公开(公告)号：US08896281B2

公开(公告)日：2014-11-25

申请号：US12032211

申请日：2008-02-15

申请人： Robert Wrathall

发明人： Robert Wrathall

IPC分类号： G05F1/00 ,  H02M3/158

CPC分类号： H02M3/158 ,  H02M1/08 ,  H02M3/1588 ,  H02M2001/0022 ,  Y02B70/1466

摘要： A method for controlling a switching voltage regulator that includes generating a feedback voltage that is proportional to the output voltage of the voltage regulator; generating a voltage proportional to the duty-cycle of the inductor charging and discharging phases as a function of the difference between the feedback voltage and a reference voltage; and adding a dominate pole and two zeros to the function used to generate the voltage proportional to the duty-cycle of the inductor charging and discharging phases.

摘要翻译： 一种用于控制开关电压调节器的方法，包括产生与所述电压调节器的输出电压成比例的反馈电压; 产生与电感器充电和放电相位的占空比成比例的电压，作为反馈电压和参考电压之间的差值的函数; 并将主要极点和两个零点添加到用于产生与电感器充电和放电阶段的占空比成比例的电压的功能。

公开(公告)号：US20140203870A1

公开(公告)日：2014-07-24

申请号：US14087555

申请日：2013-11-22

申请人： Advanced Analogic Technologies Incorporated

发明人： Richard K. Williams

IPC分类号： H03F3/217 ,  H03F3/185

CPC分类号： H01L29/7811 ,  H01L23/3677 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L27/092 ,  H01L29/407 ,  H01L29/42372 ,  H01L29/7802 ,  H01L29/7813 ,  H01L2223/6644 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12035 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H03F1/0205 ,  H03F3/185 ,  H03F3/2171 ,  H03F3/2173 ,  H03F3/68 ,  H03F2200/03 ,  H03F2200/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A stereo class-D audio system includes a first die including four monolithically integrated NMOS high-side devices and a second a second die including, four monolithically integrated PMOS low-side devices. The audio system also includes a set of electrical contacts for connecting the high and low-side devices to components within the a stereo class-D audio system, the set of electrical contacts including at least one supply contact for connecting the drains of the high-side devices to a supply voltage (Vcc) and at least one ground contact for connecting the drains of the low-side devices to ground, the electrical contacts also including respective contacts for each source of the high and low-side devices allowing the source of each high-side device to be connected to the source of a respective low-side device to form two H-bridge circuits.

摘要翻译： 立体声D类音频系统包括包括四个单片集成NMOS高侧器件的第一裸片和包括四个单片集成PMOS低侧器件的第二裸片。 音频系统还包括一组用于将高侧和低端设备连接到立体声D类音频系统内的组件的电触点，该组触点包括至少一个电源触点， 侧端装置到电源电压（Vcc）和至少一个用于将低侧装置的漏极连接到地的接地触点，电触点还包括用于高端和低侧装置的每个源的相应触点， 每个高侧装置连接到相应的低侧装置的源极以形成两个H桥电路。

公开(公告)号：US20140055101A1

公开(公告)日：2014-02-27

申请号：US13947571

申请日：2013-07-22

申请人： ADVANCED ANALOGIC TECHNOLOGIES INCORPORATED

发明人： Bruno Ferrario

IPC分类号： H02J7/00

CPC分类号： H02J7/00 ,  G03B15/05 ,  G03B2215/05 ,  H02J7/345 ,  H05B33/0815

摘要： Mobile devices have limited power sources. In some cases, such as camera flash operations in cell phones or digital cameras, the power required to provide bright illumination is significant and exceeding the battery voltage level. In order to supply burst power or continuous high power to light sources, such as white LEDs (light emitting diodes), mobile devices typically employ charge storage functioning as energy reservoir that can supply the required power. One such charge storage is a supercapacitor that can supply the needed power repeatedly by discharging and recharging. Various embodiments of the present invention include devices and methods for providing the charge energy and controlling the charge and discharge operations.

