剂剥离溶液具有优异的光致抗蚀剂剥离性,不会对生产液晶面板使用的丙烯酸类透明膜造成溶胀/着色的损伤,并且不会对电极材料造成损害。 特别是具有良好的光致抗蚀剂剥离性,即使在半导体芯片封装(特别是晶片级芯片尺寸封装,W-CSP)的生产中使用的厚膜负性光致抗蚀剂(感光性干膜)也能够除去,不会对铜造成损害 。

    MATERIAL FOR FORMATION OF PROTECTIVE FILM, METHOD FOR FORMATION OF PHOTORESIST PATTERN, AND SOLUTION FOR WASHING/REMOVAL OF PROTECTIVE FILM
    42.
    发明申请
    MATERIAL FOR FORMATION OF PROTECTIVE FILM, METHOD FOR FORMATION OF PHOTORESIST PATTERN, AND SOLUTION FOR WASHING/REMOVAL OF PROTECTIVE FILM 有权
    形成保护膜的材料,形成光电子图案的方法和用于洗涤/去除保护膜的方法

    公开(公告)号:US20100086879A1

    公开(公告)日:2010-04-08

    申请号:US12441514

    申请日:2007-09-13

    摘要: Disclosed are: a material for forming a protective film to be laminated on a photoresist film, which can prevent the contamination of an exposing device with an outgas generated from the photoresist film, which has little influence on the environment, which has a high water repellent property, which sparingly causes mixing with the photoresist film, and which can form a high-resolution photoresist pattern; a method for forming a photoresist pattern; and a solution for washing/removing a protective film. Specifically disclosed are: a material for forming a protective film, which comprises (a) a non-polar polymer and (b) a non-polar solvent; a method for forming a photoresist pattern by using the material; and a solution for washing/removing a protective film, which is intended to be used in the method.

    摘要翻译: 公开了一种用于形成层压在光致抗蚀剂膜上的保护膜的材料,其可以防止由具有高斥水性的对环境影响很小的光致抗蚀剂膜产生的废气对曝光装置的污染 性质,其微小地引起与光致抗蚀剂膜的混合,并且其可以形成高分辨率光致抗蚀剂图案; 形成光致抗蚀剂图案的方法; 以及洗涤/除去保护膜的溶液。 具体公开的是:形成保护膜的材料,其包含(a)非极性聚合物和(b)非极性溶剂; 通过使用该材料形成光致抗蚀剂图案的方法; 以及旨在用于该方法的保护膜的洗涤/去除溶液。

    METHOD OF FORMING RESIST PATTERN AND NEGATIVE RESIST COMPOSITION
    43.
    发明申请
    METHOD OF FORMING RESIST PATTERN AND NEGATIVE RESIST COMPOSITION 有权
    形成电阻图案和负极电阻组合物的方法

    公开(公告)号:US20090191478A1

    公开(公告)日:2009-07-30

    申请号:US12438906

    申请日:2007-10-19

    IPC分类号: G03F7/20 G03F7/004

    摘要: A novel method of forming a resist pattern in which thickness loss from the resist pattern is reduced, and a negative resist composition that can be used in this method of forming a resist pattern. The method of forming a resist pattern includes: forming a first resist film by applying a first resist composition to a support, forming a first resist pattern by selectively exposing the first resist film through a first mask pattern and then developing the first resist film, forming a second resist film by applying a negative resist composition containing an ether-based organic solvent (S″) having no hydroxyl groups onto the support having the first resist pattern formed thereon, and forming a resist pattern by selectively exposing the second resist film through a second mask pattern and then developing the second resist film.

    摘要翻译: 形成抗蚀剂图案的厚度损失降低的抗蚀剂图案的新颖方法以及可用于形成抗蚀剂图案的方法中的负型抗蚀剂组合物。 形成抗蚀剂图案的方法包括:通过将第一抗蚀剂组合物施加到载体上来形成第一抗蚀剂膜,通过选择性地将第一抗蚀剂膜通过第一掩模图案曝光,然后显影第一抗蚀剂膜,形成第一抗蚀剂图案,形成第一抗蚀剂图案 通过将不含羟基的醚类有机溶剂(S“)的负性抗蚀剂组合物涂布在其上形成有第一抗蚀剂图案的载体上,形成第二抗蚀剂膜,并通过选择性地使第二抗蚀剂膜通过 第二掩模图案,然后显影第二抗蚀剂膜。

    Method of forming resist pattern and negative resist composition
    45.
    发明授权
    Method of forming resist pattern and negative resist composition 有权
    形成抗蚀剂图案和负性抗蚀剂组合物的方法

