公开(公告)号：US20180318965A1

公开(公告)日：2018-11-08

申请号：US15956094

申请日：2018-04-18

Applicant: Via Mechanics, Ltd.

Inventor： Kaori TATEISHI ,  Yasushi ITO

IPC: B23K26/386 ,  B23K26/40 ,  C03C23/00 ,  C03C15/00

CPC classification number: B23K26/386 ,  B23K26/0622 ,  B23K26/18 ,  B23K26/384 ,  B23K26/40 ,  B23K26/402 ,  B23K2103/54 ,  C03B33/02 ,  C03C15/00 ,  C03C23/0025

Abstract: Provided is a laser processing method for drilling a hole in a glass substrate with using a carbon dioxide laser, including the steps of: irradiating the laser onto a drilling position on the glass substrate from a side of the glass substrate on which a protective sheet is adhered so as to form a blind hole; removing the protective sheet from the glass substrate and performing an annealing treatment; and performing a wet-etching process on a side of the glass substrate not irradiated with the laser so as to convert the blind hole into a through hole.

公开(公告)号：US09802855B2

公开(公告)日：2017-10-31

申请号：US14972352

申请日：2015-12-17

Applicant: CORNING INCORPORATED

Inventor： Heather Debra Boek ,  Robert Carl Burket ,  Daniel Ralph Harvey ,  Alexander Mikhailovich Streltsov

IPC: C03B33/08 ,  B23K26/386 ,  C03C15/02 ,  C03C15/00 ,  C03C23/00 ,  B23K26/382 ,  B23K26/384 ,  B23K26/40 ,  B23K26/402 ,  G02B6/122 ,  G02B6/136 ,  B23K103/00

CPC classification number: C03B33/082 ,  B23K26/382 ,  B23K26/384 ,  B23K26/386 ,  B23K26/389 ,  B23K26/40 ,  B23K26/402 ,  B23K2103/50 ,  C03C15/00 ,  C03C15/02 ,  C03C23/0025 ,  G02B6/1225 ,  G02B6/136

Abstract: A method of fabricating a high-density array of holes in glass is provided, comprising providing a glass piece having a front surface, then irradiating the front surface of the glass piece with a UV laser beam focused to a focal point within +/−100 μm of the front surface of the glass piece most desirably within +/−50 μm of the front surface. The lens focusing the laser has a numerical aperture desirably in the range of from 0.1 to 0.4, more desirably in the range of from 0.1 to 0.15 for glass thickness between 0.3 mm and 0.63 mm, even more desirably in the range of from 0.12 to 0.13, so as to produce open holes extending into the glass piece 100 from the front surface 102 of the glass piece, the holes having an diameter the in range of from 5 to 15 μm, and an aspect ratio of at least 20:1. For thinner glass, in the range of from 0.1-0.3 mm, the numerical aperture is desirably from 0.25 to 0.4, more desirably from 0.25 to 0.3, and the beam is preferably focused to within +/−30 μm of the front surface of the glass. The laser is desirable operated at a repetition rate of about 15 kHz or below. An array of holes thus produced may then be enlarged by etching. The front surface may be polished prior to etching, if desired.

公开(公告)号：US09724782B2

公开(公告)日：2017-08-08

申请号：US14211162

申请日：2014-03-14

Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.

Inventor： Mark A. Unrath

IPC: B23K26/03 ,  B23K26/08 ,  B23K26/38 ,  B23K26/386 ,  G02B26/10 ,  B23K26/082 ,  B23K26/0622 ,  B23K26/388

CPC classification number: B23K26/032 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/0853 ,  B23K26/38 ,  B23K26/386 ,  B23K26/388 ,  B23K26/389 ,  G02B26/101 ,  G02B26/105

Abstract: Laser systems and methods insert a settling time before and after each tooling action. A peak AOD excursion generally occurs at the transition in velocity between inter-feature moves and tooling moves. This transition occurs both before tooling (on the approach to the tooling location) and after tooling (on the departure from the completed tooling location to the next location). By adding a settling delay on each end of the tooling period, the AOD excursion is allowed to settle to a lower value. This then allows higher inter-tooling velocities (for high throughput) while keeping the AOD travel excursion within the bounds of the system's AOD configuration.

