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公开(公告)号：US09745220B2
公开(公告)日：2017-08-29
申请号：US14899602
申请日：2014-06-20
Applicant: Corning Incorporated
CPC classification number: C03C15/00
Abstract: A method etching a glass material comprises providing an etchant comprising 10-30% HF, 5-15% HNO3,and at least 10% H3PO4 by volume constituted such that the ratio HF:HNO3 by volume is in the range of 1.7:1 to 2.3:1, providing a glass material to be etched, and contacting the glass material with the etchant. The etchant desirably has no other acid components. The method may be performed with the etchant temperature within the range of 20-30° C. The glass material may be an aluminosilicate glass. Ultrasound energy may be applied to the etchant, to the glass material, or both.
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公开(公告)号：US09296646B2
公开(公告)日：2016-03-29
申请号：US14464851
申请日：2014-08-21
Applicant: CORNING INCORPORATED
Inventor： Robert Carl Burket , Uta-Barbara Goers , Samuel Odei Owusu , Tammy Lynn Petriwsky
CPC classification number: C03C15/00 , B23K26/302 , B23K26/362 , B23K26/364 , B23K26/382 , B23K26/384 , B23K26/402 , B23K26/55 , B23K2103/54 , C03B33/0222 , C03C23/00 , C03C23/0025 , C03C2218/34 , H05K1/0306 , H05K3/0017 , H05K3/002 , H05K3/0029 , H05K2203/0285
Abstract: Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.
Abstract translation: 公开了通过激光钻孔和酸蚀刻在玻璃基板中形成通孔的方法。 在一个实施例中，在玻璃基板中形成通孔的方法包括从玻璃基板的入射表面激光穿过玻璃基板的厚度的至少一部分。 该方法还包括在蚀刻持续时间的至少一部分期间蚀刻玻璃基板以蚀刻持续时间以增加通孔的入射开口的直径并向玻璃基板施加超声波能量。 所应用的超声波能量的频率在40 kHz到192 kHz之间。
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3.发明申请公开(公告)号：US20190119150A1
公开(公告)日：2019-04-25
申请号：US16162644
申请日：2018-10-17
Applicant: CORNING INCORPORATED
Inventor： Robert Carl Burket , Daniel Wayne Levesque, JR. , Sasha Marjanovic , Garrett Andrew Piech , Heather Nicole Vanselous , Kristopher Allen Wieland
Abstract: A method for processing a transparent workpiece includes forming a closed contour line having a plurality of defects in the transparent workpiece such that the closed contour line defines a closed contour. Forming the closed contour line includes directing a pulsed laser beam through an aspheric optical element and into the transparent workpiece such that a portion of the pulsed laser beam directed into the transparent workpiece generates an induced absorption within the transparent workpiece, the induced absorption producing a defect within the transparent workpiece, and translating the transparent workpiece and the pulsed laser beam relative to each other along the closed contour line. The method further includes etching the transparent workpiece with a chemical etching solution at an etching rate of about 2.5 μm/min or less to separate a portion of the transparent workpiece along the closed contour line, thereby forming an aperture extending through the transparent workpiece, the aperture comprising an aperture perimeter extending along the closed contour.
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Patent Agency Ranking
公开(公告)号：US09656909B2
公开(公告)日：2017-05-23
申请号：US14972284
申请日：2015-12-17
Applicant: CORNING INCORPORATED
Inventor： Robert Carl Burket , Uta-Barbara Goers , Samuel Odei Owusu , Tammy Lynn Petriwsky
IPC: C03C15/00 , H05K1/03 , H05K3/00 , B23K26/00 , C03C23/00 , B23K26/384 , B23K26/362 , B23K26/302 , B23K26/364 , C03B33/02
CPC classification number: C03C15/00 , B23K26/302 , B23K26/362 , B23K26/364 , B23K26/382 , B23K26/384 , B23K26/402 , B23K26/55 , B23K2103/54 , C03B33/0222 , C03C23/00 , C03C23/0025 , C03C2218/34 , H05K1/0306 , H05K3/0017 , H05K3/002 , H05K3/0029 , H05K2203/0285
Abstract: Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.
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公开(公告)号：US20160145149A1
公开(公告)日：2016-05-26
申请号：US14899602
申请日：2014-06-20
Applicant: Corning Incorporated
IPC: C03C15/00
CPC classification number: C03C15/00
Abstract: A method etching a glass material comprises providing an etchant comprising 10-30% HF, 5-15% HNO3, and at least 10% H3PO4 by volume constituted such that the ratio HF:HNO3 by volume is in the range of 1.7:1 to 2.3:1, providing a glass material to be etched, and contacting the glass material with the etchant. The etchant desirably has no other acid components. The method may be performed with the etchant temperature within the range of 20-30° C. The glass material may be an aluminosilicate glass. Ultrasound energy may be applied to the etchant, to the glass material, or both.
