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公开(公告)号:US20170370481A1
公开(公告)日:2017-12-28
申请号:US15532705
申请日:2015-10-08
Applicant: Robert Bosch GmbH
Inventor: Tadeusz Glazewski
CPC classification number: F16K11/027 , F16K11/07 , F16K11/0716 , F16K31/1262 , F28D15/0266 , F28D15/06 , F28D21/0003 , F28D2015/0291 , Y02T10/16
Abstract: The invention relates to a valve (1), comprising a valve housing (4) and a closing body (3) arranged in the valve housing (4) in such a way that the closing body can be moved longitudinally, wherein at least one inlet channel (5) and at least one outlet channel (6) are arranged in the valve housing (4). The closing body (3) interacts with a valve seat (8) formed on the valve housing (4) by means of the longitudinal motion of the closing body and thereby opens and closes at least one hydraulic connection between the at least one inlet channel (5) and the at least one outlet channel (6). The closing body (3) can be driven by means of a metal-bellows/piston unit (2), wherein the metal-bellows/piston unit (2) has a variable-length metal bellows (20) and a variable-volume working chamber (23) and wherein the metal bellows (20) bounds the working chamber (23) in a sealing manner.
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公开(公告)号:US20170363365A1
公开(公告)日:2017-12-21
申请号:US15695468
申请日:2017-09-05
Inventor: Kensuke Aoki , Takuya Hongo
CPC classification number: F28D15/0266 , F25B23/006 , F28D15/02 , F28D15/025 , F28F2250/06 , F28F2265/14 , H01L23/427 , H05K7/20672
Abstract: A cooling device of an embodiment includes an evaporator, a condenser, a first connection pipe, a second connection pipe, and a third connection pipe. A refrigerant is vaporized in the evaporator by heat generated by a heating element. The condenser is located above the evaporator, and configured to condense the vaporized refrigerant by exchanging heat with an external fluid. The first connection pipe guides the refrigerant vaporized by the evaporator to the condenser. The second connection pipe guides the refrigerant condensed by the condenser to the evaporator. The third connection pipe connects a portion of the first connection pipe and a portion of the second connection pipe. A connection position between the third connection pipe and the first connection pipe is higher than a maximum liquid level height of the refrigerant in the second connection pipe during an operation.
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公开(公告)号:US20170350657A1
公开(公告)日:2017-12-07
申请号:US15226060
申请日:2016-08-02
Applicant: TAI-SOL ELECTRONICS CO., LTD.
Inventor: Yun-Yeu YEH , Chuan-Chi TSENG , Ming-Quan CUI
CPC classification number: F28D15/0266 , F28D15/0233 , F28D15/046 , F28D2021/0028 , F28F9/0075 , H01L23/427
Abstract: A heat spreader with a liquid-vapor separation structure includes a first panel, a second panel bonded with the first panel and defining therebetween an enclosed accommodation chamber, multiple spacer members arranged spaced apart from one another in the accommodation chamber and abutted between the first panel and the second panel and defining multiple vapor passages and liquid passages therebetween and dividing the accommodation chamber into a heat-absorbing zone and a condensing zone that are disposed in communication with each other through the vapor passages and the liquid passages, a first wick material partially disposed in the liquid passages and partially disposed in the heat-absorbing zone and the condensing zone, and a working fluid filled in the accommodation chamber.
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公开(公告)号:US20170343298A1
公开(公告)日:2017-11-30
申请号:US15166281
申请日:2016-05-27
Applicant: ASIA VITAL COMPONENTS CO., LTD.
Inventor: Wen-Ji Lan
IPC: F28D15/04
CPC classification number: F28D15/04 , F28D15/0233 , F28D15/0266 , F28D15/046 , F28F1/32
Abstract: A heat dissipation component includes: a first main body having a first chamber; a second main body having a second chamber; a third main body having a third chamber; a first tubular body having a first flow way, two ends of the first tubular body being respectively connected with the first and second main bodies; and a second tubular body having a second flow way. The second tubular body is passed through the second main body and the first flow way. Two ends of the second tubular body are respectively connected with the first and third main bodies. A working fluid is filled in the first, second and third chambers.
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公开(公告)号:US20170343294A1
公开(公告)日:2017-11-30
申请号:US15165518
申请日:2016-05-26
Applicant: Fujikura Ltd.
Inventor: Thanhlong PHAN , Youji KAWAHARA , Yuichi YOKOYAMA , Yuji SAITO , Mohammad Shahed AHAMED , Koichi MASHIKO
CPC classification number: F28D15/0266 , F28D15/0233 , F28D15/0258 , F28D15/0283 , F28D15/046 , F28D2021/0028 , F28F3/08 , F28F21/083 , F28F21/084 , F28F21/085 , F28F21/089
Abstract: In a heat spreading module, a plurality of hollow paths is formed in a thin plate-shaped main body so as to pass though the heating portion, and the hollow paths communicate with each other in a heating portion, a working fluid is enclosed in the hollow paths, a wick is disposed in each of the hollow paths such that a vapor flow path in which vapor of the working fluid flows is formed in each of the hollow paths, a part of each wick is positioned at the heating portion, and the vapor flow paths formed in the hollow paths communicate with each other in the heating portion.
