Abstract:
A method of forming a conformal dielectric film having Si—N bonds on a semiconductor substrate by plasma enhanced chemical vapor deposition (PECVD) includes: introducing a nitrogen- and hydrogen-containing reactive gas and an additive gas into a reaction space inside which a semiconductor substrate is placed; applying RF power to the reaction space; and introducing a hydrogen-containing silicon precursor in pulses into the reaction space wherein a plasma is excited, thereby forming a conformal dielectric film having Si—N bonds on the substrate.
Abstract:
A method for managing a schedule as a supplementary function of a mobile communication terminal. The method is capable of efficiently managing schedule information such as anniversaries to be repeated every year. Further, the method is capable of conveniently making contact with another party by providing telephone numbers of the other party at the same time when the schedule information is provided to a user.
Abstract:
A method of forming device isolation regions on a trench-formed silicon substrate and removing residual carbon therefrom includes providing a flowable, insulative material constituted by silicon, carbon, nitrogen, hydrogen, oxygen or any combination of two or more thereof; forming a thin insulative layer, by using the flowable, insulative material, in a trench located on a semiconductor substrate wherein the flowable, insulative material forms a conformal coating in a silicon and nitrogen rich condition whereas in a carbon rich condition, the flowable, insulative material vertically grows from the bottom of the trenches; and removing the residual carbon deposits from the flowable, insulative material by multi-step curing, such as O2 thermal annealing, ozone UV curing followed by N2 thermal annealing.
Abstract:
A method of forming device isolation regions on a trench-formed silicon substrate and removing residual carbon therefrom includes providing a flowable, insulative material constituted by silicon, carbon, nitrogen, hydrogen, oxygen or any combination of two or more thereof; forming a thin insulative layer, by using the flowable, insulative material, in a trench located on a semiconductor substrate wherein the flowable, insulative material forms a conformal coating in a silicon and nitrogen rich condition whereas in a carbon rich condition, the flowable, insulative material vertically grows from the bottom of the trenches; and removing the residual carbon deposits from the flowable, insulative material by multi-step curing, such as O2 thermal annealing, ozone UV curing followed by N2 thermal annealing.
Abstract:
According to an example embodiment, a semiconductor memory device may include a memory core, input circuit, and/or an output circuit. The input circuit may be configured to generate second data from first data using latch circuits operating in response to input control signals enabled during different periods. The input circuit may be further configured to provide the second data to the memory core. The second data may have 2N times the number of bits of the first data, where N is a positive integer. The output circuit may be configured to generate fourth data from third data using latch circuits operating in response to output control signals enabled during different periods. The output circuit may be further configured to provide the fourth data to data output pins. The fourth data may have ½N times the number of bits of the third data. A method of inputting/outputting data is also provided.
Abstract:
A NAND gate, a NOR gate, an output buffer and method thereof. An example embodiment of the present invention is directed to a NAND gate, including a first transistor having a source to which a supply voltage is applied and a gate to which a ground voltage is applied, a first plurality of transistors connected in series between the first transistor and the ground voltage, gates of the first plurality of transistors receiving a first input signal, the first plurality of transistors including at least three transistors and a second plurality of transistors connected in series between the first transistor and the ground voltage, the second plurality of transistors not in series with the first plurality of transistors and including at least three transistors. Another example embodiment of the present invention is directed to a NOR gate including a first plurality of transistors connected in series with a supply voltage, the first plurality of transistors including first, second and third transistors, a second plurality of transistors connected in series with the supply voltage and not connected in series with the first plurality of transistors, the second plurality of transistors including fourth, fifth and sixth transistors and a seventh transistor connected between the third and sixth transistors and a ground voltage and having a gate connected to the supply voltage. The example NOR and NAND gates may be employed within the example output buffer. The example NOR and NAND gates may also be employed in the example method so as to reduce skew by attaining the same output characteristics.
Abstract:
A semiconductor memory device includes a primary output driver which outputs a data signal through an output terminal; a secondary output driver which is connected to the output terminal and performs a pre-emphasis operation; and a pre-emphasis signal generator which outputs a pre-emphasis signal to enable the secondary output driver The pre-emphasis signal generator includes a auto pulse generator which generates an auto pulse in response to a transition of a control signal; a delay circuit which receives the auto pulse output from the auto pulse generator, delays the auto pulse by a predetermined period, and outputs a pre-emphasis signal; and a delay control unit which applies a delay control signal to the delay circuit and controls a delay amount of the delay circuit.
Abstract:
A method of forming a dielectric layer, the method including sequentially forming a first oxide layer, a nitride layer, and a second oxide layer on a substrate by performing a plasma-enhanced atomic layer deposition process, wherein a first nitrogen plasma treatment is performed after forming the first oxide layer.
Abstract:
A process for synthesizing nano-sized rutile, anatase, or a mixture of rutile and anatase TiO2 powder. The process includes the steps of: 1) forming a Ti-peroxo complex by mixing H2O2 with a Ti compound, and 2) heating the Ti-peroxo complex at a temperature of above 50° C. A primary particle size of TiO2 particles, synthesized by the method, is below 50 nm, and an agglomerated particle size thereof after a washing/dry process is below about 10 μm. The major characteristics of the present invention are that it is a low temperature process, a highly concentrated synthesis, and high production yield of above 90%.
Abstract translation:合成纳米尺寸金红石,锐钛矿或金红石和锐钛矿TiO 2粉末的混合物的方法。 该方法包括以下步骤:1)通过将H 2 O 2与Ti化合物混合形成Ti-过氧配合物,和2)在高于50℃的温度下加热Ti-过氧配合物。合成的TiO 2颗粒的一次粒径 通过该方法,低于50nm,洗涤/干燥处理后的附聚粒径低于约10μm。 本发明的主要特征是低温工艺,高浓缩合成,高产率高于90%。
Abstract:
Disclosed herein is a touch panel. The touch panel 100 according to the present invention includes electrode patterns 110 disposed in parallel with each other in a first direction (A), wherein the electrode patterns are provided with opening portions 120 dividing the electrode patterns 110 into two portions, the opening portions 120 having a configuration 125 in which the opening portion moves N times in the first direction (A) while going to a second direction (B) that is vertical to the first direction (A), the configuration 125 being repeated M times. The touch panel allows the electrode patterns to have a single-layer structure by adopting the opening portions 120 in the electrode patterns 110, thereby making it possible to reduce the manufacturing costs of the touch panel and simplify the manufacturing process thereof.