    公开(公告)号:US08859187B2

    公开(公告)日:2014-10-14

    申请号:US12438906

    申请日:2007-10-19

    摘要: A novel method of forming a resist pattern in which thickness loss from the resist pattern is reduced, and a negative resist composition that can be used in this method of forming a resist pattern. The method of forming a resist pattern includes: forming a first resist film by applying a first resist composition to a support, forming a first resist pattern by selectively exposing the first resist film through a first mask pattern and then developing the first resist film, forming a second resist film by applying a negative resist composition containing an ether-based organic solvent (S″) having no hydroxyl groups onto the support having the first resist pattern formed thereon, and forming a resist pattern by selectively exposing the second resist film through a second mask pattern and then developing the second resist film.

    摘要翻译: 形成抗蚀剂图案的厚度损失降低的抗蚀剂图案的新颖方法以及可用于形成抗蚀剂图案的方法中的负型抗蚀剂组合物。 形成抗蚀剂图案的方法包括:通过将第一抗蚀剂组合物施加到载体上来形成第一抗蚀剂膜,通过选择性地将第一抗蚀剂膜通过第一掩模图案曝光,然后显影第一抗蚀剂膜,形成第一抗蚀剂图案,形成第一抗蚀剂图案 通过在其上形成有第一抗蚀剂图案的载体上涂布含有无羟基的醚类有机溶剂(S“)的负性抗蚀剂组合物,形成第二抗蚀剂膜,并通过选择性地将第二抗蚀剂膜曝光 第二掩模图案,然后显影第二抗蚀剂膜。

    OPTICAL PATH STRUCTURE OF LASER PROCESSING MACHINE
    46.
    发明申请
    OPTICAL PATH STRUCTURE OF LASER PROCESSING MACHINE 审中-公开
    激光加工机的光学路径结构

    公开(公告)号:US20130032580A1

    公开(公告)日:2013-02-07

    申请号:US13639775

    申请日:2011-11-11

    IPC分类号: B23K26/00

    摘要: An optical path structure of a laser processing machine that irradiates a laser beam from a processing head to a workpiece to perform laser processing, includes: a casing that has an opening, a light leading unit that includes a bend block including a bend mirror which deflects a laser beam traveling within the casing toward a side of the opening and an optical path tube which protrudes from the bend block toward the side of the opening for leading the laser beam to the processing head, a sealing member that is arranged at an edge part of the opening, a moving member that is abutting against the sealing member, that slides with respect to the sealing member, and that is fixed to the light leading unit, and a drive unit that integrally moves the moving member and the light leading unit in a longitudinal direction of the moving member.

    摘要翻译: 激光加工机的光路结构,其将来自处理头的激光束照射到工件进行激光加工,包括:具有开口的壳体,导光单元,其包括弯曲块,所述弯曲块包括弯曲镜,所述弯曲镜偏转 在壳体内朝向开口侧移动的激光束和从弯曲块朝向开口侧突出的光路,用于将激光束引导到处理头;密封构件,其布置在边缘部分 的开口部,与所述密封部件抵接的移动部件,所述移动部件相对于所述密封部件滑动,并且固定在所述导光部件上;驱动部,其将所述移动部件和所述光引导部件一体地移动 移动构件的纵向方向。

    LASER MACHINING DEVICE AND BELLOWS DEVICE
    47.
    发明申请
    LASER MACHINING DEVICE AND BELLOWS DEVICE 有权
    激光加工设备和BELLOWS设备

    公开(公告)号:US20120241423A1

    公开(公告)日:2012-09-27

    申请号:US13514357

    申请日:2011-10-14

    申请人: Shigeru Yokoi

    发明人: Shigeru Yokoi

    IPC分类号: B23K26/04 F16J3/00

    摘要: Provided are: a table on which a workpiece is placed, a laser oscillator emitting a laser beam; a light-guide optical system deflecting the beam emitted from the oscillator; a cylindrical extensible bellows surrounding an optical path of the beam after the light-guide optical system deflects the beam; a bend mirror moving in an axial direction of the bellows while extending/contracting the bellows and deflecting the beam having passed through the bellows toward the table; a machining head irradiating the workpiece with the beam deflected by the mirror; an abnormality detector including a beam-sensor light-emitting unit emitting a beam advancing parallel with an axis of the bellows and a beam-sensor light-receiving unit measuring the amount of received light of the beam; and a control device bringing down the laser oscillator when the amount of received light of the beam in the beam-sensor light-receiving unit falls below a first threshold.

