公开(公告)号：US20080254242A1

公开(公告)日：2008-10-16

申请号：US11867979

申请日：2007-10-05

申请人： Shinsuke ASADA ,  Takafumi Hara ,  Seizo Fujimoto ,  Masaaki Taruya

发明人： Shinsuke ASADA ,  Takafumi Hara ,  Seizo Fujimoto ,  Masaaki Taruya

IPC分类号： B32B27/00

CPC分类号： B29C66/3242 ,  B29C65/1616 ,  B29C65/1619 ,  B29C65/1635 ,  B29C65/1654 ,  B29C65/1674 ,  B29C65/1696 ,  B29C65/7829 ,  B29C66/112 ,  B29C66/114 ,  B29C66/322 ,  B29C66/326 ,  B29C66/3282 ,  B29C66/542 ,  B29C66/71 ,  B29C66/7332 ,  B29C66/7392 ,  B29C66/81267 ,  B29C66/8322 ,  B29K2023/06 ,  B29K2067/00 ,  B29K2067/006 ,  B29K2069/00 ,  B29K2077/00 ,  B29K2081/04 ,  B29K2995/0027 ,  Y10T428/195 ,  Y10T428/8305 ,  B29C65/00 ,  B29K2071/00 ,  B29K2067/003

摘要： A method for producing a welded resin material contains steps of: superimposing a resin member having transmissibility to laser light and a resin member having absorptivity to laser light to form a contact part where the resin members are in contact with each other; forming a closed space that is adjacent to the contact part and faces one end of the contact part; and radiating the laser light from the resin member having transmissibility while pressing the resin members to each other through the contact part, so as to heat the contact part to melt a resin at the contact part, housing a resin excluded from the contact part through melting in the closed space, solidifying the resin melted at the contact part to weld the resin members.

摘要翻译： 一种焊接树脂材料的制造方法，包括以下步骤：将具有透光性的树脂构件与激光重叠，对具有对激光具有吸收性的树脂构件形成树脂构件彼此接触的接触部; 形成与所述接触部相邻的面向所述接触部的一端的封闭空间; 并且在通过接触部分将树脂构件相互挤压的同时，从具有透光性的树脂构件照射激光，从而加热接触部分以熔化接触部分处的树脂，通过熔化将不接触接触部分的树脂 在封闭空间中固化在接触部分熔化的树脂以熔化树脂构件。

公开(公告)号：US07412895B2

公开(公告)日：2008-08-19

申请号：US11507461

申请日：2006-09-22

申请人： Shinsuke Asada ,  Hiroshi Nakamura ,  Masaaki Taruya

发明人： Shinsuke Asada ,  Hiroshi Nakamura ,  Masaaki Taruya

IPC分类号： G01L9/00

CPC分类号： G01L19/0084 ,  G01L19/0038 ,  G01L19/0627 ,  G01L19/0654 ,  G01L19/141 ,  G01L19/143 ,  H01L2224/48091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor pressure sensor is provided with a semiconductor pressure sensor part that converts a pressure to an electrical signal, a sensor module in which said semiconductor pressure sensor part and a terminal of which part is extended to the outside are insert-molded with a first resin, and an outer case in which said sensor module is contained, and said sensor module is further insert-molded with a second resin to form a connector portion, and the semiconductor pressure sensor is characterized in that the exposed portion of the sensor module from the second resin, and the boundary between the exposed portion of the sensor module and the second resin are covered with an adhesive.

摘要翻译： 半导体压力传感器设置有将压力转换为电信号的半导体压力传感器部件，其中将所述半导体压力传感器部分和其部分的端部延伸到外部的传感器模块用第一树脂 以及其中容纳所述传感器模块的外壳，并且所述传感器模块进一步用第二树脂嵌入成型以形成连接器部分，并且所述半导体压力传感器的特征在于，所述传感器模块的暴露部分 第二树脂，并且传感器模块的暴露部分和第二树脂之间的边界用粘合剂覆盖。

公开(公告)号：US07171858B1

公开(公告)日：2007-02-06

申请号：US11319668

申请日：2005-12-29

申请人： Masao Kanatani ,  Masaaki Taruya ,  Hiroshi Nakamura

发明人： Masao Kanatani ,  Masaaki Taruya ,  Hiroshi Nakamura

IPC分类号： G01L9/00

CPC分类号： G01L9/06

摘要： A semiconductor pressure sensor is intended to achieve reduction in size and cost by decreasing the number of terminals and the number of pads. In the semiconductor pressure sensor, in a first mode in which correction data is input to a memory, a voltage input change-over switch and an input/output change-over switch are operated by an input signal from a switch change-over terminal in such a manner that a voltage input terminal and an input/output terminal are connected to a digital circuit, whereas in a second mode in which an electric signal corrected and amplified is output, the voltage input change-over switch is connected to a semiconductor sensor chip by means of an input signal from the switch change-over terminal, and the input/output terminal is connected to a correction and amplification circuit.

