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    (METH)ACRYLIC ADHESIVE WITH LOW ODOR AND HIGH IMPACT RESISTANCE
    44.
    发明申请
    (METH)ACRYLIC ADHESIVE WITH LOW ODOR AND HIGH IMPACT RESISTANCE 失效
    （METH）丙烯酸粘合剂，具有低气味和高抗冲击性

    公开(公告)号：US20080202683A1

    公开(公告)日：2008-08-28

    申请号：US12113698

    申请日：2008-05-01

    申请人： Shingo TSUNO ,  Ria DE COOMAN

    发明人： Shingo TSUNO ,  Ria DE COOMAN

    IPC分类号： C09J133/20 ,  C08L53/00 ,  C09J153/00

    CPC分类号： C09J175/16 ,  C08F290/048 ,  C08F290/062 ,  C08F290/067 ,  C08G18/4825 ,  C08G18/672 ,  C08G18/7657 ,  C08G18/48

    摘要： The present invention relates to (meth)acrylic adhesives with high impact resistance and no or low odor. The compositions comprise at least a (meth)acrylic ester E which may be obtained by esterification of an alcohol ALC and methacrylic or acrylic acid, said alcohol ALC contains at least 5 carbon atoms; and at least a rubber block co-polymer RS being solid at room temperature and which is a co-polymer of styrene and butadiene and/or isoprene and/or ethylene propylene diene monomer; and at least a polymer PL having pending (meth)acrylic groups and is a butadiene/acrylonitrile co-polymer with terminal (meth)acrylic groups or a polyurethane (meth)acrylate or an ester obtainable by esterification of an alcohol ALC-II and methacrylic or acrylic acid and which has a molecular weight between 200 and 9000 g/mol. Such combinations E-RS-PL have lower viscosity than PL and a combination E-RS.

    摘要翻译： 本发明涉及具有高耐冲击性和无气味的（甲基）丙烯酸类粘合剂。 组合物包含至少一种（甲基）丙烯酸酯E，其可以通过醇ALC和甲基丙烯酸或丙烯酸的酯化获得，所述醇ALC含有至少5个碳原子; 并且至少橡胶嵌段共聚物RS在室温下为固体，并且是苯乙烯和丁二烯和/或异戊二烯和/或乙烯丙烯二烯单体的共聚物; 和至少具有未决（甲基）丙烯酸基团的聚合物PL，并且是具有末端（甲基）丙烯酸基团的丁二烯/丙烯腈共聚物或聚氨酯（甲基）丙烯酸酯或可通过酯化醇ALC-II和甲基丙烯酸甲酯 或丙烯酸，其分子量为200-9000g / mol。 这种组合E-RS-PL具有比PL更低的粘度和组合E-RS。

    Elastic (meth)acrylic adhesive compositions
    45.
    发明申请
    Elastic (meth)acrylic adhesive compositions 审中-公开
    弹性（甲基）丙烯酸粘合剂组合物

