公开(公告)号：US07638864B2

公开(公告)日：2009-12-29

申请号：US11695441

申请日：2007-04-02

Applicant: Ying-Cheng Wu ,  Chun-Hung Lin

Inventor： Ying-Cheng Wu ,  Chun-Hung Lin

IPC: H01L23/02

CPC classification number: H01L31/0203 ,  H01L24/48 ,  H01L24/85 ,  H01L27/14618 ,  H01L27/14627 ,  H01L31/0232 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/16195 ,  H01L2924/18165 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A digital camera module (100) includes a chip package (110) and a lens module (130), mounted on the chip package, for forming a focused image on the chip package. The chip package includes a supporter (112), a chip (114), a plurality of wires (116), a main adhesive (118), and a cover plate (119). The supporter includes a through hole defined therethrough and has a plurality of top contacts (1130) formed thereon around the through hole. The chip is disposed in the through hole and includes a plurality of pads (1144) arranged thereon. The wires electrically connect the pads to the top contacts. The main adhesive is applied to a gap between the chip and the supporter and fixes the chip to the supporter. The cover plate is adhered and supported on the main adhesive. A method for making the chip package is also provided.

Abstract translation: 数字照相机模块（100）包括安装在芯片封装上的芯片封装（110）和透镜模块（130），用于在芯片封装上形成聚焦图像。 芯片封装包括支撑件（112），芯片（114），多个电线（116），主粘合剂（118）和盖板（119）。 支撑件包括通过其定义的通孔，并且在通孔周围形成有多个顶部触头（1130）。 芯片设置在通孔中并且包括布置在其上的多个焊盘（1144）。 电线将焊盘电连接到顶部触点。 将主要粘合剂施加到芯片和支撑件之间的间隙，并将芯片固定到支撑件上。 盖板粘接并支撑在主粘合剂上。 还提供了制造芯片封装的方法。

公开(公告)号：US07626160B2

公开(公告)日：2009-12-01

申请号：US11617627

申请日：2006-12-28

Applicant: Ying-Cheng Wu ,  Chun-Hung Lin

Inventor： Ying-Cheng Wu ,  Chun-Hung Lin

IPC: H01J40/14

CPC classification number: H01L27/14618 ,  H01L27/14625 ,  H01L2224/8592

Abstract: An image sensor package (110) includes a base board (111), a supporter (113), an image sensor (112), a plurality of wires (114), a main adhesive (115) and a cover board (116). The supporter includes a through hole and a plurality of top pads (113c) formed around the through hole, and the supporter is mounted on the base board and electrically connected to the base board. The image sensor is mounted on the base board and received in the through hole, and the image sensor includes a sensing portion (112b) and a plurality of contacts (112a). The wires electrically connect the top pads to the contacts. The main adhesive is applied on the image sensor and surrounds the sensing portion. The cover board supported on the main adhesive, and the cover board and the main adhesive cooperatively enclose the sensing portion of the image sensor.

Abstract translation: 图像传感器封装（110）包括基板（111），支撑件（113），图像传感器（112），多根电线（114），主粘合剂（115）和盖板（116）。 支撑体包括通孔和形成在通孔周围的多个顶部焊盘（113c），并且支撑件安装在基板上并电连接到基板。 图像传感器安装在基板上并被接收在通孔中，图像传感器包括感测部分（112b）和多个触点（112a）。 电线将顶部焊盘电连接到触点。 主要粘合剂被施加在图像传感器上并且围绕感测部分。 支撑在主粘合剂上的盖板，盖板和主粘合剂协同地包围图像传感器的感测部分。

公开(公告)号：US07595839B2

公开(公告)日：2009-09-29

申请号：US11595331

申请日：2006-11-10

Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

IPC: H04N5/225

CPC classification number: H04N5/2254 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2924/01079 ,  H01L2924/16195 ,  H04N5/2253 ,  H01L2924/00014

Abstract: An image sensor chip packaging method includes: first, providing a carrier (20). The carrier includes a base (21) and a lead frame (23). The base has a chamber (214) defined therein. The lead frame has a plurality of conduction pieces (233). The conduction pieces of the lead frame are embedded in the base and are spaced from each other. An image sensor chip (30) is then mounted in the chamber. The image sensor has a photosensitive area (301) and a plurality of chip pads (302). A plurality of bonding wires (40) is then provided. Each wire electrically connects a corresponding chip pad of the image sensor chip and one of the exposed ends of a corresponding conduction piece of the carrier. A holder (50) having a holding cavity (54) is then provided. Finally, the carrier is then mounted in the holding cavity of the holder.