    摘要翻译: 提供:放置工件的工作台,发射激光束的激光振荡器; 导光光学系统偏转从振荡器发射的光束; 在导光光学系统偏转光束之后围绕光束的光路的圆柱形可伸缩波纹管; 弯曲反射镜在波纹管的轴向方向上移动,同时延伸/收缩波纹管并使已经穿过波纹管的光束朝向桌子偏转; 加工头用由镜子偏转的光束照射工件; 异常检测器,其包括发射与波纹管的轴平行的光束的光束传感器发光单元和测量光束的接收光量的光束传感器光接收单元; 以及当束传感器光接收单元中的光束的接收光量低于第一阈值时,使激光振荡器下降的控制装置。

    PROCESS CONTROL APPARATUS AND LASER PROCESSING APPARATUS
    48.
    发明申请
    PROCESS CONTROL APPARATUS AND LASER PROCESSING APPARATUS 有权
    过程控制装置和激光加工装置

    公开(公告)号:US20110042360A1

    公开(公告)日:2011-02-24

    申请号:US12936120

    申请日:2009-04-03

    IPC分类号: B23K26/04

    摘要: A process control apparatus controls a focus position of a laser beam, while a laser processing mechanism converges the laser beam into a predetermined focus position and performs a laser processing on a workpiece. The process control apparatus includes: a calculator that, based on the magnitude of an output of the laser beam that changes during the laser processing, calculates a change amount of a positional deviation of the focus position in an optical axis direction that changes during the laser processing at a laser beam radiation position; and a control unit that, based on the change amount of the positional deviation that has been calculated by the calculator, controls the focus position of the laser beam during the laser processing so as to resolve the positional deviation of the focus position.

    摘要翻译: 过程控制装置控制激光束的焦点位置,而激光加工机构将激光束会聚到预定的聚焦位置,并对工件进行激光加工。 该处理控制装置包括:计算器,其基于在激光处理期间发生变化的激光束的输出的大小来计算在激光器内变化的光轴方向上的聚焦位置的位置偏差的变化量 在激光束辐射位置处理; 以及控制单元,其基于由计算器计算出的位置偏差的变化量来控制激光处理期间的激光束的聚焦位置,以便解析聚焦位置的位置偏差。

    Laser beam machining apparatus
    49.
    发明授权
    Laser beam machining apparatus 失效
    激光束加工设备

    公开(公告)号:US06894248B2

    公开(公告)日:2005-05-17

    申请号:US10483954

    申请日:2003-05-20

    摘要: A laser beam machining apparatus includes a laser oscillator, a machining head which that machines a workpiece using the laser beam. An optical duct has an optical system to guide the laser beam from the laser oscillator to the machining head. Purge gas is supplied into the optical duct from a purge gas supply port, and the purge gas is output from a purge gas exhaust port. A detector detects presence of undesired gas in the optical duct.

    摘要翻译: 激光束加工装置包括激光振荡器,使用激光束加工工件的加工头。 光导管具有将激光振荡器的激光束引导到加工头的光学系统。 净化气体从净化气体供给口供给到光导管中,净化气体从净化气体排出口输出。 检测器检测光导管中不需要的气体的存在。

    Process control apparatus and laser processing apparatus
    50.
    发明授权
    Process control apparatus and laser processing apparatus 有权
    过程控制装置和激光加工装置

    公开(公告)号:US08648279B2

    公开(公告)日:2014-02-11

    申请号:US12936120

    申请日:2009-04-03

    IPC分类号: B23K26/04

    摘要: A process control apparatus controls a focus position of a laser beam, while a laser processing mechanism converges the laser beam into a predetermined focus position and performs a laser processing on a workpiece. The process control apparatus includes: a calculator that, based on the magnitude of an output of the laser beam that changes during the laser processing, calculates a change amount of a positional deviation of the focus position in an optical axis direction that changes during the laser processing at a laser beam radiation position; and a control unit that, based on the change amount of the positional deviation that has been calculated by the calculator, controls the focus position of the laser beam during the laser processing so as to resolve the positional deviation of the focus position.

    摘要翻译: 过程控制装置控制激光束的焦点位置,而激光加工机构将激光束会聚到预定的聚焦位置,并对工件进行激光加工。 该处理控制装置包括:计算器,其基于在激光处理期间发生变化的激光束的输出的大小来计算在激光器内变化的光轴方向上的聚焦位置的位置偏差的变化量 在激光束辐射位置处理; 以及控制单元,其基于由计算器计算出的位置偏差的变化量来控制激光处理期间的激光束的聚焦位置,以便解析聚焦位置的位置偏差。