公开(公告)号：US07604889B2

公开(公告)日：2009-10-20

申请号：US10960024

申请日：2004-10-08

申请人： Akio Nakamura ,  Junichi Akama ,  Yuriko Segawa

发明人： Akio Nakamura ,  Junichi Akama ,  Yuriko Segawa

IPC分类号： H01M2/00

CPC分类号： H01M8/1011 ,  H01M8/04082 ,  H01M8/04201 ,  H01M8/04208 ,  H01M8/04223 ,  H01M8/04225 ,  H01M2250/30 ,  Y02B90/18 ,  Y02E60/523

摘要： A liquid fuel cell system is disclosed. The liquid fuel cell system includes a liquid fuel cell unit and a liquid fuel cartridge that can be connected to the liquid fuel cell unit. The liquid fuel cell unit and the liquid fuel cartridge each include a valve unit. The liquid fuel cartridge is connected to the liquid fuel cell unit so as to pour and supply liquid fuel that is a methanol solution from the liquid fuel cartridge to the liquid fuel cell unit. Using the supplied liquid fuel, the liquid fuel cell unit generates power to charge a battery. After the charging, both of the valve units are opened to return the liquid fuel remaining in the liquid fuel cell unit back to the liquid fuel cartridge, and thus, the liquid fuel cell unit is emptied.

摘要翻译： 公开了一种液体燃料电池系统。 液体燃料电池系统包括可连接到液体燃料电池单元的液体燃料电池单元和液体燃料盒。 液体燃料电池单元和液体燃料盒各自包括阀单元。 液体燃料盒与液体燃料电池单元连接，以便将来自液体燃料盒的甲醇溶液的液体燃料倒入液体燃料电池单元。 使用所提供的液体燃料，液体燃料电池单元产生用于对电池充电的电力。 在充电之后，打开两个阀单元，将残留在液体燃料电池单元中的液体燃料返回到液体燃料盒，从而将液体燃料电池单元排空。

公开(公告)号：USD585467S1

公开(公告)日：2009-01-27

申请号：US29300816

申请日：2008-05-19

申请人： Norihiro Takanashi ,  Shigenori Emoto ,  Akio Nakamura

设计人： Norihiro Takanashi ,  Shigenori Emoto ,  Akio Nakamura

公开(公告)号：US07443384B2

公开(公告)日：2008-10-28

申请号：US10912063

申请日：2004-08-06

申请人： Keita Harada ,  Shigemi Kurashima ,  Nobuyoshi Shimizu ,  Akio Nakamura ,  Yuriko Nishiyama ,  Shinichiro Akieda ,  Takashi Arita

发明人： Keita Harada ,  Shigemi Kurashima ,  Nobuyoshi Shimizu ,  Akio Nakamura ,  Yuriko Nishiyama ,  Shinichiro Akieda ,  Takashi Arita

IPC分类号： G09G5/00

CPC分类号： G06F3/016

摘要： A coordinates input device includes an operation unit that receives an operation input, a vibration generator that applies a vibration to the operation unit, and a vibration control unit that controls the vibration generator to apply the vibration to the operation unit when the operation input is received by the operation unit. The vibration generator includes a power feed unit provided to the operation unit, and a magnetic-field applying unit having sub-units. Each of the sub-units has first and second magnets spaced apart from each other with a given gap. The magnetic flux produced by the first and second magnets crosses a current flowing in the power feed unit.

摘要翻译： 坐标输入装置包括：接收操作输入的操作单元，向操作单元施加振动的振动发生器;以及振动控制单元，其在接收到操作输入时控制振动发生器将振动施加到操作单元 由操作单位。 振动发生器包括提供给操作单元的供电单元和具有子单元的磁场施加单元。 每个子单元具有彼此间隔开的给定间隙的第一和第二磁体。 由第一和第二磁体产生的磁通量与在馈电单元中流动的电流交叉。

公开(公告)号：US07249510B2

公开(公告)日：2007-07-31

申请号：US11244041

申请日：2005-10-06

申请人： Akio Nakamura

发明人： Akio Nakamura

IPC分类号： G01P15/12 ,  G01P21/00

CPC分类号： G01P15/123 ,  G01P1/023 ,  G01P15/0802 ,  G01P15/16 ,  G01P2015/084 ,  H01L2224/05554 ,  H01L2224/45124 ,  H01L2224/48095 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/16152 ,  H01L2924/00

摘要： A semiconductor acceleration sensor in which a reduction in size can be achieved when electrodes are formed in a chip main body and acceleration can be measured with good sensitivity. The semiconductor acceleration sensor comprises a weight section, flexible sections which support the weight section and have measurement elements P, and a chip main body which has a front surface having chip electrodes electrically connected with the measurement elements, and support the flexible sections, wherein an additional weight, which has an inclined face which surrounds a bonding section and decreases its size toward the bonding section, is bonded on the front surface of the weight section.

