公开(公告)号：US07948335B2

公开(公告)日：2011-05-24

申请号：US12214785

申请日：2008-06-20

Applicant: David W. Sherrer ,  John J. Fisher

Inventor： David W. Sherrer ,  John J. Fisher

IPC: H01P3/06

CPC classification number: H01P3/06 ,  H01P1/08 ,  H01P3/00 ,  H01P5/103 ,  H01P5/183 ,  H01P11/002 ,  H01P11/003 ,  H01P11/005 ,  H05K1/0221 ,  H05K1/0272 ,  H05K3/4644 ,  H05K3/4685 ,  H05K2201/09809 ,  Y10T29/49117 ,  Y10T29/49123

Abstract: Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and disposed around the center conductor; one or more dielectric support members for supporting the center conductor in contact with the center conductor and enclosed within the outer conductor; and a core volume between the center conductor and the outer conductor, wherein the core volume is under vacuum or in a gas state. Also provided are methods of forming coaxial waveguide microstructures by a sequential build process and hermetic packages which include a coaxial waveguide microstructure.

Abstract translation: 提供同轴波导微结构。 微结构包括设置在衬底上方的衬底和同轴波导。 同轴波导包括：中心导体; 包括一个或多个壁的外导体，与中心导体间隔开并设置在中心导体周围; 一个或多个电介质支撑构件，用于支撑与中心导体接触并封闭在外部导体内的中心导体; 以及中心导体和外部导体之间的芯体积，其中芯体积处​​于真空状态或气体状态。 还提供了通过顺序构建工艺形成同轴波导微结构的方法和包括同轴波导微结构的密封封装。

公开(公告)号：US20110057743A1

公开(公告)日：2011-03-10

申请号：US12875353

申请日：2010-09-03

Applicant: Toshihiro SHIMURA ,  Yoji OHASHI

Inventor： Toshihiro SHIMURA ,  Yoji OHASHI

IPC: H01P5/107

CPC classification number: H01P5/024 ,  H01P5/087 ,  H01P11/002 ,  Y10T29/49016

Abstract: A signal converter configured to convert a signal between a substrate unit and a hollow waveguide includes a substrate unit, including a first conductor layer formed on one face of a dielectric substrate, and a second conductor layer formed on another face of the dielectric substrate, a plurality of conduction units that penetrate the dielectric substrate and provide conduction between the first conductor layer and the second conductor layer, an dielectric waveguide formed by the dielectric substrate, the first and second conductor layers, and the conduction units, and a conversion unit that converts the signal between the hollow waveguide and the dielectric waveguide, the conversion unit including a conductor patch having a separator region between itself and the first conductor layer, with the conductor patch being disposed on the substrate unit within an aperture of the hollow waveguide.

Abstract translation: 被配置为转换衬底单元和中空波导之间的信号的信号转换器包括：衬底单元，包括形成在电介质衬底的一个面上的第一导体层和形成在电介质衬底的另一个表面上的第二导体层; 多个导电单元，其穿过电介质基板并且在第一导体层和第二导体层之间提供导通，由介质基板，第一和第二导体层以及导电单元形成的电介质波导，以及转换单元， 中空波导与电介质波导之间的信号，转换单元包括导体贴片，该导体贴片在其自身与第一导体层之间具有隔离区，导体贴片设置在中空波导的孔内的基板单元上。

公开(公告)号：US07623004B2

公开(公告)日：2009-11-24

申请号：US11521268

申请日：2006-09-13

Applicant: Dieter Wolk ,  Isabel Montero Herrero ,  Luis Galan Estella ,  David Raboso Garcia-Baquero

Inventor： Dieter Wolk ,  Isabel Montero Herrero ,  Luis Galan Estella ,  David Raboso Garcia-Baquero

IPC: H01J25/76

CPC classification number: H01P11/002

Abstract: A method of reducing multipactor effect occurrence on surfaces in a high energy field, e.g., RF devices, is provided and RF devices having a configuration produced by the method are provided. The method includes forming wall structures formed of a metallic wall material and defining a channel through which the RF energy travels, the wall material having a wall material surface. A porous layer is disposed over the wall material surface and has a porous layer upper surface opposite a porous layer lower surface facing the wall material surface. The porous layer defines pores with openings distributed in the porous layer upper surface. A conductive layer is disposed over the porous layer upper surface.