    公开(公告)号：US20070142543A1

    公开(公告)日：2007-06-21

    申请号：US11704240

    申请日：2007-02-09

    申请人： Ria De Cooman ,  Werner Meyer ,  Rene Flury ,  Daniel Flury-Schafer

    发明人： Ria De Cooman ,  Werner Meyer ,  Rene Flury ,  Daniel Flury-Schafer

    IPC分类号： C09D5/02

    CPC分类号： C09J175/16 ,  C08F290/048 ,  C08F290/067 ,  C08G18/4866 ,  C08G18/672 ,  C09J4/06 ,  C08G18/48

    摘要： Described is an adhesive composition with a high elasticity, measured in terms of elongation at break, and an elastic behavior approaching the ideal Hook law in the stress-strain diagram. Said adhesive composition comprises (a) at least one monofunctional meth(acrylic) monomer A whose homo-polymer or co-polymer exhibit a glass transition temperature (Tg) between 40° C. and 140° C., (b) at least one monofunctional meth(acrylic) monomer B of the following structure (B): wherein R is H or CH3, R′ is H or (CH2)nCH3, with n=0 to 2, in particular CH2CH3 or H, and R″ is C3-C20-alkyl or phenoxy or O—(CH2)n—CH3 or O—[(CH2)2-O]n—CH2—CH3 with n=0 to 2, in particular (CH2)nCH3 wherein n is 3 or 10 to 13 , and c) at least one liquid elastomer C in the molecular weight range of 1000 to 9000 with (meth)acrylic derivative groups, preferably (meth)acrylic ester groups, whereby the components A, B, and C are present in the following amounts: B based on the total weight of A+B+C=5 to 20% by weight, C based on the total weight of A+C=30 to 70% by weight.

    摘要翻译： 描述了一种具有高弹性的粘合剂组合物，以断裂伸长率测量，以及在应力 - 应变图中接近理想的Hook定律的弹性性能。 所述粘合剂组合物包含（a）至少一种单官能甲基（丙烯酸）单体A，其均聚物或共聚物表现出40℃至140℃之间的玻璃化转变温度（Tg），（b）至少一种 具有以下结构（B）的单官能甲基（丙烯酸）单体B：其中R是H或CH 3，R'是H或（CH 2 CH 2）n n = 0〜2，特别是CH 2 CH 3或H，R“为C C 3 -C 20 - 烷基或苯氧基或O-（CH 2 CH 2）n -CH 3 或O - [（CH 2）2 -O-CH 2 -CH 2 - ， - CH 2 CH 2 n = 0〜2，特别是（CH 2）n 3 CH 3其中n为3或 10〜13，c）至少一种液体弹性体C，其分子量范围为1000〜9000，具有（甲基）丙烯酸衍生物基团，优选为（甲基）丙烯酸酯基，其中组分A，B和C存在于 以下量：基于A + B + C = 5的总重量的B 至20重量％，基于A + C的总重量= 30至70重量％的C。

    (Meth)acrylic adhesive with low odor and high impact resistance
    46.
    发明申请
    (Meth)acrylic adhesive with low odor and high impact resistance 审中-公开
    （Meth）丙烯酸粘合剂，具有低气味和高抗冲击性

    公开(公告)号：US20060155045A1

    公开(公告)日：2006-07-13

    申请号：US11143460

    申请日：2005-06-03

    申请人： Shingo Tsuno ,  Ria De Cooman

    发明人： Shingo Tsuno ,  Ria De Cooman

    IPC分类号： C08L53/00

    CPC分类号： C09J175/16 ,  C08F290/048 ,  C08F290/062 ,  C08F290/067 ,  C08G18/4825 ,  C08G18/672 ,  C08G18/7657 ,  C08G18/48

    摘要： The present invention relates to (meth)acrylic adhesives with high impact resistance and no or low odor. The compositions comprise at least a (meth)acrylic ester E which may be obtained by esterification of an alcohol ALC and methacrylic or acrylic acid, said alcohol ALC contains at least 5 carbon atoms; and at least a rubber block co-polymer RS being solid at room temperature and which is a co-polymer of styrene and butadiene and/or isoprene and/or ethylene propylene diene monomer; and at least a polymer PL having pending (meth)acrylic groups and is a butadiene/acrylonitrile co-poly- mer with terminal (meth)acrylic groups or a polyurethane (meth)acrylate or an ester obtainable by esterification of an alcohol ALC-II and methacrylic or acrylic acid and which has a molecular weight between 200 and 9000 g/mol. Such combinations E-RS-PL have lower viscosity than PL and a combination E-RS.

