公开(公告)号：US06757550B1

公开(公告)日：2004-06-29

申请号：US09658270

申请日：2000-09-08

申请人： Masayuki Yoneyama ,  Shigeki Harada

发明人： Masayuki Yoneyama ,  Shigeki Harada

IPC分类号： H04Q720

CPC分类号： H04W24/10 ,  H04W48/20 ,  H04W56/0085 ,  H04W72/0413 ,  H04W72/044 ,  H04W76/10

摘要： A mobile station that selects one of a plurality of base stations according to electric field strengths of signals transmitted on control channels corresponding to the plurality of base stations, and establishes first a link and then a call connection with the selected base station on a traffic channel that is assigned via a control channel corresponding to the selected base station, the mobile station including: a measuring unit for measuring an electric field strength of a signal on the traffic channel when a link operation is performed to establish the link for the traffic channel; and a judging unit for judging whether the link operation should be continued according to the measured electric field strength.

摘要翻译： 1.一种移动台，其根据在与所述多个基站对应的控制信道上发送的信号的电场强度来选择多个基站中的一个，并且首先在业务信道上建立与所选择的基站的链路，然后建立呼叫连接 所述移动台包括：测量单元，用于当执行链路操作以建立所述业务信道的链路时，测量所述业务信道上的信号的电场强度; 以及判断单元，用于根据测量的电场强度来判断是否应该继续连接操作。

公开(公告)号：US5096749A

公开(公告)日：1992-03-17

申请号：US588862

申请日：1990-09-27

申请人： Shigeki Harada ,  Masahiro Sugimoto

发明人： Shigeki Harada ,  Masahiro Sugimoto

IPC分类号： C23C14/06 ,  C04B41/51 ,  C04B41/52 ,  C04B41/89 ,  C23C14/14 ,  C23C14/18 ,  C23C14/58 ,  H01L23/10 ,  H05K1/03 ,  H05K3/38

CPC分类号： C04B41/009 ,  C04B41/52 ,  C04B41/89 ,  H01L2224/32225 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2924/01047 ,  H01L2924/10253 ,  H01L2924/207 ,  H05K1/0306 ,  H05K3/38 ,  Y10T428/12056 ,  Y10T428/12576 ,  Y10T428/31536

摘要： A metallization layer structure containing, in order, an aluminum nitride ceramic base layer, an aluminum titanium nitride layer, a titanium layer, a heat-resistant metallic layer and a metallic layer for facilitating soldering and brazing. The aluminum titanium nitride layer is formed at the interface between the aluminum nitride ceramic base layer and the titanium layer by subjecting a laminate containing, in order, an aluminum nitride ceramic base layer, a titanium layer, a heat-resistant metallic layer and a metallic layer for facilitating soldering and brazing to a heat treatment within the range of 350.degree.-1000.degree. C. for 40 minutes.

公开(公告)号：US5081067A

公开(公告)日：1992-01-14

申请号：US698030

申请日：1991-05-10

申请人： Nobutaka Shimizu ,  Takehisa Tsujimura ,  Masahiro Sugimoto ,  Shigeki Harada

发明人： Nobutaka Shimizu ,  Takehisa Tsujimura ,  Masahiro Sugimoto ,  Shigeki Harada

IPC分类号： H01L23/04 ,  H01L23/057 ,  H01L23/367 ,  H01L23/498

CPC分类号： H01L23/04 ,  H01L23/057 ,  H01L23/367 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/15312 ,  Y10T29/49144

摘要： A ceramic package type semiconductor device comprising: a ceramic substrate having a wiring pattern layer formed on a top surface thereof; at least one semiconductor element mounted on the ceramic substrate with a top face thereof facing downward and electrically connected to the wiring patttern layer; a metal cap having at least one through-hole corresponding to an external size of the semiconductor element and an end portion thereof soldered to the top surface of the ceramic substrate, so that a top surface of the metal cap and a bottom surface of the semiconductor element fitting into the through-hole form a flat plane: and a heatsink member comprising a plate portion which is soldered to the flat plane of the metal cap and the semiconductor element to complete a hermetic sealing of the semiconductor element.

