公开(公告)号：US2917873A

公开(公告)日：1959-12-22

申请号：US75048558

申请日：1958-07-23

申请人： TRANSITRON ELECTRONIC CORP

发明人： JEWETT PHILIP D

IPC分类号： B28D5/02

CPC分类号： B28D5/023

公开(公告)号：US20180286757A1

公开(公告)日：2018-10-04

申请号：US15941131

申请日：2018-03-30

申请人： DISCO CORPORATION

发明人： Kenji Takenouchi

IPC分类号： H01L21/78 ,  B28D5/00 ,  B28D5/02

CPC分类号： H01L21/78 ,  B28D5/0076 ,  B28D5/0094 ,  B28D5/023 ,  H01L21/67092

摘要： A method of processing a plate-shaped workpiece that includes layered bodies containing metal which are formed in superposed relation to projected dicing lines, includes the steps of holding the workpiece on a holding table, and thereafter, cutting the workpiece along the projected dicing lines with an annular cutting blade, thereby separating the layered bodies. The cutting blade has a slit which is open at an outer peripheral edge thereof. The step of cutting the workpiece includes the step of cutting the workpiece while supplying a cutting fluid containing an organic acid and an oxidizing agent to the workpiece.

公开(公告)号：US20180044220A1

公开(公告)日：2018-02-15

申请号：US15549654

申请日：2016-05-26

申请人： BANDO KIKO CO., LTD.

发明人： Kazuaki BANDO

IPC分类号： C03B33/03 ,  G05B19/4093 ,  B28D5/02 ,  B65G49/06 ,  C03B33/037 ,  C03B33/027

CPC分类号： C03B33/03 ,  B28D1/22 ,  B28D5/023 ,  B65G49/064 ,  B65G2249/04 ,  B65G2249/045 ,  C03B33/027 ,  C03B33/037 ,  G05B19/401 ,  G05B19/40932 ,  G05B2219/50033

摘要： A cut-out glass plate positioning apparatus includes: a cut line forming device 4 provided in a cut line forming position 4a; a bend-breaking and separating device 6 for cutting out unworked plate glasses 5 from an unworked plate glass 2 along the cut lines 3; a pair of position and angle correcting devices 8 for effecting correction of the position and angle with respect to the unworked plate glass 5; a pair of sucking and transporting devices 9 for suckingly lifting and transporting the unworked plate glass 5 to each position and angle correcting device 8; and two CCD cameras 10 respectively installed above the position and angle correcting devices 8.

公开(公告)号：US09653366B2

公开(公告)日：2017-05-16

申请号：US15080919

申请日：2016-03-25

申请人： DISCO CORPORATION

发明人： Satoshi Miyata ,  Makoto Tanaka ,  Sombat Chanvilai

IPC分类号： H01L21/304 ,  H01L21/66 ,  H01L21/78 ,  H01L21/683 ,  H01L21/67

CPC分类号： H01L22/20 ,  B28D5/0064 ,  B28D5/023 ,  H01L21/67092 ,  H01L21/6836 ,  H01L21/78 ,  H01L22/12 ,  H01L2221/68327

摘要： Disclosed herein is a method of dividing a wafer including an exposed area incising step of lowering a cutting blade to a preset lowered position for fully severing the wafer to cause the cutting blade to incise an exposed area of a wafer unit, an image capturing step of capturing an image of the exposed area which the cutting blade has incised in the exposed area incising step, with image capturing means, a determining step of determining whether or not it is possible to fully sever the wafer on the basis of the captured image in the image capturing step, and an adjusting step of increasing a distance by which to lower the cutting blade if it is determined that it is impossible to fully sever the wafer in the determining step.

公开(公告)号：US20070259483A1

公开(公告)日：2007-11-08

申请号：US11574392

申请日：2004-08-31

申请人： Yong-Goo Lee

发明人： Yong-Goo Lee

IPC分类号： H01L21/78

CPC分类号： B28D5/023 ,  B28D5/0082 ,  B28D5/024

摘要： Disclosed is a sawing apparatus for manufacturing a semiconductor package, capable of simultaneously performing strip loading work and package unloading work during the sawing process to improve productivity of the semiconductor packages. The sawing apparatus includes a chuck table base 200; a chuck table 23 installed on the chuck table base 200 such that the chuck table 23 horizontally moves on the chuck table base 200; two chuck plates 233a and 233b rotatably installed on the chuck table 23 such that a strip S is loaded on upper surfaces of the chuck plates 233a and 233b by turns; a sawing machine 30 for dividing the strip S loaded on the chuck plate into individual packages P by performing a relative movement with respect to the chuck table 23; and a strip/package picker 22 for loading the strip S onto the chuck plates and unloading the packages P from the chuck plates,

摘要翻译： 公开了一种用于制造半导体封装的锯切装置，其能够在锯切过程期间同时执行带材加载工作和封装卸载工作，以提高半导体封装的生产率。 锯切装置包括卡盘台基座200; 安装在卡盘台座200上的卡盘台23，使得卡盘台23在卡盘台基座200上水平移动; 两个夹盘233a和233b可旋转地安装在卡盘台23上，使得条S被轮流装载在卡盘233a和233b的上表面上; 锯床30，用于通过相对于卡盘台23的相对运动将装载在卡盘板上的条S分成单个包装件P; 以及条带/包装拾取器22，用于将条带S装载到卡盘板上并从夹盘卸载包装件P，