公开(公告)号：US09580851B2

公开(公告)日：2017-02-28

申请号：US14103347

申请日：2013-12-11

Applicant: Gordon Davies

Inventor： Gordon Davies

IPC: D05B93/00 ,  D05B37/00 ,  D05B61/00 ,  B23K26/40 ,  B23K26/38

CPC classification number: D05B93/00 ,  B23K26/386 ,  B23K26/389 ,  B23K26/40 ,  B23K2103/16 ,  B23K2103/172 ,  D05B37/00 ,  D05B61/00 ,  D05D2207/00 ,  D05D2209/16

Abstract: In at least one implementation, a method for forming openings for a stitched seam in a composite panel having an outer layer, and a substrate behind the outer layer includes providing a laser beam onto the substrate, with the laser beam forming an opening through the substrate but not through the outer layer, and moving at least one of the laser or the substrate relative to the other so that a new opening can be formed that is spaced from the already formed opening. Successive openings can be formed in desired locations around the panel to facilitate subsequent panel stitching. In at least some implementations, the laser may form such openings while stitches are formed in the panel, wherein a stitch is provided in a previous opening while or nearly at the same time the laser forms a different opening for a subsequent stitch.

Abstract translation: 在至少一个实施方案中，用于在具有外层的复合面板中形成用于缝合缝的开口的方法和在外层后面的衬底包括在激光束上形成穿过衬底的开口 而不是通过外层，并且相对于另一个移动至少一个激光器或基板，使得可以形成与已经形成的开口间隔开的新的开口。 可以在面板周围的期望位置形成连续的开口，以便于随后的面板拼接。 在至少一些实施方案中，激光器可以形成这样的开口，同时在面板中形成线迹，其中在先前的开口中设置线圈，或者几乎同时激光形成用于随后的针迹的不同的开口。

公开(公告)号：US20160158891A1

公开(公告)日：2016-06-09

申请号：US15013103

申请日：2016-02-02

Applicant: Disco Corporation

Inventor： Hiroshi Morikazu

IPC: B23K26/38 ,  B23K26/03 ,  B23K26/0622

CPC classification number: B23K26/032 ,  B23K26/0622 ,  B23K26/386 ,  B23K26/389 ,  B23K26/40 ,  B23K2103/172

Abstract: A laser processing method for forming a laser processed hole in a workpiece having a first member including a first material and a second member including a second material, the laser processed hole extending from the first member to the second member, the laser processing method including: applying a pulsed laser beam to the workpiece; using a plasma detecting means to detect the wavelength of plasma light generated by applying the pulsed laser beam to the workpiece; controlling, via a controller, a laser beam applying means according to a detection signal from the plasma detecting means; and stopping the application of the pulsed laser beam when both: (i) the light intensity detected by a first photodetector is decreased, and (ii) the light intensity detected by a second photodetector is increased to a peak value and next decreased to a given value that is slightly less than the peak value.

Abstract translation: 一种激光加工方法，用于在具有包括第一材料的第一构件和包括第二材料的第二构件的工件中形成激光加工孔，所述激光加工孔从所述第一构件延伸到所述第二构件，所述激光加工方法包括： 将脉冲激光束施加到工件; 使用等离子体检测装置来检测通过将脉冲激光束施加到工件而产生的等离子体光的波长; 根据来自等离子体检测装置的检测信号经由控制器控制激光束施加装置; 并且当两者同时停止施加脉冲激光束时：（i）由第一光电检测器检测到的光强度降低，并且（ii）由第二光电检测器检测到的光强度增加到峰值，然后下降到给定 值略小于峰值。

公开(公告)号：US20160102009A1

公开(公告)日：2016-04-14

申请号：US14972352

申请日：2015-12-17

Applicant: CORNING INCORPORATED

Inventor： Heather Debra Boek ,  Robert Carl Burket ,  Daniel Ralph Harvey ,  Alexander Mikhailovich Streltsov

IPC: C03B33/08 ,  C03C23/00 ,  B23K26/386 ,  C03C15/02

CPC classification number: C03B33/082 ,  B23K26/382 ,  B23K26/384 ,  B23K26/386 ,  B23K26/389 ,  B23K26/40 ,  B23K26/402 ,  B23K2103/50 ,  C03C15/00 ,  C03C15/02 ,  C03C23/0025 ,  G02B6/1225 ,  G02B6/136

Abstract: A method of fabricating a high-density array of holes in glass is provided, comprising providing a glass piece having a front surface, then irradiating the front surface of the glass piece with a UV laser beam focused to a focal point within +/−100 μm of the front surface of the glass piece most desirably within +/−50 μm of the front surface. The lens focusing the laser has a numerical aperture desirably in the range of from 0.1 to 0.4, more desirably in the range of from 0.1 to 0.15 for glass thickness between 0.3 mm and 0.63 mm, even more desirably in the range of from 0.12 to 0.13, so as to produce open holes extending into the glass piece 100 from the front surface 102 of the glass piece, the holes having an diameter the in range of from 5 to 15 μm, and an aspect ratio of at least 20:1. For thinner glass, in the range of from 0.1-0.3 mm, the numerical aperture is desirably from 0.25 to 0.4, more desirably from 0.25 to 0.3, and the beam is preferably focused to within +/−30 μm of the front surface of the glass. The laser is desirable operated at a repetition rate of about 15 kHz or below. An array of holes thus produced may then be enlarged by etching. The front surface may be polished prior to etching, if desired.