公开(公告)号：US5065223A

公开(公告)日：1991-11-12

申请号：US531457

申请日：1990-05-31

申请人： Hirohisa Matsuki ,  Shigeki Harada ,  Masahiro Sugimoto ,  Toshiki Yoshida

发明人： Hirohisa Matsuki ,  Shigeki Harada ,  Masahiro Sugimoto ,  Toshiki Yoshida

IPC分类号： H01L23/055 ,  H01L23/367 ,  H01L23/498

CPC分类号： H01L23/3675 ,  H01L23/055 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2924/0002 ,  H01L2924/01079

摘要： A semiconductor device includes a semiconductor chip, a substrate for supporting the semiconductor chip, a plurality of terminals provided on the substrate for external connections, a plurality of lead wires provided on the semiconductor chip for connections to the terminals, and a multilevel interconnection structure for connecting the plurality of terminals to the plurality of lead wires on the semiconductor chip. The multilevel interconnection structure includes at least a lower conductor layer provided on the substrate and patterned into a plurality of pattern portions connected electrically to the terminals, an insulator layer provided on the lower conductor layer, and an upper conductor layer provided above the insulator layer. The upper conductor layer is formed with a connection area immediately below the lead wires on the semiconductor chip when the semiconductor chip is mounted on the substrate, the upper conductor layer is patterned in the connection area into a plurality of conductor strips extending parallel with each other in correspondence to the lead wires, the insulator layer is provided with contact holes so as to connect electrically the conductor strips of the upper conductor layer with the pattern portions of the lower conductor layer. In the semiconductor device, each of the pattern portions in the connection area has an edge extending obliquely to the conductor strips of the upper conductor layer wherein the pattern portions are disposed so that a pair of adjacent pattern portions have respective edges opposing with each other and extending parallel with each other with a lateral gap extending therebetween.

公开(公告)号：US5055914A

公开(公告)日：1991-10-08

申请号：US477404

申请日：1990-02-09

申请人： Nobutaka Shimizu ,  Takehisa Tsujimura ,  Masahiro Sugimoto ,  Shigeki Harada

发明人： Nobutaka Shimizu ,  Takehisa Tsujimura ,  Masahiro Sugimoto ,  Shigeki Harada

IPC分类号： H01L23/04 ,  H01L23/057 ,  H01L23/367 ,  H01L23/498

CPC分类号： H01L23/04 ,  H01L23/057 ,  H01L23/367 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/15312 ,  Y10T29/49144

摘要： A ceramic package type semiconductor device comprising: a ceramic substrate having a wiring pattern layer formed on a top surface thereof; at least one semiconductor element mounted on the ceramic substrate with a top face thereof facing downward and electrically connected to the wiring pattern layer; a metal cap having at least one through-hole corresponding to an external size of the semiconductor element and an end portion thereof soldered to the top surface of the ceramic substrate, so that a top surface of the metal cap and a bottom surface of the semiconductor element fitting into the through-hole form a flat plane: and a heatsink member comprising a plate portion which is soldered to the flat plane of the metal cap and the semiconductor element to complete a hermetic sealing of the semiconductor element.

公开(公告)号：US09235109B2

公开(公告)日：2016-01-12

申请号：US13501473

申请日：2010-10-18

申请人： Takahiko Yamamuro ,  Shigeki Harada

发明人： Takahiko Yamamuro ,  Shigeki Harada

IPC分类号： G05F1/00 ,  G03B21/20 ,  G09G3/34 ,  H05B33/08 ,  G09G3/20 ,  H01S5/042 ,  H01S5/0683 ,  H01S5/40

CPC分类号： G03B21/2033 ,  G03B21/2053 ,  G09G3/2014 ,  G09G3/3406 ,  G09G2310/0235 ,  G09G2310/066 ,  G09G2320/064 ,  G09G2330/02 ,  G09G2330/025 ,  G09G2360/145 ,  H01S5/0428 ,  H01S5/0683 ,  H01S5/4087 ,  H05B33/0818 ,  H05B33/0851

摘要： A switching power source for driving a light emitting element, a pulse-drive switching element connected in parallel to the light emitting element, a photodetector for detecting an intensity of an output light output from the light emitting element, a current detecting element for detecting a current flowing from the switching power source, and an operation processing unit that controls an operation of the switching power source by performing a feedback loop operation based on a detection result from the photodetector and a feedback loop operation based on a detection result from the current detecting element are provided to stabilize an emission waveform even when the light emitting element is subjected to a pulsed emission.

