Abstract:
688,172. Soldering and brazing. USINE GENEVOISE DE DEGROSSISSAGE D'OR. April 13, 1951 [April 21, 1950], No. 8632/51. Class 83 (iv). A soldering device comprises a malleable bimetallic plate which at least partly surrounds the members to be soldered, the inner layer of which clamps the members and the outer layer of which has a substantially lower melting-point and forms the solder. The inner layer of the bimetallic plate may be of copper, brass, nickel or their alloys and the outer layer which may be applied by hot plating may be a lead tin or silver alloy. One layer may be galvanically deposited on the other layer. The plate may be in the form of an open channel with layers 2, 3, Fig. 1, with perforations 4 through the inner layer 2, Fig. 4, or with perforations 4 through both layers 2, 3, Fig. 8, or the plate may be in the form of a tube. The inner and outer surfaces of the plate may be coated with an oxidation resistant metal, e.g. tin or silver. Flux, e.g. resin or borax, may be deposited on both surfaces of the plate and in the holes 4. The channel or tube is placed about the members to be butted or lapped and clamped to them by pliers and heated by an iron, flame or highfrequency coil.
Abstract:
The invention relates to a process for welding electric conductors employing ultrasound following compaction. The process comprises compaction of the conductors in a compaction area by adjusting height and width up to a preset contact force and ultrasonically welding according to predetermined, stored parameters.
Abstract:
A method of producing an overhead contact wire for supplying power to electrically driven vehicles is proposed which comprises a copper-clad steel wire and a copper wire that is metallically joined to the copper-clad steel wire. The method includes the following steps: a) heating a steel wire to a temperature about 950.degree. C.; b) joining first and second metal band sections to a surface of the steel wire by means of rolling at a temperature of about 950.degree. C. under protective gas atmosphere to produce a combined element; c) reducing the cross-section of the combined element by at least 20%; d) heating a copper wire to a temperature about 950.degree. C.; e) joining the heated copper wire to the reduced diameter combined element in the area covered by the first band section by rolling at about 950.degree. C. under protective gas to produce a prepared wire; and f) reducing the cross-section of the prepared wire to produce an overhead contact wire.
Abstract:
Grid-shaped reinforcement strip is configured for reinforcing masonry joints, and includes at least one substantially straight elongated reinforcement wire having a substantially rectangularly cross section. There is a further reinforcement wire having a substantially rectangular cross section that is spaced apart from the at least one reinforcement wire. At least one connecting wire extends between opposed faces of such at least two spaced apart reinforcement wires. An unflattened weld attaches the at least one connecting wire to respective ones of opposed faces of such at least two reinforcement wires. The connecting wire preferably has a substantially round cross section, and the thickness of the at least one connecting wire is as thick or less thick than the thickness of the at least two reinforcement wires. The sizes and materials of such reinforcement wires and connecting wire may be selected so that the reinforcement wires have tensile strengths and load-carrying capacities greater than the tensile strength and load-carrying capacity of the connecting wire. In addition, the reinforcement strip may be made sufficiently flexible so that it may be rolled up into a roll for shipping and then unrolled into a substantially flat form when ready for use.
Abstract:
The terminal portion 83 of a contact 82 is of a groove type, with a larger diameter than the lead wire diameter, and includes small holes 84 drilled and installed in the bottom of the groove. By such a construction, when the solder 19 flows in between the terminal portion 83 and the lead wire by the surface tension, the air between the terminal portion 83 and the lead wire discharges through the small holes 84, thus preventing formation of an air layer between the terminal portion 83 and the lead wire. The holes 84 permit solder to enter the holes to discharge the air, but are sufficiently small to prevent solder from flowing therethrough and dripping out of the groove. By observing whether or not the solder has flowed into the small holes 84 it is possible to confirm whether the solder has entered the clearance between the lead wire and the terminal.