Abstract translation: 提供一种在玻璃中制造高密度孔阵列的方法，包括提供具有前表面的玻璃片，然后用聚焦在+/- 100内的焦点的UV激光束照射玻璃片的前表面 玻璃片的前表面的μm最理想地在前表面的+/-50μm内。 聚焦激光器的透镜的数值孔径希望在0.1至0.4的范围内，更优选在0.1至0.15的范围内，对于玻璃厚度在0.3mm至0.63mm之间，甚至更优选在0.12至0.13的范围内 从玻璃片的前表面102产生从玻璃片100延伸的露出孔，其直径在5至15μm，纵横比至少为20:1的孔中。 对于较薄的玻璃，在0.1-0.3mm的范围内，数值孔径期望地为0.25至0.4，更优选为0.25至0.3，并且该光束优选地聚焦在该光束的前表面的+/-30μm内 玻璃。 期望激光器以约15kHz或更低的重复率操作。 然后可以通过蚀刻来扩大由此产生的孔阵列。 如果需要，前表面可以在蚀刻之前被抛光。

公开(公告)号：US09278886B2

公开(公告)日：2016-03-08

申请号：US13989914

申请日：2011-11-30

Applicant: Heather Debra Boek ,  Robert Carl Burket ,  Daniel Ralph Harvey ,  Alexander Mikhailovich Streltsov

Inventor： Heather Debra Boek ,  Robert Carl Burket ,  Daniel Ralph Harvey ,  Alexander Mikhailovich Streltsov

IPC: B23K26/382 ,  C03C23/00 ,  B23K26/38 ,  B23K26/40 ,  C03C15/00 ,  G02B6/122 ,  G02B6/136

CPC classification number: C03B33/082 ,  B23K26/382 ,  B23K26/384 ,  B23K26/386 ,  B23K26/389 ,  B23K26/40 ,  B23K26/402 ,  B23K2103/50 ,  C03C15/00 ,  C03C15/02 ,  C03C23/0025 ,  G02B6/1225 ,  G02B6/136

Abstract: A method of fabricating a high-density array of holes in glass is provided, comprising providing a glass piece having a front surface, then irradiating the front surface of the glass piece with a UV laser beam focused to a focal point within +/−100 μm of the front surface of the glass piece most desirably within +/−50 μm of the front surface. The lens focusing the laser has a numerical aperture desirably in the range of from 0.1 to 0.4, more desirably in the range of from 0.1 to 0.15 for glass thickness between 0.3 mm and 0.63 mm, even more desirably in the range of from 0.12 to 0.13, so as to produce open holes extending into the glass piece 100 from the front surface 102 of the glass piece, the holes having an diameter the in range of from 5 to 15 μm, and an aspect ratio of at least 20:1. For thinner glass, in the range of from 0.1-0.3 mm, the numerical aperture is desirably from 0.25 to 0.4, more desirably from 0.25 to 0.3, and the beam is preferably focused to within +/−30 μm of the front surface of the glass. The laser is desirable operated at a repetition rate of about 15 kHz or below. An array of holes thus produced may then be enlarged by etching. The front surface may be polished prior to etching, if desired.

Abstract translation: 提供一种在玻璃中制造高密度孔阵列的方法，包括提供具有前表面的玻璃片，然后用聚焦在+/- 100内的焦点的UV激光束照射玻璃片的前表面 玻璃片的前表面的μm最理想地在前表面的+/-50μm内。 聚焦激光器的透镜的数值孔径希望在0.1至0.4的范围内，更优选在0.1至0.15的范围内，对于玻璃厚度在0.3mm至0.63mm之间，甚至更优选在0.12至0.13的范围内 从玻璃片的前表面102产生从玻璃片100延伸的露出孔，其直径在5至15μm，纵横比至少为20:1的孔中。 对于较薄的玻璃，在0.1-0.3mm的范围内，数值孔径期望地为0.25至0.4，更优选为0.25至0.3，并且该光束优选地聚焦在该光束的前表面的+/-30μm内 玻璃。 期望激光器以约15kHz或更低的重复率操作。 然后可以通过蚀刻来扩大由此产生的孔阵列。 如果需要，前表面可以在蚀刻之前被抛光。