摘要翻译： 用于驱动发光元件的开关电源，与发光元件并联连接的脉冲驱动开关元件，用于检测从发光元件输出的输出光的强度的光电检测器，用于检测发光元件的电流检测元件 从开关电源流出的电流;以及操作处理单元，其通过基于来自光电检测器的检测结果执行反馈回路操作和基于来自电流检测的检测结果的反馈回路操作来控制开关电源的操作 即使当发光元件经受脉冲发射时，也提供了用于稳定发射波形的元件。

公开(公告)号：US20100177540A1

公开(公告)日：2010-07-15

申请号：US12715430

申请日：2010-03-02

申请人： Akihiko Iwata ,  Makoto Seto ,  Masaki Yamada ,  Shigeki Harada ,  Noriyuki Matsubara ,  Takashi Kumagai

发明人： Akihiko Iwata ,  Makoto Seto ,  Masaki Yamada ,  Shigeki Harada ,  Noriyuki Matsubara ,  Takashi Kumagai

IPC分类号： H02M7/48

CPC分类号： H02J3/383 ,  H02M7/483 ,  H02M2001/007 ,  H02M2001/0077 ,  Y02E10/563

摘要： In a power conversion apparatus that boosts a solar light voltage, converts it to AC and supplies AC power to a load or system, power loss is reduced and efficiency is improved. An inverter unit, in which AC sides of three single-phase inverters receive DC power from respective sources with a voltage ratio of 1:3:9 as respective inputs are connected in series. Gradational output voltage control of an output voltage is carried out using the sum of the respective generated AC voltages. Also, a solar light voltage is boosted by a chopper circuit to generate the highest voltage DC power source. When the solar light voltage exceeds a predetermined voltage, the boosting of the chopper circuit is stopped, thereby reducing power loss due to the boosting.

摘要翻译： 在提高太阳光电压的电力转换装置中，将其转换为交流电并向负载或系统提供AC电力，降低功率损耗并提高效率。 三相单相逆变器的AC侧以相互输入的电压比为1：3：9的各个电源的DC电源串联连接的逆变器单元。 使用各自产生的AC电压的和来执行输出电压的等级输出电压控制。 此外，太阳能光伏电压由斩波电路升压以产生最高电压的直流电源。 当太阳光电压超过预定电压时，斩波电路的升压停止，由此降低由于升压引起的功率损耗。

公开(公告)号：US07719865B2

公开(公告)日：2010-05-18

申请号：US11816456

申请日：2006-02-21

申请人： Akihiko Iwata ,  Makoto Seto ,  Masaki Yamada ,  Shigeki Harada ,  Noriyuki Matsubara ,  Takashi Kumagai

发明人： Akihiko Iwata ,  Makoto Seto ,  Masaki Yamada ,  Shigeki Harada ,  Noriyuki Matsubara ,  Takashi Kumagai

IPC分类号： H02M7/49

CPC分类号： H02J3/383 ,  H02M7/483 ,  H02M2001/007 ,  H02M2001/0077 ,  Y02E10/563

摘要： In a power conversion apparatus that boosts a solar light voltage, converts it to AC and supplies AC power to a load or system, power loss is reduced and efficiency is improved. An inverter unit, in which AC sides of three single-phase inverters receive DC power from respective sources with a voltage ratio of 1:3:9 as respective inputs are connected in series. Gradational output voltage control of an output voltage is carried out using the sum of the respective generated AC voltages. Also, a solar light voltage is boosted by a chopper circuit to generate the highest voltage DC power source. When the solar light voltage exceeds a predetermined voltage, the boosting of the chopper circuit is stopped, thereby reducing power loss due to the boosting.

