公开(公告)号：US20120191256A1

公开(公告)日：2012-07-26

申请号：US13435193

申请日：2012-03-30

Applicant: Sridhar Deivasigamani ,  Sivaprasad Akasam

Inventor： Sridhar Deivasigamani ,  Sivaprasad Akasam

IPC: G05D23/00

CPC classification number: F24D17/0026 ,  F24D19/1051 ,  F24D2200/043 ,  F24D2200/08 ,  G05D23/1927 ,  G05D23/1932 ,  Y02B30/762

Abstract: Disclosed is a masterless control system for controlling a plurality of fluidly and operably connected water heaters to meet a hot water demand such that overall efficiency is maximized and usage disparity between water heaters is minimized. There is further disclosed a method for detecting a small system demand in said network by adjusting the setting of each flow limiting valve of each water heater. There is still further disclosed a method for enabling seamless addition or removal of a heater in service and heating load distribution to water heaters.

Abstract translation: 公开了一种无控制控制系统，用于控制多个流体和可操作地连接的热水器以满足热水需求，使得整体效率最大化，并且热水器之间的使用差异最小化。 还公开了一种通过调节每个热水器的每个限流阀的设定来检测所述网络中的小系统需求的方法。 还进一步公开了一种能够无缝地添加或除去使用中的加热器并将加热负载分配给热水器的方法。

公开(公告)号：US08034170B2

公开(公告)日：2011-10-11

申请号：US11779203

申请日：2007-07-17

Applicant: Lawrence Kates

Inventor： Lawrence Kates

IPC: B01D46/46

CPC classification number: G05D23/1932 ,  F24F3/1603 ,  F24F11/30 ,  F24F11/39 ,  F24F11/47 ,  F24F11/56 ,  F25B49/00 ,  F25B49/005 ,  F25B2500/19 ,  F25B2600/07 ,  F25B2700/02 ,  F25B2700/133 ,  F25B2700/1351 ,  F25B2700/15 ,  F25B2700/151 ,  F25B2700/172 ,  F25B2700/1931 ,  F25B2700/1933 ,  F25B2700/195 ,  F25B2700/2106 ,  F25B2700/21151 ,  F25B2700/21152 ,  F25B2700/21161 ,  F25B2700/21163 ,  F25B2700/21172 ,  F25B2700/21173 ,  F25B2700/21174 ,  F25B2700/21175 ,  F25D2400/36 ,  G01K13/00 ,  G01K2201/00 ,  G01N15/0826 ,  G01N2015/084 ,  G01N2015/0846 ,  G05B15/02 ,  G05D23/1917 ,  G05D23/1928 ,  Y10S55/34 ,  Y10S116/25 ,  Y10S116/42

Abstract: A real-time monitoring system that monitors various aspects of the operation of a refrigerant-cycle system is described. In one embodiment, the system includes a processor that measures power provided to the refrigerant-cycle system and that gathers data from one or more sensors and uses the sensor data to calculate a figure of merit related to the efficiency of the system. In one embodiment, the sensors include one or more of the following sensors: a suction line temperature sensor, a suction line pressure sensor, a suction line flow sensor, a hot gas line temperature sensor, a hot gas line pressure sensor, a hot gas line flow sensor, a liquid line temperature sensor, a liquid line pressure sensor, a liquid line flow sensor. In one embodiment, the sensors include one or more of an evaporator air temperature input sensor, an evaporator air temperature output sensor, an evaporator air flow sensor, an evaporator air humidity sensor, and a differential pressure sensor. In one embodiment, the sensors include one or more of a condenser air temperature input sensor, a condenser air temperature output sensor, and a condenser air flow sensor, an evaporator air humidity sensor. In one embodiment, the sensors include one or more of an ambient air sensor and an ambient humidity sensor.