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公开(公告)号:US20170308133A1
公开(公告)日:2017-10-26
申请号:US15637718
申请日:2017-06-29
Applicant: BEYOND BLADES LTD.
Inventor: AVIV SOFFER
CPC classification number: G06F1/18 , F28D15/0266 , F28D15/0275 , G06F1/20 , G06F2200/1635 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/19105 , H05K1/0284 , H05K1/185 , H05K7/205 , H05K2201/041 , H01L2924/00
Abstract: A stackable layer is provided for 3-Dimensional multi-layered modular computers. The stackable layer comprises at least one encapsulated chip die. Sets of electrical contacts are provided on each one of the large surfaces of the layer. The encapsulated chip die and the two large opposite surfaces of the layer are substantially parallel.
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公开(公告)号:US09801311B2
公开(公告)日:2017-10-24
申请号:US15094460
申请日:2016-04-08
Applicant: FUJITSU LIMITED
Inventor: Teru Nakanishi , Nobuyuki Hayashi , Takahiro Kimura
CPC classification number: H05K7/20809 , F28D15/0266 , F28D15/06 , F28F2250/08
Abstract: A cooling system, includes: an evaporator configured to take heat from a heat source by latent heat of evaporation of liquid; an aspirator configured to suck vapor generated in the evaporator and decompress an inside of the evaporator; a liquid supplying unit configured to supply liquid to the aspirator and the evaporator; and a gas mixing unit configured to mix gas into the liquid to be supplied from the liquid supplying unit to the evaporator.
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公开(公告)号:US09797659B2
公开(公告)日:2017-10-24
申请号:US15157918
申请日:2016-05-18
Applicant: MAN ZAI INDUSTRIAL CO., LTD.
Inventor: Cheng-Chien Wan , Cheng-Feng Wan , Hao-Hui Lin
IPC: F28D15/00 , F28D15/02 , H01L23/427 , F28D21/00 , H01L23/367 , H01L23/467 , F28D1/053
CPC classification number: F28D15/0266 , F28D1/05366 , F28D15/025 , F28D2021/0028 , H01L23/3672 , H01L23/427 , H01L23/467
Abstract: A refrigerant heat dissipation apparatus has an evaporator, a condenser having a first condensing tube and a second condensing tube, a first refrigerant tube, two second refrigerant tubes, and a refrigerant. The first refrigerant tube is connected between the top of the evaporator and an upper part of a first condensing tube. The second refrigerant tubes are respectively connected with a lower part of the first condensing tube and a lower part of the second condensing tube, so as to form a multi-flow closed-loop cycle. The refrigerant is filled into the multi-flow closed-loop cycle. The controlling of cycling direction of the refrigerant achieves the efficiency in heat dissipating of the refrigerant heat dissipation apparatus.
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公开(公告)号:US09786578B2
公开(公告)日:2017-10-10
申请号:US14164986
申请日:2014-01-27
Inventor: Aaron R. Cox , William J. Grady , Jason A. Matteson , Jason E. Minyard
IPC: H01L23/427 , H01L23/473 , H01L23/40 , F28D15/02 , F28F1/20 , H05K7/20
CPC classification number: H01L23/473 , F28D15/0266 , F28D15/0275 , F28F1/20 , F28F2275/08 , H01L23/4093 , H01L23/427 , H05K7/20509 , Y10T29/49117
Abstract: A memory module cooling system includes a liquid cooled manifold assembly and a heat spreader assembly rotateably attached to the liquid cooled manifold assembly about an axis perpendicular to the memory module. The liquid cooled manifold assembly includes a manifold, an liquid inlet, and a liquid outlet. The heat spreader assembly includes a base in thermal contact with a heat pipe, and a heat spreader in thermal contact with the heat pipe, the heat spreader configured to thermally engage the memory module. In certain embodiments, thermal bonds are maintained between a plurality of neighboring memory modules when a particular heat spreader assembly is rotated away from an associated memory module.
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公开(公告)号:US09777967B2
公开(公告)日:2017-10-03
申请号:US14825320
申请日:2015-08-13
Applicant: J R Thermal LLC
Inventor: Jeremy Rice
CPC classification number: F28D15/043 , F28D15/0266 , F28D15/046
Abstract: Fluid to fluid heat exchange processes involve the hot fluid reducing in temperature and the cold fluid increasing in temperature. To transfer heat between the two fluids, a third, separated heat transfer fluid is often used. The present invention allows for passive heat transfer between the two fluids, using a separate heat transfer fluid, while enabling heat absorption and rejection through a continuously variable temperature.
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