Abstract translation: 图像传感器芯片封装方法包括：首先提供载体（20）。 载体包括基座（21）和引线框架（23）。 底座具有限定在其中的腔室（214）。 引线框架具有多个导电件（233）。 引线框架的导电片被嵌入在基座中并且彼此间隔开。 然后将图像传感器芯片（30）安装在腔室中。 图像传感器具有感光区域（301）和多个芯片焊盘（302）。 然后提供多个接合线（40）。 每根线将图像传感器芯片的相应的芯片焊盘和载体的相应导电片的暴露端之一电连接。 然后提供具有保持腔（54）的保持器（50）。 最后，将载体安装在支架的保持腔中。

公开(公告)号：US07592197B2

公开(公告)日：2009-09-22

申请号：US11453456

申请日：2006-06-14

Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu

IPC: H01L21/00

CPC classification number: H01L27/14685 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: An image sensor package method includes the steps of: first, providing a carrier (30), which includes a base (24) and a leadframe (320). The base has a cavity therein and the leadframe includes a number of conductive pieces; Second, mounting an image sensor chip on the base and received in the cavity, the image sensor having a photosensitive area. Third, providing a plurality of wires, each electrically connects the image sensor chip and a corresponding one of the conductive pieces of the carrier. Fourth, applying an adhesive means around the image sensor chip that at least partially covers all the wires. Finally, mounting a transparent cover on the carrier, where an adhesive means fixes the cover in place.

Abstract translation: 图像传感器封装方法包括以下步骤：首先，提供包括基座（24）和引线框架（320）的载体（30）。 基座在其中具有空腔，引线框架包括多个导电件; 第二，将图像传感器芯片安装在基座上并被接纳在空腔中，图像传感器具有感光区域。 第三，提供多条导线，每个电线将图像传感器芯片和载体的相应导电片之一电连接。 第四，在图像传感器芯片周围施加至少部分地覆盖所有电线的粘合剂装置。 最后，将透明盖子安装在托架上，粘合剂将盖子固定在适当位置。

公开(公告)号：US20090153706A1

公开(公告)日：2009-06-18

申请号：US12100297

申请日：2008-04-09

Applicant: STEVEN WEBSTER ,  YING-CHENG WU ,  SHUO-WEI HUANG ,  SHIH-MIN LO

Inventor： STEVEN WEBSTER ,  YING-CHENG WU ,  SHUO-WEI HUANG ,  SHIH-MIN LO

IPC: H04N5/335

CPC classification number: H01L25/16 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/0232 ,  H01L2224/48091 ,  H01L2224/8592 ,  H04N5/2257 ,  H01L2924/00014

Abstract: An imaging module package includes a substrate, an imaging sensor chip, a functional unit, a housing, and a lens module positioned in the housing. The substrate defines an upper chamber extending through a top surface thereof, and a lower chamber extending through a bottom surface thereof. The imaging sensor chip is positioned in the upper chamber and is electrically connected to the substrate. The functional unit is positioned in the lower chamber and is electrically connected to the substrate. The housing is mounted on the top surface of the substrate and is disposed above the imaging sensor chip.