Abstract translation: 描述了监测制冷剂循环系统的操作的各个方面的实时监控系统。 在一个实施例中，系统包括处理器，其测量提供给制冷剂循环系统的功率，并从一个或多个传感器收集数据，并使用传感器数据来计算与系统效率相关的品质因数。 在一个实施例中，传感器包括以下传感器中的一个或多个：吸入管线温度传感器，吸入管线压力传感器，吸入管线流量传感器，热气体管线温度传感器，热气体管线压力传感器，热气体 线路流量传感器，液体线路温度传感器，液体线路压力传感器，液体线路流量传感器。 在一个实施例中，传感器包括蒸发器空气温度输入传感器，蒸发器空气温度输出传感器，蒸发器空气流量传感器，蒸发器空气湿度传感器和差压传感器中的一个或多个。 在一个实施例中，传感器包括冷凝器空气温度输入传感器，冷凝器空气温度输出传感器和冷凝器空气流量传感器，蒸发器空气湿度传感器中的一个或多个。 在一个实施例中，传感器包括一个或多个环境空气传感器和环境湿度传感器。

公开(公告)号：US20110154834A1

公开(公告)日：2011-06-30

申请号：US12975994

申请日：2010-12-22

Applicant: Changmin Choi ,  Baikyoung Chung ,  Sunghwan Kim

Inventor： Changmin Choi ,  Baikyoung Chung ,  Sunghwan Kim

IPC: F25D3/00 ,  F25B41/04

CPC classification number: F24F11/0009 ,  F24F11/30 ,  F24F11/32 ,  F24F2110/10 ,  F24F2140/20 ,  F25B13/00 ,  F25B41/062 ,  F25B49/005 ,  F25B2313/0233 ,  F25B2313/02741 ,  F25B2313/0314 ,  F25B2500/06 ,  F25B2600/2513 ,  G05D23/1932 ,  Y02B30/765

Abstract: The present invention relates to an air conditioner and method for controlling the same, which can continue an operation when a sensor breaks down. A method for controlling an air conditioner according to the exemplary embodiment of the present invention comprises a plurality of indoor units, wherein the method comprises occurring a breakdown in a sensor of any one of the plurality of indoor units, calculating a value of the sensor, and controlling the indoor unit according to the calculated value of the sensor.

Abstract translation: 空调机及其控制方法技术领域本发明涉及一种空调机及其控制方法，能够在传感器故障时继续运转。 根据本发明的示例性实施例的空调的控制方法包括多个室内单元，其中，所述方法包括：在所述多个室内单元中的任一个的传感器中发生击穿，计算所述传感器的值， 以及根据传感器的计算值来控制室内机。

公开(公告)号：US20100163633A1

公开(公告)日：2010-07-01

申请号：US12650320

申请日：2009-12-30

Applicant: Jon Barrett ,  Ronald Lingemann

Inventor： Jon Barrett ,  Ronald Lingemann

IPC: F24F7/00 ,  G05B15/00 ,  G05D23/00

CPC classification number: G05D23/1934 ,  B60H1/00871 ,  F24F3/044 ,  F24F11/30 ,  F24F11/56 ,  F24F11/62 ,  F24F11/755 ,  F24F11/76 ,  F24F13/082 ,  F24H9/2064 ,  G05D23/1932

Abstract: Distributed nodes, such as intelligent register controllers, of a heating, ventilating and/or air conditioning (HVAC) system wirelessly communicate with each other on a peer-to-peer basis, forming a network, and collectively control the HVAC system, without a central controller. The intelligent register controllers collectively control the amount of conditioned air introduced into each region. Each node may base its operation at least in part on information about one or more (ideally all) of the other nodes. Each intelligent register controller automatically determines how much conditioned air to allow into its region, or how much return air to allow to be withdrawn from its region, based on information collected by the register controller, such as: current temperature of the region; desired temperature of the region; calculated amount of conditioned air required to change the region's temperature to the desired temperature; temperature of conditioned air begin supplied by a duct to the register; current time, day of week, vacation or other schedule data; temperatures of other regions and their respective desired temperatures; calculated amounts of air required to be supplied or withdrawn by the other controlled registers to change their respective regions' temperatures to their desired temperatures; or combinations thereof. Each register controller automatically determines when and to what extent to operate its respective controllable damper.