摘要翻译： 移动设备的电源有限。 在某些情况下，例如手机或数码相机中的相机闪光灯操作，提供明亮照明所需的功率是显着的，超过电池电压电平。 为了向诸如白色LED（发光二极管）的光源提供突发电力或连续的大功率，移动设备通常采用充当能量储存器的电荷存储器，其能够提供所需的功率。 一个这样的电荷存储器是可以通过放电和再充电反复提供所需功率的超级电容器。 本发明的各种实施例包括用于提供充电能量并控制充电和放电操作的装置和方法。

公开(公告)号：US20140042997A1

公开(公告)日：2014-02-13

申请号：US14021579

申请日：2013-09-09

申请人： ADVANCED ANALOGIC TECHNOLOGIES INCORPORATED

发明人： Kevin D'Angelo

IPC分类号： G05F1/46

CPC分类号： G05F1/46 ,  H02M3/156 ,  H05B33/0815 ,  H05B33/0827 ,  H05B33/0848

摘要： An operational transconductance amplifier used in conjunction with a multiple chip voltage feedback technique allows multiple strings of LEDs and current sinks to be efficiently powered by a simple feedback oriented voltage regulator within an appliance. A connected series of differential amplifiers or multiplexors are used to monitor the voltages between the connected LEDs and the current sinks, in order to progressively determine the lowest voltage. The operational transconductance amplifier compares this voltage to a reference voltage and injects or removes current from the feedback node of a voltage regulator, thereby altering the voltage present at the feedback node. This causes the voltage regulator to adjust its output, ensuring that the current sinks of the LED strings have adequate voltage with which to function, even as the LEDs have different forward voltages and the strings are asynchronously enabled and disabled.

摘要翻译： 与多芯片电压反馈技术结合使用的运算跨导放大器允许多个LED串和电流吸收器由设备内的简单的反馈取向的电压调节器有效地供电。 使用连接的差分放大器或多路复用器系列来监视连接的LED和电流吸收器之间的电压，以便逐步确定最低电压。 操作跨导放大器将该电压与参考电压进行比较，并从电压调节器的反馈节点注入或去除电流，从而改变反馈节点处的电压。 这使得电压调节器调节其输出，确保LED串的电流吸收器具有足够的电压，即使LED具有不同的正向电压，并且串是异步启用和禁用的。

公开(公告)号：US20140035133A1

公开(公告)日：2014-02-06

申请号：US13959197

申请日：2013-08-05

申请人： ADVANCED ANALOGIC TECHNOLOGIES INCORPORATED

发明人： Richard K. Williams

IPC分类号： H01L23/498

CPC分类号： H01L23/49811 ,  H01L23/3107 ,  H01L23/4334 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49572 ,  H01L24/73 ,  H01L2224/16145 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00

摘要： Thermal transfer from a silicon-on-insulator (SOI) die is improved by mounting the die in a bump-on-leadframe manner in a semiconductor package, with solder or other metal bumps connecting the active layer of the SOI die to metal leads used to mount the package on a printed circuit board or other support structure.

摘要翻译： 通过以半导体封装中的凸起引线框架方式将裸片安装在半导体封装中，通过将SOI裸片的有源层连接到金属引线上的焊料或其它金属凸块来改善来自绝缘体上硅（SOI）裸片的热传递 将封装安装在印刷电路板或其他支撑结构上。

公开(公告)号：US20130200952A1

公开(公告)日：2013-08-08

申请号：US13788336

申请日：2013-03-07

申请人： ADVANCED ANALOGIC TECHNOLOGIES INCORPORATED

发明人： Richard K. Williams

IPC分类号： H03F3/217

CPC分类号： H01L29/7811 ,  H01L23/3677 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L27/092 ,  H01L29/407 ,  H01L29/42372 ,  H01L29/7802 ,  H01L29/7813 ,  H01L2223/6644 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12035 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H03F1/0205 ,  H03F3/185 ,  H03F3/2171 ,  H03F3/2173 ,  H03F3/68 ,  H03F2200/03 ,  H03F2200/351 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A stereo class-D audio system includes a first die including four monolithically integrated NMOS high-side devices and a second a second die including four monolithically integrated PMOS low-side devices. The audio system also includes a set of electrical contacts for connecting the high and low-side devices to components within the a stereo class-D audio system, the set of electrical contacts including at least one supply contact for connecting the drains of the high-side devices to a supply voltage (Vcc) and at least one ground contact for connecting the drains of the low-side devices to ground, the electrical contacts also including respective contacts for each source of the high and low-side devices allowing the source of each high-side device to be connected to the source of a respective low-side device to form two H-bridge circuits.

摘要翻译： 立体声D类音频系统包括包括四个单片集成NMOS高侧器件的第一裸片和包括四个单片集成PMOS低边器件的第二裸片。 音频系统还包括一组用于将高侧和低端设备连接到立体声D类音频系统内的组件的电触点，该组触点包括至少一个电源触点， 侧端装置到电源电压（Vcc）和至少一个用于将低侧装置的漏极连接到地的接地触点，电触点还包括用于高端和低侧装置的每个源的相应触点， 每个高侧装置连接到相应的低侧装置的源极以形成两个H桥电路。