公开(公告)号：US11426989B2

公开(公告)日：2022-08-30

申请号：US16391719

申请日：2019-04-23

申请人： CORNING OPTICAL COMMUNICATIONS LLC

发明人： Stephan Lvovich Logunov ,  Alexander Mikhailovich Streltsov

IPC分类号： B32B37/06 ,  B32B37/04 ,  B32B37/14 ,  B23K26/21 ,  B23K26/244 ,  B23K26/324 ,  C03B23/20 ,  C03B23/203 ,  C03B23/22 ,  C03B23/207 ,  C03C27/06 ,  C03C23/00 ,  B32B7/04 ,  B23K103/00

摘要： Methods of making a transparent glass-based article including at least two transparent glass-based substrates and a laser-induced bond therebetween. Methods include arranging the two transparent glass-based substrates relative to each other to form a contact area. Methods also include providing a laser beam contiguous the contact area to bond the two transparent glass-based substrates.

公开(公告)号：US20210230041A1

公开(公告)日：2021-07-29

申请号：US17161278

申请日：2021-01-28

申请人： SCHOTT AG

发明人： Frank Gindele ,  Christian Rakobrandt ,  Kazuhito Miyawaki ,  Robert Hettler ,  Takahisa Uchida

IPC分类号： C03B23/203 ,  C03B23/02 ,  C25D3/12 ,  H01L33/00 ,  H01L33/56

摘要： A method is provided for producing a patterned glass wafer for packaging electronic devices in a wafer assembly. The method includes placing a glass sheet between two mold halves and heating until the glass sheet softens, while the mold halves are pressed against one another so that the glass sheet is reshaped and forms a patterned glass wafer. The first mold half has an array of projections and the second mold half has an array of recesses. The mold halves are arranged and shaped so that the recesses and projections oppose each other. The projections introduce cavities into the glass sheet during the reshaping and with the glass flowing into the recesses of the second mold half during the reshaping. The recesses are deep enough for the glass to at least partially not come in contact therewith and to form a convexly shaped glass surface in each recess.

公开(公告)号：US10821707B2

公开(公告)日：2020-11-03

申请号：US16413398

申请日：2019-05-15

申请人： VAON, LLC

发明人： Henry B Steen

IPC分类号： C03B23/203 ,  B32B17/06 ,  B32B3/26 ,  B32B37/20 ,  B32B38/00 ,  G01N30/60 ,  H04M1/02 ,  G01N30/02

摘要： The present invention generally relates to multi-layer, flat glass structures and a method of manufacturing multi-layer, flat glass structures.

公开(公告)号：US10648491B2

公开(公告)日：2020-05-12

申请号：US16273397

申请日：2019-02-12

申请人： Palo Alto Research Center Incorporated

发明人： Scott J. H. Limb ,  Gregory L. Whiting

IPC分类号： C03C21/00 ,  F16B1/00 ,  B32B17/00 ,  C03C27/06 ,  C03C27/10 ,  C03B27/00 ,  C03B23/203 ,  C03B23/20 ,  C03C15/00 ,  C03C27/04 ,  B32B17/10

摘要： A stress-engineered frangible structure includes multiple discrete glass members interconnected by inter-structure bonds to form a complex structural shape. Each glass member includes strengthened (i.e., by way of stress-engineering) glass material portions that are configured to transmit propagating fracture forces throughout the glass member. Each inter-structure bond includes a bonding member (e.g., glass-frit or adhesive) connected to weaker (e.g., untreated, unstrengthened, etched, or thinner) glass member region(s) disposed on one or both interconnected glass members that function to reliably transfer propagating fracture forces from one glass member to other glass member. An optional trigger mechanism generates an initial fracture force in a first (most-upstream) glass member, and the resulting propagating fracture forces are transferred by way of inter-structure bonds to all downstream glass members. One-way crack propagation is achieved by providing a weaker member region only on the downstream side of each inter-structure bond.

公开(公告)号：US10457608B2

公开(公告)日：2019-10-29

申请号：US16182784

申请日：2018-11-07

申请人： Murata Manufacturing Co., Ltd.

发明人： Seiji Fujita

IPC分类号： C04B37/04 ,  H05K3/46 ,  B32B17/06 ,  C03C14/00 ,  C04B37/00 ,  H05K1/03 ,  H05K1/11 ,  H01L23/538 ,  C03C3/064 ,  C03C3/091 ,  C03C12/00 ,  H01L23/15 ,  C03B23/203 ,  H05K1/09 ,  H05K1/18

摘要： A multilayer ceramic substrate that includes a surface layer portion positioned on an internal layer portion, and a surface layer electrode on a surface of the surface layer portion. The surface layer portion includes a first layer next to the internal layer portion, and the internal layer portion includes a second layer next to the first layer. The thermal expansion coefficient of the first layer is lower than the thermal expansion coefficient of the second layer. The first layer and the second layer each contain glass containing 40 weight % to 65 weight % of MO, where MO is at least one selected from CaO, MgO, SrO, and/or BaO); 35 weight % to 60 weight % of alumina, and 1 weight % to 10 weight % of at least one metal oxide selected from CuO and/or Ag2O.

