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    Optical module including silicon photonics chip and coupler chip
    42.
    发明授权
    Optical module including silicon photonics chip and coupler chip 有权

    公开(公告)号：US10466433B2

    公开(公告)日：2019-11-05

    申请号：US16016979

    申请日：2018-06-25

    Applicant: Samtec, Inc.

    Inventor： Marc Epitaux ,  Joshua R. Cornelius ,  John L. Nightingale

    IPC: G02B6/42 ,  G02B6/36 ,  G02B6/12 ,  G02B6/138 ,  G02B6/293 ,  G02B6/122 ,  G02B6/124

    Abstract: An optical module includes a Silicon Photonics chip that transports a light signal and a coupler chip that includes a waveguide and that is attached to the Silicon Photonics chip so that the light signal is transported along a light path between the Silicon Photonics chip and the coupler chip. The light path in the coupler chip includes a guided section that includes the waveguide that guides the light signal and an unguided section that does not guide the light signal in any other waveguide structure. The cross-sectional size of the beam defined by the light signal is largest at the interface between the Silicon Photonics chip and the coupler chip.

    Overmolded lead frame providing contact support and impedance matching properties
    43.
    发明授权
    Overmolded lead frame providing contact support and impedance matching properties 有权

    公开(公告)号：US10439330B2

    公开(公告)日：2019-10-08

    申请号：US15566504

    申请日：2017-06-15

    Applicant: Samtec, Inc.

    Inventor： John A. Mongold ,  Jonathan E. Buck

    IPC: H01R13/14 ,  H01R13/646 ,  H03H7/38 ,  H01R13/6477 ,  H01R13/514 ,  H01R12/72 ,  H01R13/41 ,  H01R13/631

    Abstract: An electrical connector includes first and second adjacent electrical contacts that each define respective first and second mating ends, the first mating end of a first one of the first and second adjacent electrical contacts defines a first contact surface, the second mating end of a second one of the first and second adjacent electrical contacts defines a second contact surface electrically isolated from the first contact surface; and a dielectric material positioned between the first and second adjacent electrical contacts. When a mating connector applies a force to the first contact surface and the second contact surface, the first and second mating ends and the dielectric material all move in a first direction.

    Rack-mountable equipment with a high-heat-dissipation module, and transceiver receptacle with increased cooling
    46.
    发明授权
    Rack-mountable equipment with a high-heat-dissipation module, and transceiver receptacle with increased cooling 有权

    公开(公告)号：US10114182B2

    公开(公告)日：2018-10-30

    申请号：US15261295

    申请日：2016-09-09

    Applicant: Samtec, Inc.

    Inventor： Eric J. Zbinden ,  Thomas A. Hall, III

    IPC: G02B6/42 ,  G02B6/38

    Abstract: An electrical connector includes a heat dissipation module with a first end and a second end opposed to the first end and two receptacle connectors located at the second end. The first and second ends define a transceiver-mating direction such that, when a transceiver is inserted into the first end of the heat dissipation module in the transceiver-mating direction, the transceiver mates with one of the two receptacle connectors, and in the heat dissipation module, air flows parallel to the transceiver-mating direction between the first and second ends and flows between the two receptacle connectors.

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