Abstract translation: 成像模块封装包括基板，成像传感器芯片，功能单元，壳体和位于壳体中的透镜模块。 衬底限定了通过其顶表面延伸的上室，以及延伸穿过其底表面的下室。 成像传感器芯片定位在上部腔室中并且电连接到衬底。 功能单元位于下腔室中，并与电极连接。 壳体安装在基板的顶表面上并且设置在成像传感器芯片的上方。

公开(公告)号：US20090135297A1

公开(公告)日：2009-05-28

申请号：US12019914

申请日：2008-01-25

Applicant: YING-CHENG WU ,  PANG-JUNG LIU ,  CHIEN-CHENG YAO ,  SHIH-MIN LO

Inventor： YING-CHENG WU ,  PANG-JUNG LIU ,  CHIEN-CHENG YAO ,  SHIH-MIN LO

IPC: H04N5/225 ,  G03B17/02

CPC classification number: H04N5/2253 ,  H04N5/2254 ,  H04N5/2257

Abstract: An exemplary camera module includes a substrate, a printed circuit board, an imaging sensor chip, and a lens module. The substrate defines a top surface and a recessed portion in the top surface. The printed circuit board defines a bottom surface soldered to the top surface of the substrate. The imaging sensor chip is received in the recessed portion of the substrate. The lens module is positioned above the imaging sensor chip, with an optical center thereof aligned with that of the imaging sensor chip.

Abstract translation: 示例性相机模块包括基板，印刷电路板，成像传感器芯片和透镜模块。 衬底在顶表面中限定顶表面和凹陷部分。 印刷电路板限定焊接到基板的顶表面的底表面。 成像传感器芯片被接收在基板的凹部中。 透镜模块位于成像传感器芯片上方，其光学中心与成像传感器芯片的光学中心对准。

公开(公告)号：US07521770B2

公开(公告)日：2009-04-21

申请号：US11862510

申请日：2007-09-27

Applicant: Ying-Cheng Wu ,  Kun-Hsiao Liu

Inventor： Ying-Cheng Wu ,  Kun-Hsiao Liu

IPC: H01L29/06 ,  H01L27/00 ,  H04N5/225 ,  H01J5/02

CPC classification number: H01L31/0203 ,  H01L31/02325 ,  H01L2224/48227 ,  H01L2924/3025 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An image capturing device includes an image sensor package and a lens module aligned with the image sensor package. The image sensor package includes a substrate, at least one passive component, an insulative layer, and an image sensor. The substrate has a surface facing an object side of the image capturing device, the surface defines a cavity therein. The at least one passive component is disposed within the cavity and electrically connected to the substrate. The insulative layer is received in the cavity and encases the at least one passive component. The image sensor is disposed on the insulative layer and electrically connected to the substrate. The holder has an end connecting with the barrel and an opposite end secured on the substrate.

Abstract translation: 图像捕获装置包括图像传感器封装和与图像传感器封装件对准的透镜模块。 图像传感器封装包括衬底，至少一个无源部件，绝缘层和图像传感器。 基板具有面向图像捕获装置的物体侧的表面，该表面在其中限定空腔。 所述至少一个无源部件设置在所述腔体内并电连接到所述基板。 绝缘层被接收在空腔中并且包围至少一个无源部件。 图像传感器设置在绝缘层上并与衬底电连接。 保持器具有与筒连接的端部，并且相对端固定在基底上。

公开(公告)号：US20080266822A1

公开(公告)日：2008-10-30

申请号：US11948526

申请日：2007-11-30

Applicant: YING-CHENG WU ,  KUN-HSIAO LIU

Inventor： YING-CHENG WU ,  KUN-HSIAO LIU

IPC: H05K1/18 ,  H05K1/16 ,  H05K3/30

CPC classification number: H05K1/183 ,  H05K1/141 ,  H05K3/284 ,  H05K3/3442 ,  H05K3/4611 ,  H05K3/4697 ,  H05K2201/043 ,  Y10T29/49128 ,  Y10T29/4913

Abstract: An electronic elements carrier includes a body, at least an electronic element and a filler. The body includes a substrate having a plate and a dam formed on the peripheral of plate, a conductive layer mounted on a surface of the dam, and at least a cavity defined by the plate and the dam of the substrate. The electronic element is disposed in the cavity of the body. The filler is received in the cavity of the substrate for encapsulating, sealing and protecting the electronic element.

