公开(公告)号：US20080284033A1

公开(公告)日：2008-11-20

申请号：US12149115

申请日：2008-04-28

申请人： Masafumi Horio ,  Yoshinari Ikeda ,  Eiji Mochizuki

发明人： Masafumi Horio ,  Yoshinari Ikeda ,  Eiji Mochizuki

IPC分类号： H01L23/485 ,  H01L21/60

CPC分类号： H01L23/3735 ,  H01L23/142 ,  H01L25/072 ,  H01L2224/32225 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/00

摘要： A semiconductor device includes a first metal foil, an insulating sheet mounted on an upper surface of the first metal foil main, at least one second metal foil mounted on the insulating sheet, at least one solder layer mounted on the at least one second metal foil, and at least one semiconductor element mounted on the at least one second metal foil through the at least one solder layer. The at least one semiconductor has a thickness of 50 μm or greater and less than 100 μm.

摘要翻译： 半导体器件包括第一金属箔，安装在第一金属箔主体的上表面上的绝缘片，安装在绝缘片上的至少一个第二金属箔，安装在至少一个第二金属箔上的至少一个焊料层 以及通过所述至少一个焊料层安装在所述至少一个第二金属箔上的至少一个半导体元件。 所述至少一个半导体具有50μm或更大且小于100μm的厚度。

公开(公告)号：US07403317B2

公开(公告)日：2008-07-22

申请号：US11074785

申请日：2005-03-09

申请人： Eiji Mochizuki

发明人： Eiji Mochizuki

IPC分类号： G02B26/08

CPC分类号： G02B26/0841

摘要： An optical scanning device is disclosed that is manufactured through a simple mounting process and is provided with a hermetically sealed oscillation space for an oscillation mirror. The optical scanning device includes plural drive electrodes for driving the oscillation mirror and plural external electrodes of the drive electrodes that are formed at the same height.

摘要翻译： 公开了一种光学扫描装置，其通过简单的安装工艺制造并且设置有用于振动反射镜的气密密封的振荡空间。 光扫描装置包括用于驱动振荡镜的多个驱动电极和形成在相同高度的驱动电极的多个外部电极。

公开(公告)号：US07368380B2

公开(公告)日：2008-05-06

申请号：US10864917

申请日：2004-06-09

申请人： Seiji Momoto ,  Eiji Mochizuki

发明人： Seiji Momoto ,  Eiji Mochizuki

IPC分类号： H01L21/44 ,  H01L21/445

CPC分类号： H01L29/66136 ,  H01L29/417 ,  H01L29/861 ,  H01L2924/0002 ,  Y10S438/928 ,  H01L2924/00

摘要： A method of manufacturing a semiconductor device is disclosed in which a metallic deposit is stably formed on the anode side with small variation in film thickness, and plating is prevented on the cathode side without carrying out any additional processing on the cathode side. The processed anode side causes no interference in subsequent processing. Insulator films are used to cover a scribe line, as well as a field plate or an open electrode provided on a surface of a silicon substrate before Ni electroless plating of an aluminum electrode is performed to form a metallic deposit on the electrode.

摘要翻译： 公开了一种制造半导体器件的方法，其中在阳极侧稳定地形成金属沉积物，薄膜的厚度变化小，并且在阴极侧不会对阴极侧进行任何额外的处理而防止电镀。 经处理的阳极侧在后续处理中不产生干扰。 在进行铝电极的Ni化学镀以在电极上形成金属沉积物之前，使用绝缘膜覆盖划线，以及设置在硅衬底的表面上的场板或开放电极。

公开(公告)号：US20080055689A1

公开(公告)日：2008-03-06

申请号：US11877800

申请日：2007-10-24

申请人： Eiji Mochizuki

发明人： Eiji Mochizuki

IPC分类号： G02B26/10

CPC分类号： G02B26/0858 ,  G02B26/0841 ,  G02B26/105

摘要： An optical scanning apparatus includes a vibration mirror having a mirror surface that reflects an optical beam. A pair of torsion beams swingably support the mirror. The mirror is vibrated in a sealed space whose pressure is adjusted such that a characteristic of the mirror falls within a predetermined range.

