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    Headphone eartips with internal support components for outer eartip bodies
    51.
    发明授权
    Headphone eartips with internal support components for outer eartip bodies 有权

    公开(公告)号：US10979795B2

    公开(公告)日：2021-04-13

    申请号：US16983736

    申请日：2020-08-03

    Applicant: Apple Inc.

    Inventor： Ethan L. Huwe ,  Brad G. Boozer ,  Erik L. Wang ,  Phillip Qian

    IPC: H04R1/00 ,  H04R1/10

    Abstract: Headphone eartips with internal support components and methods for making the same are provided. Different support components may provide specific amounts and types of additional rigidity at specific portions of an exterior surface of an outer eartip body that may be expected to interface with specific portions of an ear canal geometry when an eartip subassembly is positioned within the ear canal, such that the eartip subassembly may conform to the various shapes of the ear canal while maintaining an acoustic seal.

    HEADPHONE EARTIPS WITH INTERNAL SUPPORT COMPONENTS FOR OUTER EARTIP BODIES
    53.
    发明申请
    HEADPHONE EARTIPS WITH INTERNAL SUPPORT COMPONENTS FOR OUTER EARTIP BODIES 审中-公开

    公开(公告)号：US20190141430A1

    公开(公告)日：2019-05-09

    申请号：US16148552

    申请日：2018-10-01

    Applicant: Apple Inc.

    Inventor： Ethan L. Huwe ,  Brad G. Boozer ,  Erik L. Wang ,  Phillip Qian

    IPC: H04R1/10

    Abstract: Headphone eartips with internal support components and methods for making the same are provided. Different support components may provide specific amounts and types of additional rigidity at specific portions of an exterior surface of an outer eartip body that may be expected to interface with specific portions of an ear canal geometry when an eartip subassembly is positioned within the ear canal, such that the eartip subassembly may conform to the various shapes of the ear canal while maintaining an acoustic seal.

    LIQUID INGRESS-REDIRECTING ACOUSTIC DEVICE RESERVOIR
    57.
    发明申请
    LIQUID INGRESS-REDIRECTING ACOUSTIC DEVICE RESERVOIR 审中-公开

    公开(公告)号：US20170280219A1

    公开(公告)日：2017-09-28

    申请号：US15621802

    申请日：2017-06-13

    Applicant: Apple Inc.

    Inventor： Phillip Qian ,  Edward Siahaan ,  Erik L. Wang ,  Esge B. Andersen

    IPC: H04R1/08

    CPC classification number: H04R1/086

    Abstract: An acoustic device such as a microphone or speaker is positioned with and coupled to a housing to connect an acoustic port of the acoustic device with an external opening of the housing. A reservoir is connected to the external opening via a bleed channel. The bleed channel may be less resistive to liquid ingress than the acoustic port. As such, the reservoir and bleed channel may redirect liquid from the external opening away from the acoustic port. In some implementations, the reservoir and/or the bleed channel may be defined by one or more acoustically permeable barriers such as meshes that cover the acoustic port, compressible materials such as foams that form a perimeter around the acoustic port, and/or adhesive layers that couple the acoustic device, the housing, and/or one or more other components.

    Electronic devices having stress concentrators for printed circuit boards
    60.
    发明授权
    Electronic devices having stress concentrators for printed circuit boards 有权
    具有用于印刷电路板的应力集中器的电子设备

    公开(公告)号：US09560749B2

    公开(公告)日：2017-01-31

    申请号：US14216916

    申请日：2014-03-17

    Applicant: Apple Inc.

    Inventor： Craig M. Stanley ,  Phillip Qian ,  Erik L. Wang

    IPC: H05K1/16 ,  H05K1/02 ,  H05K3/28 ,  H05K1/11 ,  H05K1/14 ,  H05K3/46

    CPC classification number: H05K1/028 ,  H05K1/0278 ,  H05K1/11 ,  H05K1/118 ,  H05K1/14 ,  H05K1/147 ,  H05K1/148 ,  H05K3/284 ,  H05K3/4691 ,  H05K2201/10053 ,  H05K2203/1316

    Abstract: An electronic device may have circuitry mounted on a printed circuit board. The circuitry may include electronic components such as integrated circuits, sensors, and switches that are sensitive to bending-induced stress in the printed circuit board. An overmolded plastic stress concentrator may be overmolded over the printed circuit board and the circuitry on the printed circuit board. A flexible plastic body may be used to enclose the stress concentrator and printed circuit board. The plastic body, stress concentrator, and printed circuit board may be elongated along a longitudinal axis. The stress concentrator may have unbent regions in which the printed circuit board is prevented from flexing and enhanced flexibility regions. Sensitive circuitry may be located in the unbent regions to prevent the sensitive circuitry from being exposed to bending stress.

    Abstract translation: 电子设备可以具有安装在印刷电路板上的电路。 该电路可以包括对印刷电路板中的弯曲引起的应力敏感的电子部件，例如集成电路，传感器和开关。 包覆成型的塑料应力集中器可以在印刷电路板和印刷电路板上的电路上包覆成型。 柔性塑料体可用于封闭应力集中器和印刷电路板。 塑料体，应力集中器和印刷电路板可以沿着纵向轴线伸长。 应力集中器可以具有其中防止印刷电路板弯曲和增强柔性区域的未吸附区域。 敏感电路可以位于未吸附区域中，以防止敏感电路暴露于弯曲应力。

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