Abstract translation: 提供了一种在高能场（例如RF装置）中减少多面体效应发生的方法，并且提供了具有通过该方法制造的配置的RF装置。 该方法包括形成由金属壁材料形成的壁结构并且限定RF能量穿过的通道，壁材料具有壁材料表面。 多孔层设置在壁材料表面上方，并且具有与面向壁材料表面的多孔层下表面相对的多孔层上表面。 多孔层限定具有分布在多孔层上表面中的孔的孔。 导电层设置在多孔层上表面上。

公开(公告)号：US20090261926A1

公开(公告)日：2009-10-22

申请号：US11521268

申请日：2006-09-13

Applicant: Dieter Wolk ,  Isabel Montero Herrero ,  Luis Galan Estella ,  David Raboso Garcia-Baquero

Inventor： Dieter Wolk ,  Isabel Montero Herrero ,  Luis Galan Estella ,  David Raboso Garcia-Baquero

IPC: H01P1/00

CPC classification number: H01P11/002

Abstract: A method of reducing multipactor effect occurrence on surfaces in a high energy field, e.g., RF devices, is provided and RF devices having a configuration produced by the method are provided. The method includes forming wall structures formed of a metallic wall material and defining a channel through which the RF energy travels, the wall material having a wall material surface. A porous layer is disposed over the wall material surface and has a porous layer upper surface opposite a porous layer lower surface facing the wall material surface. The porous layer defines pores with openings distributed in the porous layer upper surface. A conductive layer is disposed over the porous layer upper surface.

Abstract translation: 提供了一种在高能场（例如RF装置）中减少多面体效应发生的方法，并且提供了具有通过该方法制造的配置的RF装置。 该方法包括形成由金属壁材料形成的壁结构并且限定RF能量穿过的通道，壁材料具有壁材料表面。 多孔层设置在壁材料表面上方，并且具有与面向壁材料表面的多孔层下表面相对的多孔层上表面。 多孔层限定具有分布在多孔层上表面中的孔的孔。 导电层设置在多孔层上表面上。

公开(公告)号：US20070274656A1

公开(公告)日：2007-11-29

申请号：US11322995

申请日：2005-12-30

Applicant: Gary Brist ,  Bryce Horine ,  Stephen Hall

Inventor： Gary Brist ,  Bryce Horine ,  Stephen Hall

IPC: G02B6/10

CPC classification number: H01P3/121 ,  H01P11/002 ,  H05K1/024 ,  H05K3/4611 ,  H05K3/4614 ,  H05K3/462 ,  H05K2201/037 ,  H05K2201/0379 ,  H05K2201/09981 ,  Y10T29/49124

Abstract: In some embodiments a printed circuit board is fabricated using printed circuit board material, and a waveguide is formed that is contained within the printed circuit board material. Other embodiments are described and claimed.

Abstract translation: 在一些实施例中，使用印刷电路板材料制造印刷电路板，并且形成包含在印刷电路板材料内的波导。 描述和要求保护其他实施例。

公开(公告)号：US06882762B2

公开(公告)日：2005-04-19

申请号：US09963637

申请日：2001-09-27

Applicant: Gary A. Brist ,  Carlos Mejia ,  William O. Alger ,  Gary B. Long

Inventor： Gary A. Brist ,  Carlos Mejia ,  William O. Alger ,  Gary B. Long

IPC: H01P11/00 ,  H05K1/02 ,  H05K3/00 ,  G02B6/12

CPC classification number: H05K1/0237 ,  H01P11/002 ,  H05K3/0017 ,  H05K2201/037 ,  H05K2201/0394 ,  H05K2201/09036 ,  H05K2201/09981

Abstract: A method is provided for forming a waveguide in a printed circuit board. This may include forming a trench in a printed circuit board substrate and forming at least one metalized surface along the trench. A metalized capping surface may be provided over the trench so as to form the waveguide structure.

Abstract translation: 提供了一种用于在印刷电路板中形成波导的方法。 这可以包括在印刷电路板基板中形成沟槽并沿着沟槽形成至少一个金属化表面。 可以在沟槽上方设置金属化封盖表面，以便形成波导结构。

公开(公告)号：US20040104793A1

公开(公告)日：2004-06-03

申请号：US10713222

申请日：2003-11-17

Inventor： Shinichi Tamura ,  Atsushi Saitoh ,  Taiyo Nishiyama ,  Takatoshi Kato ,  Hiroaki Tanaka

IPC: H01P003/12

CPC classification number: H01P11/002 ,  H01P3/122

Abstract: A waveguide, a high-frequency circuit, and a high-frequency circuit device having the waveguide are provided. The waveguide includes two conductor plates each of which has a surface having a groove. At least one of the conductor plates has protrusions extending from the surface at both sides of the groove. The two conductor plates are in contact with each other such that the grooves face each other. Screws disposed between the protrusions and bumps, which are formed outside the protrusions on the conductor plate, fasten the conductor plates with a predetermined pressure.

