公开(公告)号：US07549600B2

公开(公告)日：2009-06-23

申请号：US11238854

申请日：2005-09-29

申请人： Karl Hesse ,  Franz Schreieder

发明人： Karl Hesse ,  Franz Schreieder

IPC分类号： B02C17/02

CPC分类号： C01B33/02 ,  B02C1/10 ,  B02C2/00 ,  B02C4/305 ,  B28D5/0029

摘要： A crusher for producing fine silicon fragments for semiconductor or solar applications from silicon fragments suitable for semiconductor or solar applications, comprises a plurality of crushing tools, the crushing tools having a surface made from a hard, wear-resistant material, wherein the crusher has a comminution ratio e of from 1.5 to 3.

摘要翻译： 一种用于从半导体或太阳能应用的硅碎片产生用于半导体或太阳能应用的精细硅碎片的破碎机包括多个破碎工具，所述破碎工具具有由硬的耐磨材料制成的表面，其中所述破碎机具有 粉碎比e从1.5到3。

公开(公告)号：US20090075458A1

公开(公告)日：2009-03-19

申请号：US12186994

申请日：2008-08-06

申请人： Masaru Nakamura

发明人： Masaru Nakamura

IPC分类号： H01L21/304

CPC分类号： H01L21/67132 ,  B28D5/0011 ,  B28D5/0029 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2224/274 ,  H01L2224/2919 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/3512

摘要： A method of manufacturing a device, including: an adhesive film attaching step of attaching an adhesive film to a back-side surface of a wafer in which devices are formed respectively in a plurality of regions demarcated by planned dividing lines formed in a grid pattern in a face-side surface of the wafer; a wafer supporting step of adhering the adhesive film side of the wafer with the adhesive film attached thereto to a surface of a dicing tape attached to an annular frame; a wafer cutting step of holding the dicing tape side of the wafer adhered to the surface of the dicing tape onto a chuck table of a cutting apparatus, and cutting the wafer along the planned dividing lines by use of a cutting blade having an annular knife edge which is V-shaped in sectional shape of a peripheral part thereof; and an adhesive film breaking step of breaking said adhesive film along cutting grooves formed in the wafer, by expanding the dicing tape so as to exert tension on the adhesive film, after the wafer cutting step is performed.

摘要翻译： 一种制造装置的方法，包括：粘合剂膜附着步骤，其将粘合膜附着到其中装置的晶片的背面分别形成在由栅格图案形成的计划分割线划分的多个区域中 晶片的面侧表面; 晶片支撑步骤，将附着有粘合剂膜的晶片的粘合膜侧粘附到附接到环形框架的切割带的表面; 晶片切割步骤，将粘附到切割带表面的晶片的切割带侧保持在切割装置的卡盘台上，并且通过使用具有环形刀刃的切割刀沿着预定分割线切割晶片 其周边部分的截面形状为V形; 以及通过在执行晶片切割步骤之后通过扩大切割带以使粘合剂膜发生张力而将形成在晶片上的切割槽断开所述粘合剂膜的粘合膜断裂步骤。

公开(公告)号：US07439665B2

公开(公告)日：2008-10-21

申请号：US10483125

申请日：2002-07-12

申请人： Haruo Wakayama

发明人： Haruo Wakayama

IPC分类号： H01J1/62 ,  H01J63/04 ,  H01J9/00

CPC分类号： C03B33/076 ,  B28D5/0011 ,  B28D5/0023 ,  B28D5/0029 ,  B28D5/0052 ,  C03B33/033 ,  G02F1/133351 ,  Y02P40/57

摘要： In a flat display panel wherein two plates made of a brittle material are adhered to each other, at least one of the two plates has a plane on which a scribing line is formed, and the plane of the at least one of the plates on which a scribing line is formed is opposed to a plane of the other of the at least one of the two plates on which no scribing line is formed. In one case, the two plates have planes on which scribing is performed, while in another case, only one of the two plates has a plane on which scribing is performed. In the latter case, scribing may be performed on the other of the two plates after the two plates are adhered.