公开(公告)号：US20060112802A1

公开(公告)日：2006-06-01

申请号：US11287190

申请日：2005-11-28

申请人： Koichi Fujinami

发明人： Koichi Fujinami

IPC分类号： B26D1/56

CPC分类号： B28D5/023 ,  B28D5/024 ,  B28D5/029 ,  Y10T83/4734

摘要： A cutting machine comprising a chuck table for holding a workpiece, which is arranged such that it can move along a guide rail extending in a predetermined direction, a gate-like support frame that is arranged straddling the guide rail and has an opening for allowing the movement of the chuck table, an alignment means arranged on one flank of the gate-like support frame, and a cutting means arranged on the other flank of the gate-like support frame, wherein the cutting means is composed of an indexing-feed base arranged on the other flank of the gate-like support frame such that it can move in a direction perpendicular to the guide rail, a cutting-in feed base arranged on the indexing-feed base such that it can move in a direction perpendicular to the holding surface of the chuck table, and a spindle unit that is mounted on the cutting-in feed base and has a cutting blade, the spindle unit being arranged on the alignment means side through the opening of the gate-like support frame.

摘要翻译： 一种切割机，包括用于保持工件的卡盘台，所述卡盘台布置成使得其能够沿着沿预定方向延伸的导轨移动;门状支撑框架，其布置成跨越所述导轨并具有用于允许 卡盘台的移动，设置在门状支撑框架的一侧面上的对准装置和布置在栅状支撑框架的另一侧面上的切割装置，其中切割装置由分度馈送基座 布置在栅状支撑框架的另一侧面上，使得其能够在垂直于导轨的方向上移动;切入进给基座，布置在分度进给基座上，使得其可沿垂直于导轨的方向移动; 夹持台的保持面和安装在切入进给基座上并具有切割刀片的主轴单元，主轴单元通过门状支撑框架的开口布置在对准装置侧上。

公开(公告)号：US06889586B2

公开(公告)日：2005-05-10

申请号：US10448221

申请日：2003-05-30

申请人： Sadahiko Kondo ,  Toshiaki Sasaki ,  Masanori Chikuba ,  Toshifumi Hiyoke ,  Sajio Ozaki

发明人： Sadahiko Kondo ,  Toshiaki Sasaki ,  Masanori Chikuba ,  Toshifumi Hiyoke ,  Sajio Ozaki

IPC分类号： B27B5/30 ,  B28D5/00 ,  B28D5/02 ,  B26D7/08 ,  B28D1/04

CPC分类号： B27B5/30 ,  B28D5/0076 ,  B28D5/0082 ,  B28D5/023 ,  B28D5/029 ,  Y10T83/04 ,  Y10T83/263 ,  Y10T83/283 ,  Y10T83/7688 ,  Y10T83/7693 ,  Y10T83/778 ,  Y10T83/9469

摘要： A work cutting apparatus comprises a bed. The bed has an upper surface provided with a column including a rail slidably mounted with a slider. The slider has a front surface mounted with a supporting portion supporting two end portions of a rotating shaft. The rotating shaft is mounted with a plurality of cutting blade blocks. Each of the cutting blade blocks includes a plurality of cutting blades and a thicker cutting blade at each end of the cutting blade block. A table provided with a recess having a V-shaped section is disposed on the bed right beneath the cutting blade blocks. A plurality of works are disposed in the recess, each fixed by a fixing member. The cutting blades lowered while rotating, thereby cutting the works. During this operation, coolant is discharged from a plurality of supplying ports of a coolant supplying portion as well as from a supplying port of a coolant supplying path.

摘要翻译： 一种切割装置包括一个床。 床具有设置有柱的上表面，该柱包括滑动地安装有滑块的导轨。 滑块具有安装有支撑旋转轴的两个端部的支撑部的前表面。 旋转轴安装有多个切割刀块。 每个切割刀片块在切割刀片块的每个端部处包括多个切割刀片和较厚的切割刀片。 设置有具有V形截面的凹部的工作台设置在切割刀块的正下方的床上。 多个工件设置在凹部中，每个工件由固定构件固定。 切割刀片在旋转时降低，从而切割工件。 在该操作期间，冷却剂从冷却剂供给部的多个供给口以及冷却剂供给路径的供给口排出。

公开(公告)号：US06754949B2

公开(公告)日：2004-06-29

申请号：US10642261

申请日：2003-08-18

申请人： Mitoshi Ishii

发明人： Mitoshi Ishii

IPC分类号： B21B1500

CPC分类号： H01L21/67092 ,  B24D5/12 ,  B28D1/121 ,  B28D5/023 ,  H05K3/0052 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49135 ,  Y10T29/5193 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53187 ,  Y10T29/53191 ,  Y10T29/53196

摘要： The object of the present invention is to form individual packaged ICs by using a single apparatus to cut wiring boards on which a plurality of IC chips are mounted. The first cutting device 23 cuts the wiring boards 3 into separate parts along one direction, so that the cut wiring boards 3 constitute strip-form cut wiring boards 3a. The cut wiring boards 3a are conveyed to the second cutting device 33, and are fed by the second conveying device 43 along the direction of length and are then cut by the second cutting device 33 with the orientation altered by 90 degrees relative to the first cutting direction. The wiring boards 3b resulting from the cutting performed by the second cutting device 33 constitute the original forms of the IC packages. The wiring boards 3b that have been cut and conveyed from the second cutting device 33 enter a cleaning step.