Abstract translation: 加热，通风和/或空调（HVAC）系统的分布式节点（如智能寄存器控制器）在点对点的基础上相互无线地进行通信，形成网络，并集中控制HVAC系统，而无需 中央控制器 智能寄存器控制器共同控制引入每个区域的调节空气的量。 每个节点可以至少部分地将其操作基于关于其他节点的一个或多个（理想地是所有）的信息。 每个智能注册控制器根据寄存器控制器收集的信息，自动确定允许进入其区域的空调空气量，或允许从其区域中取出多少空气，例如：该区域的当前温度; 所需区域温度; 将区域温度改变到所需温度所需的调节空气的计算量; 调节空气的温度由管道开始供应到寄存器; 当前时间，星期几，假期或其他时间表数据; 其他区域的温度及其各自的期望温度; 由其他受控寄存器提供或撤回所需的空气的计算量，以将其各自区域的温度改变为所需温度; 或其组合。 每个寄存器控制器自动确定何时以及在多大程度上操作其各自的可控阻尼器。

公开(公告)号：US07641419B1

公开(公告)日：2010-01-05

申请号：US09961483

申请日：2001-09-24

Applicant: James J. Nelson

Inventor： James J. Nelson

IPC: E01C23/14

CPC classification number: H05B1/023 ,  E01C19/48 ,  E01C2301/10 ,  G05D23/1932

Abstract: A control system for heating a screed assembly of a paving machine is provided. The control system includes a plurality of resistive heating elements positioned adjacent to a screed plate of the screed assembly. An electrical power supply is selectively connected with the resistive heating elements via switches operated by a controller. The controller is responsive to inputs from at least manual switches and temperature sensors. The controller is configured to automatically adjust the temperature of the screed plate by selectively energizing fewer than all of the resistive heating elements at a time.

Abstract translation: 提供了一种用于加热铺路机的熨平板组件的控制系统。 控制系统包括与熨平板组件的熨平板相邻定位的多个电阻加热元件。 电源通过由控制器操作的开关选择性地与电阻加热元件连接。 控制器响应于至少手动开关和温度传感器的输入。 控制器被配置为通过相对于所有电阻加热元件一次选择性地供能来自动调节熨平板的温度。

公开(公告)号：US20090199580A1

公开(公告)日：2009-08-13

申请号：US12368205

申请日：2009-02-09

Applicant: GEOFF SEAN LYON

Inventor： GEOFF SEAN LYON

IPC: G05D23/00

CPC classification number: H05K7/20836 ,  G05D23/1932

Abstract: A cooling system for cooling a room containing a plurality of computer devices is provided. The cooling system has a number of cooling supplies and at least one temperature sensor. Using the at least one temperature sensor and altering the cooling supplied to the room by the cooling supplies, the affect of each cooling supply on the temperature of the room can be approximated and used for the operation of the cooling system.

Abstract translation: 提供一种用于冷却包含多个计算机设备的房间的冷却系统。 冷却系统具有多个冷却供应和至少一个温度传感器。 使用至少一个温度传感器并且通过冷却供应改变供应给房间的冷却，可以近似地将每个冷却供给对房间温度的影响用于冷却系统的操作。

公开(公告)号：US20090078695A1

公开(公告)日：2009-03-26

申请号：US11858809

申请日：2007-09-20

Applicant: Megumi Jyousaka ,  Hiroshi Tomita ,  Masahide Tadokoro

Inventor： Megumi Jyousaka ,  Hiroshi Tomita ,  Masahide Tadokoro

IPC: H05B1/02

CPC classification number: H01L21/67109 ,  G05D23/1932 ,  H01L21/67748

Abstract: A thermal plate of a PEB unit is divided into a plurality of thermal plate regions, and a temperature is settable for each of the thermal plate regions. A temperature correction value for adjusting the temperature within the thermal plate is settable for each of the thermal plate regions of the thermal plate. The line widths within the substrate for which a photolithography process has been finished are measured. The in-plane tendency of the measured line widths is decomposed into a plurality of in-plane tendency components using a Zernike polynomial. Then, in-plane tendency components improvable by setting the temperature correction values are extracted from the calculated plurality of in-plane tendency components and added to calculate an improvable in-plane tendency in the measured line widths. Then, the improvable in-plane tendency is subtracted from the in-plane tendency Z of the current processing states to calculate an after-improvement in-plane tendency.