Abstract translation: 蚀刻玻璃材料的方法包括提供包括10-30％HF，5-15％HNO3和至少10％H 3 PO 4的蚀刻剂，其体积构成为使得HF:HNO 3的比例在1.7:1至 2.3：1，提供待蚀刻的玻璃材料，并使玻璃材料与蚀刻剂接触。 蚀刻剂理想地不具有其它酸成分。 该方法可以用蚀刻剂温度在20-30℃的范围内进行。玻璃材料可以是铝硅酸盐玻璃。 超声能量可以施加到蚀刻剂，玻璃材料或两者。
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公开(公告)号：US20160107925A1
公开(公告)日：2016-04-21
申请号：US14972284
申请日：2015-12-17
Applicant: CORNING INCORPORATED
Inventor： Robert Carl Burket , Uta-Barbara Goers , Samuel Odei Owusu , Tammy Lynn Petriwisky
IPC: C03C15/00
CPC classification number: C03C15/00 , B23K26/302 , B23K26/362 , B23K26/364 , B23K26/382 , B23K26/384 , B23K26/402 , B23K26/55 , B23K2103/54 , C03B33/0222 , C03C23/00 , C03C23/0025 , C03C2218/34 , H05K1/0306 , H05K3/0017 , H05K3/002 , H05K3/0029 , H05K2203/0285
Abstract: Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.
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公开(公告)号：US09802855B2
公开(公告)日：2017-10-31
申请号：US14972352
申请日：2015-12-17
Applicant: CORNING INCORPORATED
Inventor： Heather Debra Boek , Robert Carl Burket , Daniel Ralph Harvey , Alexander Mikhailovich Streltsov
IPC: C03B33/08 , B23K26/386 , C03C15/02 , C03C15/00 , C03C23/00 , B23K26/382 , B23K26/384 , B23K26/40 , B23K26/402 , G02B6/122 , G02B6/136 , B23K103/00
CPC classification number: C03B33/082 , B23K26/382 , B23K26/384 , B23K26/386 , B23K26/389 , B23K26/40 , B23K26/402 , B23K2103/50 , C03C15/00 , C03C15/02 , C03C23/0025 , G02B6/1225 , G02B6/136
Abstract: A method of fabricating a high-density array of holes in glass is provided, comprising providing a glass piece having a front surface, then irradiating the front surface of the glass piece with a UV laser beam focused to a focal point within +/−100 μm of the front surface of the glass piece most desirably within +/−50 μm of the front surface. The lens focusing the laser has a numerical aperture desirably in the range of from 0.1 to 0.4, more desirably in the range of from 0.1 to 0.15 for glass thickness between 0.3 mm and 0.63 mm, even more desirably in the range of from 0.12 to 0.13, so as to produce open holes extending into the glass piece 100 from the front surface 102 of the glass piece, the holes having an diameter the in range of from 5 to 15 μm, and an aspect ratio of at least 20:1. For thinner glass, in the range of from 0.1-0.3 mm, the numerical aperture is desirably from 0.25 to 0.4, more desirably from 0.25 to 0.3, and the beam is preferably focused to within +/−30 μm of the front surface of the glass. The laser is desirable operated at a repetition rate of about 15 kHz or below. An array of holes thus produced may then be enlarged by etching. The front surface may be polished prior to etching, if desired.
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公开(公告)号：US20160102009A1
公开(公告)日：2016-04-14
申请号：US14972352
申请日：2015-12-17
Applicant: CORNING INCORPORATED
Inventor： Heather Debra Boek , Robert Carl Burket , Daniel Ralph Harvey , Alexander Mikhailovich Streltsov
IPC: C03B33/08 , C03C23/00 , B23K26/386 , C03C15/02
CPC classification number: C03B33/082 , B23K26/382 , B23K26/384 , B23K26/386 , B23K26/389 , B23K26/40 , B23K26/402 , B23K2103/50 , C03C15/00 , C03C15/02 , C03C23/0025 , G02B6/1225 , G02B6/136
Abstract: A method of fabricating a high-density array of holes in glass is provided, comprising providing a glass piece having a front surface, then irradiating the front surface of the glass piece with a UV laser beam focused to a focal point within +/−100 μm of the front surface of the glass piece most desirably within +/−50 μm of the front surface. The lens focusing the laser has a numerical aperture desirably in the range of from 0.1 to 0.4, more desirably in the range of from 0.1 to 0.15 for glass thickness between 0.3 mm and 0.63 mm, even more desirably in the range of from 0.12 to 0.13, so as to produce open holes extending into the glass piece 100 from the front surface 102 of the glass piece, the holes having an diameter the in range of from 5 to 15 μm, and an aspect ratio of at least 20:1. For thinner glass, in the range of from 0.1-0.3 mm, the numerical aperture is desirably from 0.25 to 0.4, more desirably from 0.25 to 0.3, and the beam is preferably focused to within +/−30 μm of the front surface of the glass. The laser is desirable operated at a repetition rate of about 15 kHz or below. An array of holes thus produced may then be enlarged by etching. The front surface may be polished prior to etching, if desired.
Abstract translation: 提供一种在玻璃中制造高密度孔阵列的方法，包括提供具有前表面的玻璃片，然后用聚焦在+/- 100内的焦点的UV激光束照射玻璃片的前表面 玻璃片的前表面的μm最理想地在前表面的+/-50μm内。 聚焦激光器的透镜的数值孔径希望在0.1至0.4的范围内，更优选在0.1至0.15的范围内，对于玻璃厚度在0.3mm至0.63mm之间，甚至更优选在0.12至0.13的范围内 从玻璃片的前表面102产生从玻璃片100延伸的露出孔，其直径在5至15μm，纵横比至少为20:1的孔中。 对于较薄的玻璃，在0.1-0.3mm的范围内，数值孔径期望地为0.25至0.4，更优选为0.25至0.3，并且该光束优选地聚焦在该光束的前表面的+/-30μm内 玻璃。 期望激光器以约15kHz或更低的重复率操作。 然后可以通过蚀刻来扩大由此产生的孔阵列。 如果需要，前表面可以在蚀刻之前被抛光。
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