    摘要翻译： 本发明涉及具有高耐冲击性和无气味的（甲基）丙烯酸类粘合剂。 组合物包含至少一种（甲基）丙烯酸酯E，其可以通过醇ALC和甲基丙烯酸或丙烯酸的酯化获得，所述醇ALC含有至少5个碳原子; 并且至少橡胶嵌段共聚物RS在室温下为固体，并且是苯乙烯和丁二烯和/或异戊二烯和/或乙烯丙烯二烯单体的共聚物; 和至少具有未决（甲基）丙烯酸基团的聚合物PL和具有末端（甲基）丙烯酸基团的丁二烯/丙烯腈共聚物或聚氨酯（甲基）丙烯酸酯或通过醇ALC-II酯化获得的酯 甲基丙烯酸或丙烯酸，其分子量为200-9000g / mol。 这种组合E-RS-PL具有比PL更低的粘度和组合E-RS。

    Acrylic structural adhesive having improved T-peel strength
    47.
    发明授权
    Acrylic structural adhesive having improved T-peel strength 有权
    丙烯酸结构粘合剂具有提高的T-剥离强度

    公开(公告)号：US07019075B2

    公开(公告)日：2006-03-28

    申请号：US10662010

    申请日：2003-09-11

    申请人： Robin F. Righettini ,  Jeffrey A. Hatcher

    发明人： Robin F. Righettini ,  Jeffrey A. Hatcher

    IPC分类号： C08L51/04 ,  C08L53/02

    CPC分类号： C09J151/006 ,  C08F279/00 ,  C08F283/00 ,  C08F287/00 ,  C08F290/048 ,  C08L2666/02 ,  C08L2666/14 ,  C09J4/06 ,  C09J151/003

    摘要： A two-part acrylic structural adhesive comprises a first package containing from about 10 to about 90 percent by weight of at least one ethylenic unsaturated methacrylic ester selected from the group consisting of 1) an alkyl mono-, di- or tetra-substituted cyclohexyl methacrylate, wherein the substitutions occur in either the 3, 4, and/or 5 ring positions, and 2) a linear or branched C4–C10 alkyl methacrylate; from about 10 to about 80 percent by weight of a toughener, and an adhesion promoter; and a second package containing a bonding activator, and, optionally, an epoxy resin.

    摘要翻译： 两部分丙烯酸结构粘合剂包括含有约10至约90重量％的至少一种烯键式不饱和甲基丙烯酸酯的第一包装，所述烯属不饱和甲基丙烯酸酯选自1）烷基单，二或四取代的甲基丙烯酸环己酯 其中取代发生在3,4和/或5个环位置，以及2）直链或支链C 4 -C 10烷基甲基丙烯酸酯; 约10至约80重量％的增韧剂和粘合促进剂; 以及包含粘合活化剂和任选的环氧树脂的第二包装。

    TWO-PART ADHESIVE: PART A-MONOMER,TOUGHENER(S), OPTIONAL ADHESION PROMOTOR AND REDUCING AGENT; PART B-EPOXY RESIN
    49.
    发明申请
    TWO-PART ADHESIVE: PART A-MONOMER,TOUGHENER(S), OPTIONAL ADHESION PROMOTOR AND REDUCING AGENT; PART B-EPOXY RESIN 有权
    两部分胶粘剂：A型单体，TOUGHENER（S），可选粘合促进剂和还原剂; B部分环氧树脂

    公开(公告)号：US20030216513A1

    公开(公告)日：2003-11-20

    申请号：US10147648

    申请日：2002-05-16

    申请人： Lord Corporation

    发明人： Robin F. Righettini ,  Jeffrey A. Hatcher

    IPC分类号： C08F008/00

    CPC分类号： C09J151/006 ,  C08F279/00 ,  C08F283/00 ,  C08F287/00 ,  C08F290/048 ,  C08L2666/02 ,  C08L2666/14 ,  C09J4/06 ,  C09J151/003

    摘要： Epoxy-modified, two-part acrylic structural adhesives characterized by improved T-peel strength are disclosed. These adhesives are not inhibited by oxygen. Representative embodiments include 2-part acrylic structural adhesives comprising, in a first package from about 10 to about 90 percent by weight of at least one methacrylate selected from C3-C10 alkyl monosubstituted-, C1-C6 alkyl disubstituted-, C1-C4 alkyl tri-substituted, and C1-C4 alkyl tetra-substituted cyclohexyl methacrylate. The ring substituents are prefereably in the 3, 4, and/or 5 ring position, and linear or branched C4-C10 branched alkyl methacrylates; from about 10 to about 80 percent by weight of a toughener, and an adhesion promotor; and in a second package, a bonding activator, and optional epoxy resin.

