Electronic component array and method of manufacturing electronic component array

    公开(公告)号:US11708204B2

    公开(公告)日:2023-07-25

    申请号:US17017744

    申请日:2020-09-11

    发明人: Yasuhiro Shimizu

    摘要: An electronic component array includes a base tape including paper and having approximately elongated and substantially planar shape, the base tape being provided with a plurality of accommodation recesses provided in a longitudinal direction of the base tape; a plurality of electronic components; and a cover tape. The electronic component array includes a first bonding portion in which openings of the respective accommodation recesses are covered by the cover tape in a state where the electronic components are included in the respective accommodation recesses, and a second bonding portion in which openings of the respective accommodation recesses are covered by the cover tape in a state where the electronic components are not included in the respective accommodation recesses. A peel strength of the second bonding portion is about 10% or more and about 70% or less of a peel strength of the first bonding portion.

    Component mounting system and tape scraps collecting device

    公开(公告)号:US11584552B2

    公开(公告)日:2023-02-21

    申请号:US17647196

    申请日:2022-01-06

    摘要: A component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.

    Component mounting system and tape scraps collecting device

    公开(公告)号:US11254456B2

    公开(公告)日:2022-02-22

    申请号:US16930458

    申请日:2020-07-16

    摘要: There is provided a component mounting system including: a component mounting device group in which a plurality of component mounting devices that mount components supplied to a board transported in from an upstream side by a tape feeder and transport out the board to a downstream side, and cut a carrier tape after supplying the components by a cutter device and discharge scraps of carrier tape, are installed on a floor surface while being arranged in a direction of conveying the board; a main conveyor that is installed along an arrangement direction of the plurality of component mounting devices in a region on the floor surface under the component mounting device group, and transports the scraps of carrier tape discharged from each of the plurality of component mounting devices; and a scraps storage that is installed outside the region and stores the scraps of carrier tape transported by the main conveyor.

    Cover tape feeder for a tape-and-reel system

    公开(公告)号:US11203450B2

    公开(公告)日:2021-12-21

    申请号:US16410673

    申请日:2019-05-13

    申请人: NEXPERIA B.V.

    摘要: A tape-and-reel system for processing components is disclosed. In the embodiment, the tape-and-reel system includes a first carrier tape reel for holding unloaded carrier tape, a component loading system for loading components into pockets of the unloaded carrier tape, an air-guided cover tape feeder through which cover tape travels, an alignment tool for guiding the cover tape into alignment with the loaded carrier tape and adhering the cover tape to the loaded carrier tape to secure the components into the loaded carrier tape, and a second carrier tape reel for holding the loaded carrier tape.

    PORTION-WISE FILLING OF A RESERVOIR WITH BULK COMPONETS

    公开(公告)号:US20200170153A1

    公开(公告)日:2020-05-28

    申请号:US16776616

    申请日:2020-01-30

    摘要: A magazine (200) is described for portion-wise receiving individualized bulk electronic components (298). The magazine (200) comprises (a) a receiving structure (110) which comprises multiple closable receiving cavities (112, 112a), which are arranged along a longitudinal axis (100a) of the receiving structure (110); (b) a cover structure (120) which is arranged at an upper side of the receiving structure (110), displaceable along the longitudinal axis (100a), so that in a closed position of the cover structure (120) all receiving cavities (112, 112a) are covered and in one opening position of multiple opening positions at least one receiving cavity (112) is free; and (c) a closure foil (225) which encompasses the cover structure (120) along the longitudinal axis (100a) in the form of a closed tape, wherein at least a part of the closure foil (225) is releasably connected to the receiving structure (110). Further, a device (430) is described for portion-wise transferring components (298) from one such magazine (200) into a reservoir (490) for a component supply device. Further, a method is described for portion-wise transferring components from one such magazine (200) into the one such reservoir (490).

    Backend taping using fluid assisted fixation

    公开(公告)号:US10600672B2

    公开(公告)日:2020-03-24

    申请号:US15283876

    申请日:2016-10-03

    申请人: Nexperia B.V.

    摘要: A method comprising; transferring a holding liquid into at least one pocket of a carrier tape, the at least one pocket comprising a recess within the carrier tape configured to receive an electronic component; placing an electronic component into the at least one pocket whereby the holding liquid acts to retain the electronic component within the pocket; and applying a sealing tape over the carrier tape to close the pocket with the electronic component therein.

    Carrier tape, method for manufacturing same, and method for manufacturing RFID tag

    公开(公告)号:US10360492B2

    公开(公告)日:2019-07-23

    申请号:US16124393

    申请日:2018-09-07

    发明人: Noboru Kato

    摘要: A method for manufacturing a carrier tape housing electronic components with seal materials includes preparing a tape-shaped main body including housing holes penetrating from one surface to other surface along a longitudinal direction, preparing a tape-shaped seal material including an adhesive layer on the one surface and including pairs of terminal electrodes on the adhesive layer, affixing the adhesive layer to the other surface such that respective portions of the paired terminal electrodes are located within each of the housing holes in a planar view, forming cuts in the tape-shaped seal material to separate portions defining and functioning as the seal materials including portions overlapping with the respective housing holes in a planar view from the other portions, and providing an electronic component into each housing hole and connecting the respective portions of the paired terminal electrodes located within each of the housing holes to the electronic component.