公开(公告)号：US09168612B2

公开(公告)日：2015-10-27

申请号：US13015632

申请日：2011-01-28

Applicant: Lloyd Wilkiel ,  Neal Gregory Skinner ,  Timothy Holiman Hunter

Inventor： Lloyd Wilkiel ,  Neal Gregory Skinner ,  Timothy Holiman Hunter

IPC: E21C37/16 ,  B23K26/14 ,  B23K26/06 ,  B23K26/38 ,  E21B7/14 ,  B23K26/04

CPC classification number: B23K26/1476 ,  B23K26/042 ,  B23K26/0643 ,  B23K26/142 ,  B23K26/1438 ,  B23K26/382 ,  B23K26/386 ,  E21B7/14

Abstract: An apparatus for laser drilling including a laser beam emitter disposed within a housing having at least one laser beam outlet and at least one purge fluid outlet. At least one actuated nozzle is disposed within the housing for providing a purge fluid through the purge fluid outlet and having functional control for synchronized programmable activation patterns. Laser beam control is provided for directing a laser beam over a target surface.

Abstract translation: 一种用于激光钻孔的装置，包括设置在具有至少一个激光束出口​​和至少一个清洗流体出口的壳体内的激光束发射器。 至少一个致动喷嘴设置在壳体内，用于通过吹扫流体出口提供净化流体，并具有用于同步可编程激活模式的功能控制。 激光束控制被提供用于将激光束引导到目标表面上。

公开(公告)号：US20130313061A1

公开(公告)日：2013-11-28

申请号：US13959133

申请日：2013-08-05

Applicant: Schaeffler Technologies AG & Co. KG

Inventor： Martin Chambrion ,  Christoph Raber

IPC: F16D13/38

CPC classification number: F16D13/38 ,  B23K26/359 ,  B23K26/364 ,  B23K26/386 ,  B23K26/389 ,  B23K26/402 ,  B23K26/53 ,  B23K2103/34 ,  B23K2103/50 ,  F16D13/04 ,  F16D13/54 ,  B23K26/0087

Abstract: A clutch having a pre-clutch and a main clutch, where the pre-clutch can be brought to an engaged or a disengaged state by a tensioning means, the pre-clutch being connected to the main clutch by means of an operative connection in such a way that the disengaged position and the engaged position are transmitted to the main clutch, and where the tensioning means is supported on a clutch basket of the main clutch.

Abstract translation: 具有预离合器和主离合器的离合器，其中预离合器可以通过张紧装置进入接合或分离状态，前离合器通过这样的操作连接连接到主离合器 将分离位置和接合位置传递到主离合器的方式，并且其中张紧装置支撑在主离合器的离合器篮上。

公开(公告)号：US20050160597A1

公开(公告)日：2005-07-28

申请号：US10983656

申请日：2004-11-09

Applicant: Hiroichi Hase

Inventor： Hiroichi Hase

IPC: B23K26/00 ,  B23D31/00 ,  B23K26/04 ,  B23K26/38 ,  B23P19/00 ,  B23P19/02

CPC classification number: F16C9/045 ,  B23D31/003 ,  B23K26/0665 ,  B23K26/083 ,  B23K26/0869 ,  B23K26/14 ,  B23K26/386 ,  B23K26/389 ,  B23K2101/006 ,  Y10T29/49288 ,  Y10T29/4979 ,  Y10T29/49796 ,  Y10T29/49821 ,  Y10T29/49824

Abstract: This is a method of forming a fracture start portion of a ductile metal part on an inner circumferential face of a through hole by irradiating laser to an opposing position of the inner circumferential face of the thorough hole of the ductile metal part having a predetermined through hole and by forming a large number of recess portions separated with a predetermined distance at a predetermined interval from one opening to the other opening of the through hole, in which a recess part is formed, instead of by focusing the laser exactly onto the inner circumferential face of the through hole, by irradiating it onto the inner circumferential face of the through hole while defocusing from the inner circumferential face of the through hole by a predetermined amount as well as by supplying an assist gas to a position of the laser irradiation, and the laser is moved linearly at a predetermined speed from one side opening to the other side opening on the inner circumferential face of the through hole while irradiating the laser onto the inner circumferential face of the through hole at a predetermined pulse.

Abstract translation: 这是通过在具有预定通孔的延性金属部分的通孔的内周面的相对位置照射激光来在通孔的内周面上形成延性金属部分的断裂起始部分的方法 并且通过形成大量的凹部，其以形成有凹部的通孔的一个开口至另一个开口以预定间隔隔开预定距离，而不是将激光精确地聚焦到内周面上 的通孔，通过在通孔的内周面上照射预定量，并且通过向激光照射的位置提供辅助气体而将其照射到通孔的内周面上，并且 激光以预定速度从一侧开口直线移动到另一侧开口的内周面上 gh孔，同时以预定脉冲将激光照射到通孔的内周面上。