摘要翻译： 光学扫描装置包括具有反射光束的镜面的振动镜。 一对扭转梁可摆动地支撑镜子。 镜子在密封空间中振动，其压力被调节使得镜子的特性落在预定范围内。

公开(公告)号：US07312912B2

公开(公告)日：2007-12-25

申请号：US11349223

申请日：2006-02-08

申请人： Eiji Mochizuki

发明人： Eiji Mochizuki

IPC分类号： G02B26/08

CPC分类号： G02B26/0858 ,  G02B26/0841 ,  G02B26/105

摘要： An optical scanning apparatus includes a vibration mirror having a mirror surface that reflects an optical beam. A pair of torsion beams swingably support the mirror. The mirror is vibrated in a sealed space whose pressure is adjusted such that a characteristic of the mirror falls within a predetermined range.

摘要翻译： 光学扫描装置包括具有反射光束的镜面的振动镜。 一对扭转梁可摆动地支撑镜子。 镜子在密封空间中振动，其压力被调节使得镜子的特性落在预定范围内。

公开(公告)号：US20060157862A1

公开(公告)日：2006-07-20

申请号：US11327482

申请日：2006-01-09

申请人： Yoshitaka Nishimura ,  Akira Morozumi ,  Kazunaga Ohnishi ,  Eiji Mochizuki ,  Yoshikazu Takahashi

发明人： Yoshitaka Nishimura ,  Akira Morozumi ,  Kazunaga Ohnishi ,  Eiji Mochizuki ,  Yoshikazu Takahashi

IPC分类号： H01L23/48

CPC分类号： H01L23/34 ,  H01L23/3735 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/291 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/32225 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01068 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/15787 ,  H01L2924/3511 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/341 ,  H05K3/3463 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/3512 ,  H01L2924/00

摘要： A high-reliability power semiconductor device uses a lead-free solder layer to connect a semiconductor chip such as an IGBT to an insulating substrate having a ceramic board and conductor layers, and a lead-free solder layer to connect the insulating substrate to a radiating base. Before the insulating substrate and the radiating base are solder-connected, the radiating base is warped such that the surface of the radiating base on the side opposite to the insulating substrate is convex. The insulating substrate is solder-connected onto the warped radiating base with the lead-free solder so as to provide a substantially flat solder-connected radiating base. When the radiating base is attached to a cooling fin, the thermal resistances are lower, and heat from the semiconductor chip is effectively dissipated so as to prevent abnormal temperature rise.

摘要翻译： 高可靠性功率半导体器件使用无铅焊料层将诸如IGBT的半导体芯片与具有陶瓷板和导体层的绝缘基板和无铅焊料层连接，以将绝缘基板连接到辐射 基础。 在绝缘基板和辐射基座焊接连接之前，辐射基部翘曲，使得辐射基体在与绝缘基板相反的一侧的表面是凸形的。 绝缘基板用无铅焊料焊接到翘曲的辐射基底上，以提供基本平坦的焊接连接的散热基座。 当散热基座安装在冷却翅片上时，热电阻较低，并且来自半导体芯片的热量被有效地消散，以防止异常升温。