Abstract translation: 电子元件载体包括主体，至少电子元件和填充物。 主体包括具有板和形成在板的周边上的坝的基板，安装在坝的表面上的导电层和至少由板和基板的坝限定的空腔。 电子元件设置在身体的空腔中。 填料被接收在衬底的空腔中，用于封装，密封和保护电子元件。

公开(公告)号：US07417327B2

公开(公告)日：2008-08-26

申请号：US11262907

申请日：2005-10-31

Applicant: Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu ,  Po-Chih Hsu

Inventor： Steven Webster ,  Ying-Cheng Wu ,  Kun-Hsieh Liu ,  Po-Chih Hsu

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/02 ,  H01L23/12

CPC classification number: H01L23/055 ,  H01L23/10 ,  H01L23/49805 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: An IC (integrated circuit) chip package includes a substrate (2), a chip (3), a plurality of bonding wires (32), and a cover (5). The substrate has a top surface, a bottom surface, a receiving chamber (23) defined therein, a plurality of solder pads (24) arranged around the top surface and the bottom surface, and a plurality of vias (25) having conductive material electrically connecting the top solder pads with the bottom solder pads defined therein. The chip is mounted in the receiving chamber, and has a plurality of chip solder pads arranged around a top surface thereof. The bonding wires respectively electrically connect the top solder pads of the substrate with the chip solder pads. The cover is fastened to the top surface of the substrate to cover the opening, and has a smaller profile than that of the substrate, thereby not cover a peripheral area of the top surface.

Abstract translation: IC（集成电路）芯片封装包括基板（2），芯片（3），多个接合线（32）和盖（5）。 衬底具有顶表面，底表面，限定在其中的接收室（23），围绕顶表面和底表面布置的多个焊盘（24），以及多个通孔（25），其具有导电材料 将顶部焊盘与其中限定的底部焊盘连接。 芯片安装在接收室中，并且具有围绕其顶表面布置的多个芯片焊盘。 接合线分别将衬底的顶部焊盘与芯片焊盘电连接。 盖被固定到基板的顶表面以覆盖开口，并且具有比基板更小的轮廓，从而不覆盖顶表面的周边区域。

公开(公告)号：US20080105819A1

公开(公告)日：2008-05-08

申请号：US11617627

申请日：2006-12-28

Applicant: YING-CHENG WU ,  CHUN-HUNG LIN

Inventor： YING-CHENG WU ,  CHUN-HUNG LIN

IPC: H01L31/0203 ,  H01L31/0232

CPC classification number: H01L27/14618 ,  H01L27/14625 ,  H01L2224/8592

Abstract: An image sensor package (110) includes a base board (111), a supporter (113), an image sensor (112), a plurality of wires (114), a main adhesive (115) and a cover board (116). The supporter includes a through hole and a plurality of top pads (113c) formed around the through hole, and the supporter is mounted on the base board and electrically connected to the base board. The image sensor is mounted on the base board and received in the through hole, and the image sensor includes a sensing portion (112b) and a plurality of contacts (112a). The wires electrically connect the top pads to the contacts. The main adhesive is applied on the image sensor and surrounds the sensing portion. The cover board supported on the main adhesive, and the cover board and the main adhesive cooperatively enclose the sensing portion of the image sensor.

Abstract translation: 图像传感器封装（110）包括基板（111），支撑件（113），图像传感器（112），多根电线（114），主粘合剂（115）和盖板（116）。 支撑体包括通孔和形成在通孔周围的多个顶部焊盘（113c），并且支撑件安装在基板上并电连接到基板。 图像传感器安装在基板上并被容纳在通孔中，图像传感器包括感测部分（112b）和多个触点（112a）。 电线将顶部焊盘电连接到触点。 主要粘合剂被施加在图像传感器上并且围绕感测部分。 支撑在主粘合剂上的盖板，盖板和主粘合剂协同地包围图像传感器的感测部分。