    摘要翻译： 公开了以改进的T剥离强度为特征的环氧改性的两部分丙烯酸结构粘合剂。 这些粘合剂不受氧气的抑制。 代表性实施方案包括2-部分丙烯酸结构粘合剂，其包含在约10至约90重量％的至少一种甲基丙烯酸酯的第一包装中，所述甲基丙烯酸酯选自C 3 -C 10烷基单取代的，C 1 -C 6烷基二取代的，C 1 -C 4烷基三 - 取代的，和C 1 -C 4烷基四取代的甲基丙烯酸环己酯。 环取代基优选在3,4和/或5个环位置，直链或支链的C 4 -C 10支链烷基甲基丙烯酸酯; 约10至约80重量％的增韧剂和粘合促进剂; 并且在第二包装中，结合活化剂和任选的环氧树脂。

    UV-curable compositions and method of use thereof in microelectronics
    50.
    发明申请
    UV-curable compositions and method of use thereof in microelectronics 有权
    UV可固化组合物及其在微电子学中的应用方法

    公开(公告)号：US20030138733A1

    公开(公告)日：2003-07-24

    申请号：US10056245

    申请日：2002-01-22

    申请人： International Business Machines Corporation

    发明人： Krishna G. Sachdev ,  Michael Berger ,  Rebecca Y. Gorrell ,  Gregg B. Monjeau ,  Bernadette H. Perry ,  Thomas A. Wassick

    IPC分类号： G03C005/00 ,  B32B027/40

    CPC分类号： C08F290/048 ,  C08L13/00 ,  G03F7/033 ,  G03F7/038 ,  H05K3/287 ,  Y10S430/106 ,  Y10S430/114 ,  Y10T428/31583 ,  Y10T428/31587 ,  Y10T428/31935

    摘要： Radiation-curable compositions are provided for use in the fabrication of electronic components as passivation coatings; for defect repair in ceramic and thin film products by micropassivation in high circuit density electronic modules to allow product recovery; as a solder mask in electronic assembly processes; for use as protective coatings on printed circuit board (PCB) circuitry and electronic devices against mechanical damage and corrosion from exposure to the environment. The compositions are solvent-free, radiation-curable, preferably uv-curable, containing a polymer binder, which is a pre-formed thermoplastic or elastomeric polymer/oligomer, a monofunctional and/or bifunctional acrylic monomer, a multifunctional (more than 2 reactive groups) acrylated/methacrylated monomer, and a photoinitiator, where all the constituents are mutually miscible forming a homogeneous viscous blend without the addition of an organic solvent. The compositions may also contain inorganic fillers and/or nanoparticle fillers.

    摘要翻译： 提供可辐射固化的组合物用于制造电子部件作为钝化涂层; 通过在高电路密度电子模块中的微激活来对陶瓷和薄膜产品进行缺陷修复，以允许产品回收; 作为电子组装工艺中的焊接掩模; 用作印刷电路板（PCB）电路和电子设备上的保护涂层，防止暴露于环境中的机械损伤和腐蚀。 该组合物是无溶剂的，可辐射固化的，优选可紫外固化的，其包含聚合物粘合剂，其为预成型的热塑性或弹性体聚合物/低聚物，单官能和/或双官能丙烯酸单体，多官能（多于2个反应性 基团）丙烯酸酯化/甲基丙烯酸酯化的单体和光引发剂，其中所有组分是相互混溶的，而不加入有机溶剂形成均匀的粘稠共混物。 组合物还可以含有无机填料和/或纳米颗粒填料。