公开(公告)号：US07038313B2

公开(公告)日：2006-05-02

申请号：US10832253

申请日：2004-04-27

申请人： Eiji Mochizuki ,  Yoshitaka Nishimura

发明人： Eiji Mochizuki ,  Yoshitaka Nishimura

IPC分类号： H01L21/44

CPC分类号： H01L23/373 ,  H01L23/3735 ,  H01L2224/32225 ,  H01L2924/13055 ,  H01L2924/00

摘要： A semiconductor device includes a circuit board formed of an insulator substrate and having conductor patterns on both surfaces thereof, a semiconductor chip bonded to the circuit board with one of the conductor patterns therebetween, and a radiator base bonded to the circuit board with a solder layer through the other of the conductor patterns therebetween for conducting heat generated in the semiconductor chip to an outside device. The radiator base is formed of a material having anisotropic thermal conductivity so that the radiator base has thermal conductivity in a direction perpendicular to a bonding plane between the radiator base and the circuit board higher than that along the bonding plane. The radiator base has thermal expansion coefficient along a bonding plane with the circuit board different from that along the bonding plate of the insulator substrate by a predetermined value.

摘要翻译： 半导体器件包括由绝缘体基板形成并且在其两个表面上具有导体图案的电路板，在其间具有一个导体图案的电路板上接合的半导体芯片，以及焊接到电路板的散热器基座 通过其间的导体图案，将半导体芯片中产生的热量传导到外部装置。 散热器基座由具有各向异性热导率的材料形成，使得散热器基座在与散热器基座和电路板之间的接合面垂直的方向上具有比沿接合面高的方向的导热性。 散热器基座具有沿着键合平面的热膨胀系数，电路板与绝缘体基板的接合板不同，具有预定值。

公开(公告)号：US07031040B2

公开(公告)日：2006-04-18

申请号：US10837489

申请日：2004-05-03

申请人： Mitsumi Fujii ,  Eiji Mochizuki

发明人： Mitsumi Fujii ,  Eiji Mochizuki

IPC分类号： G02B26/08

CPC分类号： G02B26/0858 ,  G02B26/0841 ,  G02B26/105

摘要： An optical scanning apparatus includes a vibration mirror having a mirror surface that reflects an optical beam. A pair of torsion beams swingably support the mirror. The mirror is vibrated in a sealed space whose pressure is adjusted such that a characteristic of the mirror falls within a predetermined range.

公开(公告)号：US06995461B2

公开(公告)日：2006-02-07

申请号：US10199507

申请日：2002-07-22

申请人： Shin Soyano ,  Eiji Mochizuki

发明人： Shin Soyano ,  Eiji Mochizuki

IPC分类号： H01L23/02 ,  H01L23/22 ,  H01L23/24 ,  H01L23/28 ,  H05K7/20

CPC分类号： H01L23/045 ,  H01L23/24 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45099 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49111 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2924/00014 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/13055 ,  H01L2924/181 ,  H01L2924/30107 ,  H05K1/144 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a package composed of a metal base, an enclosure case integrated with terminals, and a top cover. A power circuit and a control circuit are arranged inside the package vertically, and a gel-like filler is injected to seal the package after being assembled. In this semiconductor device, externally lead control terminals for the control circuit are insert-molded in a control terminal block constituting an independent component. The control terminal block is fixed to the enclosure case to extend over a center of a top surface thereof. A printed circuit board of the control circuit is disposed and connected between the control terminal block and a relay terminal block disposed inside the case.

公开(公告)号：US06657765B2

公开(公告)日：2003-12-02

申请号：US10085707

申请日：2002-03-01

申请人： Yoshinori Hayashi ,  Eiji Mochizuki ,  Tomohiro Nakajima

发明人： Yoshinori Hayashi ,  Eiji Mochizuki ,  Tomohiro Nakajima

IPC分类号： G02B2608

CPC分类号： G02B26/105

摘要： An optical deflecting unit includes a torsion mirror which is pivotable about an axis and has a deflecting reflection surface which receives a light beam at an incident angle inclined with respect to a plane which is perpendicular to the axis and the deflecting reflection surface, and at least one fixed mirror surface confronting the torsion mirror and arranged so that the light beam is reflected between the torsion mirror and the at least one fixed mirror surface a plurality of times. A moving direction of a reflection position of the light beam on the torsion mirror in a sub scan direction reverses.