Abstract translation: PEB单元的热板被分成多个热板区域，并且可以为每个热板区域设置温度。 用于调节热板内的温度的温度校正值可针对热板的每个热板区域而设定。 测量光刻工艺已经完成的衬底内的线宽。 使用泽尔尼克多项式将测量的线宽的平面内趋势分解成多个平面内趋势分量。 然后，从计算出的多个面内趋势分量中提取通过设定温度校正值而可改善的面内倾向分量，并且将其相加以计算测量的线宽中的可改进的面内倾向。 然后，从当前处理状态的面内倾向Z中减去可改进的平面内趋势，以计算改进后的平面内趋势。

公开(公告)号：US20080281476A1

公开(公告)日：2008-11-13

申请号：US11747279

申请日：2007-05-11

Applicant: Pradip Bose ,  Alper Buyuktosunoglu ,  Eren Kursun

Inventor： Pradip Bose ,  Alper Buyuktosunoglu ,  Eren Kursun

IPC: G05D23/20 ,  G06F1/00

CPC classification number: G05D23/1932

Abstract: A method of dynamic thermal management in a multi-dimensional integrated circuit or device is provided. The method includes monitoring on-chip temperatures, power dissipation, and performance of device layers. The method includes comparing on-chip temperatures to thermal thresholds, on-chip power dissipation to power thresholds and on-chip performance to performance thresholds. Also, the method includes analyzing interactions between temperatures, power, and performance of different device layers within the multi-dimensional integrated circuits. The method includes activating layer-specific thermal and power management within performance constraints on one or more device layers through actuators in the corresponding device layers, depending on the severity of heating.

Abstract translation: 提供了一种多维集成电路或器件中的动态热管理方法。 该方法包括监测片上温度，功耗和器件层的性能。 该方法包括将片上温度与热阈值进行比较，将片上功耗降至功率阈值，并将片上性能与性能阈值进行比较。 此外，该方法包括分析多维集成电路内不同器件层的温度，功率和性能之间的相互作用。 该方法包括根据加热的严重程度，通过相应设备层中的致动器在一个或多个设备层上的性能约束内激活层特定的热和功率管理。

公开(公告)号：US20080216495A1

公开(公告)日：2008-09-11

申请号：US12050821

申请日：2008-03-18

Applicant: Lawrence Kates

Inventor： Lawrence Kates

IPC: G01K13/00 ,  G05D23/00

CPC classification number: G05D23/1932 ,  F24F3/1603 ,  F24F11/30 ,  F24F11/39 ,  F24F11/47 ,  F24F11/56 ,  F25B49/00 ,  F25B49/005 ,  F25B2500/19 ,  F25B2600/07 ,  F25B2700/02 ,  F25B2700/133 ,  F25B2700/1351 ,  F25B2700/15 ,  F25B2700/151 ,  F25B2700/172 ,  F25B2700/1931 ,  F25B2700/1933 ,  F25B2700/195 ,  F25B2700/2106 ,  F25B2700/21151 ,  F25B2700/21152 ,  F25B2700/21161 ,  F25B2700/21163 ,  F25B2700/21172 ,  F25B2700/21173 ,  F25B2700/21174 ,  F25B2700/21175 ,  F25D2400/36 ,  G01K13/00 ,  G01K2201/00 ,  G01N15/0826 ,  G01N2015/084 ,  G01N2015/0846 ,  G05B15/02 ,  G05D23/1917 ,  G05D23/1928 ,  Y10S55/34 ,  Y10S116/25 ,  Y10S116/42