摘要翻译： 本发明的目的是通过使用单个装置来切割安装有多个IC芯片的布线板来形成单独的封装IC。 第一切割装置23将布线板3沿着一个方向切割成分离的部分，使得切割的布线板3构成条形切割布线板3a。 切割的线路板3a被输送到第二切割装置33，并且沿着长度方向由第二输送装置43进给，然后被第二切割装置33切割，相对于第一切割方向改变了90度 方向。 由第二切割装置33进行的切割而产生的布线板3b构成IC封装的原始形式。 已经从第二切割装置33切割和输送的布线板3b进入清洁步骤。

公开(公告)号：US20030205119A1

公开(公告)日：2003-11-06

申请号：US10448221

申请日：2003-05-30

申请人： SUMITOMO SPECIAL METALS CO., LTD.

发明人： Sadahiko Kondo ,  Toshiaki Sasaki ,  Masanori Chikuba ,  Toshifumi Hiyoke ,  Sajio Ozaki

IPC分类号： B26D001/14

CPC分类号： B27B5/30 ,  B28D5/0076 ,  B28D5/0082 ,  B28D5/023 ,  B28D5/029 ,  Y10T83/04 ,  Y10T83/263 ,  Y10T83/283 ,  Y10T83/7688 ,  Y10T83/7693 ,  Y10T83/778 ,  Y10T83/9469

摘要： A work cutting apparatus comprises a bed. The bed has an upper surface provided with a column including a rail slidably mounted with a slider. The slider has a front surface mounted with a supporting portion supporting two end portions of a rotating shaft. The rotating shaft is mounted with a plurality of cutting blade blocks. Each of the cutting blade blocks includes a plurality of cutting blades and a thicker cutting blade at each end of the cutting blade block. A table provided with a recess having a V-shaped section is disposed on the bed right beneath the cutting blade blocks. A plurality of works are disposed in the recess, each fixed by a fixing member. The cutting blades lowered while rotating, thereby cutting the works. During this operation, coolant is discharged from a plurality of supplying ports of a coolant supplying portion as well as from a supplying port of a coolant supplying path.

公开(公告)号：US06595094B1

公开(公告)日：2003-07-22

申请号：US09494124

申请日：2000-01-28

申请人： Sadahiko Kondo ,  Toshiaki Sasaki ,  Masanori Chikuba ,  Toshifumi Hiyoke ,  Sajio Ozaki

发明人： Sadahiko Kondo ,  Toshiaki Sasaki ,  Masanori Chikuba ,  Toshifumi Hiyoke ,  Sajio Ozaki

IPC分类号： B26D100

CPC分类号： B27B5/30 ,  B28D5/0076 ,  B28D5/0082 ,  B28D5/023 ,  B28D5/029 ,  Y10T83/04 ,  Y10T83/263 ,  Y10T83/283 ,  Y10T83/7688 ,  Y10T83/7693 ,  Y10T83/778 ,  Y10T83/9469

摘要： A work cutting apparatus comprises a bed. The bed has an upper surface provided with a column including a rail slidably mounted with a slider. The slider has a front surface mounted with a supporting portion supporting two end portions of a rotating shaft. The rotating shaft is mounted with a plurality of cutting blade blocks. Each of the cutting blade blocks includes a plurality of cutting blades and a thicker cutting blade at each end of the cutting blade block. A table provided with a recess having a V-shaped section is disposed on the bed right beneath the cutting blade blocks. A plurality of works are disposed in the recess, each fixed by a fixing member. The cutting blades lowered while rotating, thereby cutting the works. During this operation, coolant is discharged from a plurality of supplying ports of a coolant supplying portion as well as from a supplying port of a coolant supplying path.

摘要翻译： 一种切割装置包括一个床。 床具有设置有柱的上表面，该柱包括滑动地安装有滑块的导轨。 滑块具有安装有支撑旋转轴的两个端部的支撑部的前表面。 旋转轴安装有多个切割刀块。 每个切割刀片块在切割刀片块的每个端部处包括多个切割刀片和较厚的切割刀片。 设置有具有V形截面的凹部的工作台设置在切割刀块的正下方的床上。 多个工件设置在凹部中，每个工件由固定构件固定。 切割刀片在旋转时降低，从而切割工件。 在该操作期间，冷却剂从冷却剂供给部的多个供给口以及冷却剂供给路径的供给口排出。