公开(公告)号：US20190263708A1

公开(公告)日：2019-08-29

申请号：US16307797

申请日：2017-06-06

申请人： CORNING INCORPORATED

发明人： Dana Craig Bookbinder ,  David Alan Deneka ,  Paul Bennett Dohn ,  Paul Oakley Johnson ,  William Edward Lock ,  David John McEnroe ,  Pushkar Tandon ,  Natesan Venkataraman ,  Sam Samer Zoubi

IPC分类号： C03B23/203 ,  C03B23/03 ,  C03B23/025

摘要： According to one or more embodiments described herein, a three-dimensional laminate glass article may be manufactured by a process which may include heating a glass stack including at least two glass sheets that are unbonded with one another at a first temperature range, fusing the first glass sheet with the second glass sheet by heating the glass stack at a second temperature range, and shaping the glass stack. The first temperature range may be from about 150° C. to about 400° C. for a first period of time of at least about 5 minutes. The second temperature range may be from about 400° C. to about 1200° C.

公开(公告)号：US20190074476A1

公开(公告)日：2019-03-07

申请号：US16083790

申请日：2017-03-08

申请人： CORNING INCORPORATED

发明人： Leonard Charles Dabich, II ,  Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov

IPC分类号： H01L51/52 ,  B23K26/20 ,  C03C3/247 ,  B32B7/04 ,  B32B17/06 ,  C03C3/14 ,  C03C3/16 ,  C03C3/23 ,  C03C4/00 ,  C03C8/24 ,  C03B23/203 ,  C03C27/08 ,  C03C27/06 ,  C03C23/00 ,  C03C3/12 ,  H01L51/00 ,  B32B37/06

摘要： Disclosed herein are sealed devices comprising a first substrate, a second substrate, an inorganic film between the first and second substrates, and at least one weld region comprising a bond between the first and second substrates. The weld region can comprise a chemical composition different from that of the inorganic film and the first or second substrates. The sealed devices may further comprise a stress region encompassing at least the weld region, in which a portion of the device is under a greater stress than the remaining portion of the device. Also disclosed herein are display and electronic components comprising such sealed devices.

公开(公告)号：US10202990B2

公开(公告)日：2019-02-12

申请号：US16025573

申请日：2018-07-02

申请人： Palo Alto Research Center Incorporated

发明人： Scott J. H. Limb ,  Gregory L. Whiting

IPC分类号： C03C21/00 ,  F16B1/00 ,  C03B27/00 ,  C03C27/10 ,  C03C27/06 ,  B32B17/00 ,  C03C27/04 ,  C03C15/00 ,  C03B23/203 ,  C03B23/20 ,  B32B17/10

摘要： A stress-engineered frangible structure includes multiple discrete glass members interconnected by inter-structure bonds to form a complex structural shape. Each glass member includes strengthened (i.e., by way of stress-engineering) glass material portions that are configured to transmit propagating fracture forces throughout the glass member. Each inter-structure bond includes a bonding member (e.g., glass-frit or adhesive) connected to weaker (e.g., untreated, unstrengthened, etched, or thinner) glass member region(s) disposed on one or both interconnected glass members that function to reliably transfer propagating fracture forces from one glass member to other glass member. An optional trigger mechanism generates an initial fracture force in a first (most-upstream) glass member, and the resulting propagating fracture forces are transferred by way of inter-structure bonds to all downstream glass members. One-way crack propagation is achieved by providing a weaker member region only on the downstream side of each inter-structure bond.

公开(公告)号：US10195825B2

公开(公告)日：2019-02-05

申请号：US15521662

申请日：2015-10-29

申请人： Corning Incorporated

发明人： Satish Chandra Chaparala

IPC分类号： B32B3/00 ,  B32B17/06 ,  C03C15/00 ,  C03B17/02 ,  C03B23/203 ,  B24C1/04 ,  C03C3/085 ,  C03C3/087 ,  C03C3/091 ,  C03C3/093 ,  C03C8/02 ,  C03C19/00 ,  C03C23/00 ,  B32B3/02 ,  C03B17/06 ,  C03C13/00

摘要： A method for strengthening an edge of a glass laminate including a glass core layer positioned between a first glass clad layer and a second glass clad layer may include forming a channel in the edge of the glass laminate. Sidewalls of the channel may be formed from the first glass clad layer and the second glass clad layer. Glass filler material having a filler coefficient of thermal expansion greater than a core coefficient of thermal expansion may be positioned in the channel. The glass filler material and the sidewalls of the channel may be fused to the second glass clad layer thereby forming an edge cap over the channel. The edge of the glass laminate is under compressive stress after the glass filler material is enclosed in the channel.

公开(公告)号：US10138162B2

公开(公告)日：2018-11-27

申请号：US14380746

申请日：2013-02-15

申请人： USHIO DENKI KABUSHIKI KAISHA

发明人： Akira Kato ,  Kinichi Morita ,  Shinji Suzuki

IPC分类号： C03C27/06 ,  C03B20/00 ,  C03C23/00 ,  C30B29/18 ,  C30B33/06 ,  C03C27/00 ,  C03B23/203

摘要： Vacuum ultraviolet light with a wavelength of 200 nm or less is applied on the joining surfaces of first and second workpieces made from a crystal substrate and a glass substrate, or a glass substrate and a glass substrate from a light irradiation unit. The workpieces are conveyed to a workpiece cleaning and laminating mechanism by a conveyance mechanism, the joining surfaces are subjected to mega-sonic cleaning as needed, and the workpieces are aligned with the joining surfaces thereof facing each other, and laminated such that the joining surfaces are in contact with each other. After being laminated, the laminated workpieces are conveyed to a workpiece heating mechanism and heated to increase the workpiece temperature to a predetermined temperature, and this temperature is maintained until joining is completed. The laminated workpieces are brought into a thermally expanded state upon heating, and are joined in this state.