摘要翻译： 在由脆性材料制成的两个板彼此粘合的平板显示面板中，两个板中的至少一个板具有其上形成划线的平面，并且其上至少一个板的平面 形成划线，与没有划线的两个板中的至少一个的另一个的平面相对。 在一种情况下，两个板具有在其上进行划线的平面，而在另一种情况下，两个板中只有一个具有进行划线的平面。 在后一种情况下，可以在两个板粘附之后在两个板中的另一个上进行划线。

公开(公告)号：US4995539A

公开(公告)日：1991-02-26

申请号：US406943

申请日：1989-09-13

申请人： Heinz Richard

发明人： Heinz Richard

IPC分类号： B26F3/00 ,  B28D5/00 ,  H01L21/301 ,  H01L21/304

CPC分类号： B26F3/002 ,  B28D5/0029 ,  B28D5/0052 ,  H01L21/304 ,  Y10T225/12 ,  Y10T225/325 ,  Y10T225/371 ,  Y10T225/386

摘要： A method and apparatus for breaking a scribed workpiece such as a semiconductor wafer is taught. Briefly stated, the semiconductor wafer is disposed between two elastomeric foils, one of which is adhesively attached to the side of the workpiece which is not scribed. The foils are stretched and a force is then applied to the sandwich so that the workpiece breaks along the scribed lines. Due to the elastomeric nature of the foils the broken pieces separate slightly and remain separated after breaking, thereby preventing damage to adjacent surfaces of the workpiece.

公开(公告)号：US4369567A

公开(公告)日：1983-01-25

申请号：US185842

申请日：1980-09-10

申请人： Gerrit Bosch ,  Arnoldus W. Kok ,  Harmen Giethoorn

发明人： Gerrit Bosch ,  Arnoldus W. Kok ,  Harmen Giethoorn

IPC分类号： B28D5/00 ,  H01F7/02 ,  H01F41/02 ,  B65B61/24 ,  B26F3/00 ,  H01F7/00

CPC分类号： H01F41/0273 ,  B28D5/0029 ,  B28D5/0052 ,  H01F7/0221 ,  Y10T225/329 ,  Y10T29/49075 ,  Y10T29/49789

摘要： A method of manufacturing a plate-shaped permanent magnet (7) which is to be arranged in an air gap of a core (1) for a transformer or choke coil and which consists of a number of permanent magnetic portions (29) which are made of a metal alloy having a high magnetic remanence and which are magnetized perpendicularly to the plane of the plate. A plate (11) of the alloy is fixed between two insulating foils (13, 15) after which this assembly is arranged on a flat backing (17) and is rolled in two mutually perpendicular directions (25, 27) by means of a cylinder (19) whose outer surface is provided with grooves (23). The plate (11) is thus very simply fractured to form a very large number of portions (29).

摘要翻译： 一种制造板状永磁体（7）的方法，该板状永久磁铁（7）将被布置在用于变压器或扼流线圈的铁芯（1）的气隙中，并且由多个永久磁性部分（29）构成 的具有高磁残余的金属合金，并且被垂直于板的平面磁化。 合金的板（11）固定在两个绝缘箔（13,15）之间，之后该组件布置在平的背衬（17）上，并且通过圆柱体在两个相互垂直的方向（25,27）上滚动 （19），其外表面设有凹槽（23）。 因此，板（11）非常简单地断裂以形成非常多的部分（29）。

公开(公告)号：US4044937A

公开(公告)日：1977-08-30

申请号：US624632

申请日：1975-10-21

申请人： Thomas Hill ,  Ambrose Kennedy ,  Walter Grey Thomson

发明人： Thomas Hill ,  Ambrose Kennedy ,  Walter Grey Thomson

IPC分类号： B28D5/00 ,  H01L21/301 ,  B26F3/00

CPC分类号： B28D5/0029 ,  Y10T225/325 ,  Y10T225/329

摘要： An apparatus is disclosed for breaking apart, pre-scribed chips in a semiconductor wafer. The apparatus comprises a plurality of ball elements having a diameter substantially smaller than the diameter of the wafer, mounted in a support beneath the contacting plane. Located above and in spaced coaxial relationship with the ball elements is a plurality of purging gas/vacuum ports. The pre-scribed semiconductor wafer is mounted on an elastic film by means of an adhesive coating thereon.The wafer, so mounted, is attached to a sliding carriage disposed so as to permit the wafer to freely move within said contacting plane. When the wafer is disposed in said contacting plane, the support for said ball element is raised into contact with the wafer. The relatively small radius of curvature of the ball elements induces a relatively large bending moment and consequently breaks the chip in the wafer along the pre-scribed lines. Omni-directional motion of the carriage causes all portions of the wafer to be brought in to contact with the ball elements, thereby inducing total separation along all pre-scribed lines. The purging gas/vacuum ports located respectively above each ball element, serve to remove debris from the broken regions of the wafer.