摘要翻译： 半导体压力传感器旨在通过减少端子的数量和焊盘的数量来实现尺寸和成本的降低。 在半导体压力传感器中，在校正数据被输入到存储器的第一模式中，电压输入转换开关和输入/输出转换开关由来自开关转换端子的输入信号 电压输入端子和输入/输出端子连接到数字电路的方式，而在其中输出经过校正和放大的电信号的第二模式中，电压输入转换开关连接到半导体传感器 通过来自开关转换端子的输入信号芯片，并且输入/输出端子连接到校正和放大电路。

公开(公告)号：US20070017294A1

公开(公告)日：2007-01-25

申请号：US11287281

申请日：2005-11-28

申请人： Shinsuke Asada ,  Hiroshi Nakamura ,  Masaaki Taruya

发明人： Shinsuke Asada ,  Hiroshi Nakamura ,  Masaaki Taruya

IPC分类号： G01L9/00

CPC分类号： G01L19/147 ,  G01L19/0038 ,  G01L19/0084 ,  G01L19/0627 ,  G01L19/143 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor pressure sensor can simplify conveyance equipment on a production line, improve production operation efficiency to a substantial extent, and reduce the production cost. The semiconductor pressure sensor includes a semiconductor sensor chip for detecting pressure, a processing circuit for correcting and amplifying an electric signal from the semiconductor sensor chip, a sub package having a terminal electrically connected to the semiconductor sensor chip and the processing circuit through bonding wires, and a housing integrally formed with the sub package at an outer side thereof by insert molding. The sub package is formed with a mounting surface on which the semiconductor sensor chip and the processing circuit are mounted.

摘要翻译： 半导体压力传感器可以简化生产线上的输送设备，大大提高生产运行效率，降低生产成本。 半导体压力传感器包括用于检测压力的半​​导体传感器芯片，用于校正和放大来自半导体传感器芯片的电信号的处理电路，具有通过接合线电连接到半导体传感器芯片的端子和处理电路的子封装， 以及通过嵌件成型在其外侧与子封装体一体形成的壳体。 子封装形成有安装表面，半导体传感器芯片和处理电路安装在该安装表面上。

公开(公告)号：US5359982A

公开(公告)日：1994-11-01

申请号：US104585

申请日：1993-08-11

申请人： Masaaki Taruya

发明人： Masaaki Taruya

IPC分类号： F02P15/00 ,  F02P3/02 ,  H01F27/40 ,  H01F38/12 ,  F02P11/00

CPC分类号： F02P3/02 ,  H01F27/40 ,  H01F38/12

摘要： An ignitor comprising a casing, an ignition coil (1) disposed within the casing (20), a power-transistor package (26) disposed within the casing (20) and electrically connected to the ignition coil (1) for interrupting an electric current flowing through the ignition coil (1), an electrical connector (21) mechanically attached to the power-transistor package (26) and for electrically connecting the ignition coil (1) and the power transistor package (26) to an external circuit and an electrically insulating resin (28) filled within the casing for hermetically sealing and supporting therein the ignition coil (1) and the power-transistor package (26). The power transistor package (26) may comprises a holder (23) mounting the mold resin package and electrically connecting the electrical connector (21) to the power-transistor package (26) and the electrical connector (21) may be fixed to the holder (23) by fastening means (22, 24).

摘要翻译： 一种点火器，包括壳体，设置在壳体（20）内的点火线圈（1），设置在壳体（20）内并电连接到点火线圈（1）的功率晶体管封装（26），用于中断电流 流过点火线圈（1），机械地附接到功率晶体管封装（26）并用于将点火线圈（1）和功率晶体管封装（26）电连接到外部电路的电连接器（21）和 电绝缘树脂（28）填充在壳体内，用于密封和支撑点火线圈（1）和功率晶体管封装（26）。 功率晶体管封装（26）可以包括安装模制树脂封装并将电连接器（21）电连接到功率晶体管封装（26）的保持器（23），并且电连接器（21）可以固定到保持器 （23）通过紧固装置（22,24）。