Abstract translation: 提供了具有波导的波导，高频电路和高频电路装置。 波导包括两个导体板，每个导体板具有一个具有凹槽的表面。 至少一个导体板具有从槽的两侧的表面延伸的突起。 两个导体板彼此接触，使得沟槽彼此面对。 设置在形成在导体板上的突起外侧的突起和凸起之间的螺钉以预定压力紧固导体板。

公开(公告)号：US06630876B1

公开(公告)日：2003-10-07

申请号：US09885578

申请日：2001-06-20

Applicant: Michael J. Noyes ,  Lee Mancheong Edouard Lee-Yow

Inventor： Michael J. Noyes ,  Lee Mancheong Edouard Lee-Yow

IPC: H01P312

CPC classification number: H01P11/002 ,  H01P11/001

Abstract: An “inside out” process is used to make RF antennas and components or higher frequency components and/or optics. This invention is especially useful for spaceflight components requiring high performance at low weight, components requiring high specific stiffness and/or strength and components requiring high performance, precision or stability. An electroformed single or multi layer of metal, such as copper, is applied to a reusable or disposable mandrel. Additional metal or composite components and/or pieces may be attached to the electroform by means of further electroforming, and/or applying adhesive and/or soldering. Any composite material (for example, fiberglass or carbon fiber reinforced plastic) is then applied selectively or uniformly around the electroform and/or additional components for structural reinforcement, and/or enhancement of thermal stability and/or thermal conductivity. The mandrel is then removed by physical or chemical means. Normal issues with plating of pre-formed composites are avoided with this technique. Adhesion over temperature and humidity extremes, surface finish, uniform metalization thickness, and surface electrical conductivity are all vastly improved over equivalent electroplated composites.

Abstract translation: 使用“内向外”过程来制造RF天线和组件或更高频率的组件和/或光学器件。 本发明特别适用于需要高重量的高性能的空间部件，需要高比刚度和/或强度的部件以及需要高性能，精度或稳定性的部件。 将电铸的单层或多层金属（例如铜）施加到可重复使用的或一次性的心轴上。 另外的金属或复合部件和/或片可以通过进一步的电铸，和/或施加粘合剂和/或焊接而附接到电铸。 然后，任何复合材料（例如，玻璃纤维或碳纤维增强塑料）选择性或均匀地围绕电铸和/或附加组分施加结构增强，和/或增强热稳定性和/或导热性。 然后通过物理或化学方法去除心轴。 通过这种技术避免了预形成复合材料的电镀的正常问题。 温度和湿度极限的附着力，表面光洁度，均匀的金属化厚度和表面电导率都比相当的电镀复合材料大大提高。

公开(公告)号：US06602429B1

公开(公告)日：2003-08-05

申请号：US09642706

申请日：2000-08-17

Applicant: Christopher Mann

Inventor： Christopher Mann

IPC: B44C122

CPC classification number: H01P11/002

Abstract: A waveguide structure is fabricated by patterning active elements on a semiconductor wafer (21). The upper surface of the wafer (21) and the active elements are then coated by a dissolvable positive resist polymer. The polymer is etched using conventional techniques to produce a former for the structure of the waveguide channel and subsequently the polymer former is coated (26) and electroformed (27) using a suitable metallic material. Finally, the polymer former is dissolved leaving an open channel (25) the boundaries of which are defined by the electroformed structure. The waveguide structure has the advantage that the active elements are integral with the waveguide structure and lie in a common fabrication plane which means that if the depth of the waveguide varies the active elements remain in the same plane. The waveguide structure is particularly suited for use at terahertz frequencies.

Abstract translation: 通过在半导体晶片（21）上构图有源元件来制造波导结构。 然后将晶片（21）的上表面和有源元件用可溶解的正性抗蚀剂聚合物涂覆。 使用常规技术蚀刻聚合物以产生用于波导通道结构的前体，随后使用合适的金属材料涂覆聚合物成型体（26）和电铸（27）。 最后，聚合物成型体溶解留下开口通道（25），其边界由电铸结构限定。 波导结构具有的优点是有源元件与波导结构成一体，并且位于公共制造平面中，这意味着如果波导的深度改变了有源元件保持在同一平面中。 波导结构特别适用于太赫兹频率。

公开(公告)号：US20020144392A1

公开(公告)日：2002-10-10

申请号：US09825624

申请日：2001-04-04

Inventor： Marc St. John ,  Barre Lankford ,  Steve Stowell

IPC: H01Q013/00 ,  H01P011/00

CPC classification number: H01Q13/0283 ,  H01P1/161 ,  H01P1/213 ,  H01P11/00 ,  H01P11/002 ,  Y10T29/49016

Abstract: A waveguide and a method for assembling the same are provided. The waveguide comprises a first half and a second half. A gasket is applied to a first mating surface of the first half. The first mating surface of the first half is aligned with a second mating surface of the second half. The gasket is positioned between the first mating surface of the first half and the second mating surface of the second half. The first half is fastened to the second half to form the assembled waveguide.

Abstract translation: 提供了一种波导及其组装方法。 波导包括第一半和第二半。 将垫圈施加到前半部分的第一配合表面。 第一半部的第一配合表面与第二半部的第二配合表面对齐。 垫片位于第一半部的第一配合表面和第二半部的第二配合表面之间。 前半部分被固定到第二个半部以形成组装的波导。