Abstract: A real-time monitoring system that monitors various aspects of the operation of a refrigerant-cycle system is described. In one embodiment, the system includes a processor that measures power provided to the refrigerant-cycle system and that gathers data from one or more sensors and uses the sensor data to calculate a figure of merit related to the efficiency of the system. In one embodiment, the sensors include one or more of the following sensors: a suction line temperature sensor, a suction line pressure sensor, a suction line flow sensor, a hot gas line temperature sensor, a hot gas line pressure sensor, a hot gas line flow sensor, a liquid line temperature sensor, a liquid line pressure sensor, a liquid line flow sensor. In one embodiment, the sensors include one or more of an evaporator air temperature input sensor, an evaporator air temperature output sensor, an evaporator air flow sensor, an evaporator air humidity sensor, and a differential pressure sensor. In one embodiment, the sensors include one or more of a condenser air temperature input sensor, a condenser air temperature output sensor, and a condenser air flow sensor, an evaporator air humidity sensor. In one embodiment, the sensors include one or more of an ambient air sensor and an ambient humidity sensor.

Abstract translation: 描述了监测制冷剂循环系统的操作的各个方面的实时监控系统。 在一个实施例中，系统包括处理器，其测量提供给制冷剂循环系统的功率，并从一个或多个传感器收集数据，并使用传感器数据来计算与系统效率相关的品质因数。 在一个实施例中，传感器包括以下传感器中的一个或多个：吸入管线温度传感器，吸入管线压力传感器，吸入管线流量传感器，热气体管线温度传感器，热气体管线压力传感器，热气体 线路流量传感器，液体线路温度传感器，液体线路压力传感器，液体线路流量传感器。 在一个实施例中，传感器包括蒸发器空气温度输入传感器，蒸发器空气温度输出传感器，蒸发器空气流量传感器，蒸发器空气湿度传感器和差压传感器中的一个或多个。 在一个实施例中，传感器包括冷凝器空气温度输入传感器，冷凝器空气温度输出传感器和冷凝器空气流量传感器，蒸发器空气湿度传感器中的一个或多个。 在一个实施例中，传感器包括一个或多个环境空气传感器和环境湿度传感器。

公开(公告)号：US20080170969A1

公开(公告)日：2008-07-17

申请号：US11680118

申请日：2007-02-28

Applicant: Ken Yoshioka ,  Yutaka Omoto ,  Mamoru Yakushiji ,  Tsunehiko Tsubone ,  Kazunori Nakamoto

Inventor： Ken Yoshioka ,  Yutaka Omoto ,  Mamoru Yakushiji ,  Tsunehiko Tsubone ,  Kazunori Nakamoto

IPC: G05D23/00

CPC classification number: H01L21/6831 ,  G05D23/1932 ,  G05D23/22 ,  H01L21/67109 ,  H01L21/67276

Abstract: It is possible to provide a plasma etching apparatus that controls the temperature of a sample at a higher speed and with more accuracy to improve the efficiency of processing the sample. A plasma processing apparatus includes a processing chamber to be depressurized and exhausted, a sample placement electrode provided in the processing chamber and having a sample placement surface on which a substrate to be processed is placed, an electromagnetic generation device to generate plasma in the processing chamber, a supply system that supplies processing gas to the processing chamber, a vacuum exhaust system that exhausts inside the processing chamber, a heater layer and a base temperature monitor that are disposed on the sample placement electrode, a wafer temperature estimating unit that estimates a wafer temperature from the base temperature monitor and plasma forming power supply, and a controller that regulates the heater corresponding to output from the temperature estimating unit.

Abstract translation: 可以提供一种等离子体蚀刻装置，其以更高的速度和更高的精度来控制样品的温度，以提高样品的处理效率。 一种等离子体处理装置，其特征在于，包括要被减压和排出的处理室，设置在处理室中并具有放置有待处理基板的样品放置面的样品放置电极，在处理室中产生等离子体的电磁产生装置 向处理室供给处理气体的供给系统，在处理室内排出的真空排气系统，设置在样本设置电极上的加热器层和基底温度监视器，估计晶片的晶片温度估计单元 来自基础温度监视器和等离子体形成电源的温度，以及根据来自温度估计单元的输出来调节加热器的控制器。