摘要翻译： 在提高太阳光电压的电力转换装置中，将其转换为交流电并向负载或系统提供AC电力，降低功率损耗并提高效率。 三相单相逆变器的AC侧以相互输入的电压比为1：3：9的各个电源的DC电源串联连接的逆变器单元。 使用各自产生的AC电压的和来执行输出电压的等级输出电压控制。 此外，太阳能光伏电压由斩波电路升压以产生最高电压的直流电源。 当太阳光电压超过预定电压时，斩波电路的升压停止，由此降低由于升压引起的功率损耗。

公开(公告)号：US07602626B2

公开(公告)日：2009-10-13

申请号：US11816029

申请日：2006-02-21

申请人： Akihiko Iwata ,  Makoto Seto ,  Masaki Yamada ,  Shigeki Harada

发明人： Akihiko Iwata ,  Makoto Seto ,  Masaki Yamada ,  Shigeki Harada

IPC分类号： H02M7/00

CPC分类号： H02M7/53871 ,  H02M7/49 ,  H02M2001/0077 ,  Y10T307/685

摘要： In a power conversion apparatus that boosts a solar light voltage, converts it to AC and supplies AC power to a load or system, a second inverter is connected in series to one of two terminals on the AC side of a first inverter that uses, as its DC source, a DC voltage boosted from a solar light voltage by a chopper circuit. A third inverter is connected in series to the other terminal. Then, output voltages of the second and third inverters are controlled to be equal, and an output voltage is provided by using the sum of the generated voltages of the first, second, and third inverters. Thus, a mid-point potential of the DC power source is made equivalent to an intermediate potential of the output voltage of the power conversion apparatus, that is, the mid-point potential (ground potential) of a system.

摘要翻译： 在升压太阳光电压的电力转换装置中，将其转换为交流电并向负载或系统提供AC电力，第二逆变器串联连接到第一逆变器的AC侧的两个端子中的一个， 其直流电源，通过斩波电路从太阳光电压提升的直流电压。 第三个逆变器串联连接到另一个端子。 然后，将第二和第三变换器的输出电压控制为相等，并且通过使用第一，第二和第三逆变器的发电电压之和来提供输出电压。 因此，直流电源的中点电位等于电力转换装置的输出电压的中间电位，即系统的中点电位（地电位）。

公开(公告)号：US20060222672A1

公开(公告)日：2006-10-05

申请号：US11393036

申请日：2006-03-30

申请人： Tomohisa Ezaka ,  Shigeki Harada ,  Yukiya Sassa ,  Manabu Maeda ,  Takurou Kawaguchi

发明人： Tomohisa Ezaka ,  Shigeki Harada ,  Yukiya Sassa ,  Manabu Maeda ,  Takurou Kawaguchi

IPC分类号： A61L9/00 ,  A61M11/00

CPC分类号： A61L9/125 ,  B60H1/00742 ,  B60H3/0007 ,  B60H3/0028 ,  B60H3/0035 ,  B60H2003/0042

摘要： A gaseous constituent supply device supplies an air cannon projectile containing a predetermined gaseous constituent to an occupant in a compartment of a vehicle. This supply device includes a gaseous constituent supply chamber for reserving the gaseous constituent, an air compression unit for compressing an inside of the gaseous constituent supply chamber to generate an air cannon projectile including the gaseous constituent and to emit the air cannon projectile to an individual occupant, and a control unit that estimates an airflow state in the compartment and controls operation of the air compression means based on the estimated airflow state.

摘要翻译： 气体成分供给装置将含有预定气态成分的空气炮射弹向车辆的车厢内的乘员提供。 该供给装置包括用于保留气态成分的气态成分供给室，用于压缩气态成分供给室内部的空气压缩单元，以产生包含气态成分的空气炮射弹，并将空气炮射弹发射给个体乘员 以及控制单元，其基于所估计的气流状态来估计所述隔室中的气流状态并控制所述空气压缩装置的操作。