摘要翻译： 公开了一种用于在半导体晶片中分离，预先划线的芯片的装置。 该装置包括多个球形元件，其直径基本上小于晶片的直径，安装在接触平面下方的支撑件中。 位于与球元件之间并与之隔开的同轴关系是多个吹扫气体/真空端口。 预先划线的半导体晶片通过其上的粘合剂涂层安装在弹性膜上。

公开(公告)号：US3870196A

公开(公告)日：1975-03-11

申请号：US40194073

申请日：1973-09-28

申请人： LAURIER ASSOCIATES INC

发明人： HARGRAVES DON

IPC分类号： B28D5/00 ,  H01L21/301 ,  B26F3/00

CPC分类号： B28D5/0029 ,  B28D5/0052 ,  Y10T225/10 ,  Y10T225/371

摘要： A semiconductor wafer having crossing sets of parallel grooves in one face is broken into dice by placing the wafer with its scribed face down on a sheet of stretchable material to which the wafer adheres. A resilient mat is disposed under the stretchable sheet. A roller is moved over the upper face of the wafer and applies pressure along the grooves to break the wafer into strips. The sheet is then stretched to move the strips apart while keeping the scribed grooves in alignment. The roller then passes over the strips and applies pressure along the aligned scribed grooves which causes the strips to be broken into dice.

摘要翻译： 通过将晶片的划线面朝下放置在晶片附着的可拉伸材料片上，将具有一个面中的平行槽交叉组的半导体晶片分成多个骰子。 弹性垫设置在可拉伸片材的下方。 将辊子移动到晶片的上表面上并且沿着凹槽施加压力以将晶片破碎成条带。 然后将片材拉伸以使条带分开，同时保持划线槽对准。 然后，辊经过条带并沿着对准的划线槽施加压力，这导致条被破碎成骰子。

公开(公告)号：US3587955A

公开(公告)日：1971-06-28

申请号：US3587955D

申请日：1969-07-22

申请人： AIME ALBERT GEHRI

发明人： GEHRI AIME ALBERT

IPC分类号： B28D5/00 ,  B26F3/00

CPC分类号： H01L21/67092 ,  B28D5/0029 ,  Y10T225/30 ,  Y10T225/321 ,  Y10T225/371

摘要： A MEANS FOR BREAKING A SEMICONDUCTOR WAFER THAT HAS BEEN SCORED INTO A PLURALITY OF INDIVIDUAL DICE CONSISTING OF A ROLLER MOUNTED ON A LONGITUDINALLY EXTENDING SHAFT ADAPTED TO ROLL OVER A SANDWICH CONTAINING A SCORED WAFER AND A FLEXIBLE BAND OF METAL LONGITUDINALLY TENSIONED AND POSITIONED IN ALIGNMENT WITH AND BELOW THE SHAFT.

公开(公告)号：US3578227A

公开(公告)日：1971-05-11

申请号：US3578227D

申请日：1969-10-01

申请人： TRANSITRON ELECTRONIC CORP

发明人： GEHRI AIME A

IPC分类号： H01L21/301 ,  H01L21/304 ,  B26F3/00

CPC分类号： H01L21/67092 ,  B28D5/0011 ,  B28D5/0029 ,  B28D5/0052 ,  H01L21/3043 ,  Y10T225/12 ,  Y10T225/371

摘要： A means for breaking a semiconductor wafer that has been scored into a plurality of individual dice consisting of a roller mounted on a longitudinally extending shaft adapted to roll over a sandwich containing a scored wafer and a flexible band of metal longitudinally tensioned and positioned in alignment with and below the shaft.

公开(公告)号：US3542266A

公开(公告)日：1970-11-24

申请号：US3542266D

申请日：1968-04-01

申请人： SIEMENS AG

发明人： WOELFLE RUDOLF

IPC分类号： B28D5/00 ,  H01L21/304 ,  B26F3/00

CPC分类号： H01L21/3043 ,  B28D5/0011 ,  B28D5/0029 ,  Y10T29/4979 ,  Y10T225/12