摘要翻译： 一种半导体加速度传感器，其中当电极形成在芯片主体中时可以实现尺寸减小，并且可以以良好的灵敏度测量加速度。 半导体加速度传感器包括：重物部分，支撑重量部分的柔性部分并具有测量元件P;以及芯片主体，其具有与测量元件电连接的芯片电极的前表面，并且支撑柔性部分，其中 附加重量，其具有围绕结合部分并且朝向接合部分减小其尺寸的倾斜面接合在配重部分的前表面上。

公开(公告)号：US07245048B2

公开(公告)日：2007-07-17

申请号：US11191135

申请日：2005-07-28

申请人： Noboru Fujii ,  Shinichiro Akieda ,  Junichi Akama ,  Akio Nakamura

发明人： Noboru Fujii ,  Shinichiro Akieda ,  Junichi Akama ,  Akio Nakamura

IPC分类号： H20K41/00

CPC分类号： H04R7/045

摘要： A tactile panel includes a vibration panel, a yoke provided to face the vibration panel, drive coils secured on a circumference of the vibration panel, and a set of permanent magnets arranged between the vibration panel and the yoke. The vibration panel is held by panel holding members, into which both sides of the vibration panel are inserted in a direction substantially perpendicular to a vibration direction of the vibration panel.

摘要翻译： 触觉面板包括振动面板，设置成面对振动面板的磁轭，固定在振动面板的圆周上的驱动线圈和布置在振动面板与磁轭之间的一组永磁体。 振动面板由面板保持构件保持，振动面板的两侧沿与振动面板的振动方向大致垂直的方向插入其中。

公开(公告)号：US07239008B2

公开(公告)日：2007-07-03

申请号：US10212171

申请日：2002-08-06

申请人： Akio Nakamura

发明人： Akio Nakamura

IPC分类号： H01L23/495

CPC分类号： H01L21/565 ,  H01L23/49555 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/8547 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A semiconductor apparatus includes a semiconductor pellet having electrodes thereon; a plurality of lead terminals, which electrically connect the electrodes of the semiconductor pellet to terminals formed on a substrate; and a molding member, which is filled around the semiconductor pellet and upper parts of the lead terminals. The plurality of lead terminals are shaped to be elongated strips and are arranged to extend out of the molding member toward the substrate.

摘要翻译： 半导体装置包括其上具有电极的半导体芯片; 多个引线端子，其将半导体芯片的电极与形成在基板上的端子电连接; 以及填充在半导体芯片周围的成型构件和引线端子的上部。 多个引线端子被成形为细长条，并且被布置成朝向基板延伸出模制构件。

公开(公告)号：US20070111320A1

公开(公告)日：2007-05-17

申请号：US10583038

申请日：2004-12-03

申请人： Akio Nakamura ,  Ikko Matsubara

发明人： Akio Nakamura ,  Ikko Matsubara

IPC分类号： G01N21/00

CPC分类号： G01N21/255 ,  G01N21/8422

摘要： An apparatus for measuring the optical characteristics of a colored liquid comprising a transparent plate (5) arranged horizontally, a sampling means (7) capable of collecting the colored liquid and dropping a collected colored liquid onto the transparent plate (5), and a measuring means (10) positioned beneath the transparent plate (5) for measuring the optical characteristics of the dropped colored liquid. This apparatus enables easy and accurate measurement of the optical characteristics of a colored liquid.

摘要翻译： 一种用于测量包括水平布置的透明板（5）的着色液体的光学特性的装置，能够收集有色液体并将收集的有色液体滴落到透明板（5）上的取样装置（7） 位于透明板（5）下方的用于测量掉落的有色液体的光学特性的装置（10）。 该装置能够容易且准确地测量着色液体的光学特性。

公开(公告)号：US07183132B2

公开(公告)日：2007-02-27

申请号：US10356613

申请日：2003-02-03

申请人： Akio Nakamura

发明人： Akio Nakamura

IPC分类号： H01L21/00

CPC分类号： H01L23/057 ,  H01L23/24 ,  H01L23/367 ,  H01L23/3675 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/157 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A semiconductor device provided with one or more semiconductor pellets arranged on the bottom surface of a recess produced along a surface of a semiconductor plate having wirings arranged on the surface thereof, wirings extending toward the surface of the recess, and the recess being buried with a layer of a resin which is inclined to inflate, while it is hardened, resultantly producing a stress in the resin layer to expand toward the side wall of the recess engraved in the semiconductor plate, resultantly preventing breakage from happening for an interface between the side wall of the recess engraved in the semiconductor plate and the surface of the resin layer contacting the side wall, and remarkably improving the thermal conductivity efficiency to reduce the magnitude of a temperature rise of the semiconductor device, resultantly preventing a delay from happening for the operation speed of the semiconductor device.

摘要翻译： 一种半导体器件，其具有布置在沿着布置在其表面上的布线的半导体板的表面上形成的凹部的底表面上的一个或多个半导体芯片，朝向凹部的表面延伸的布线，并且凹部被埋入 倾斜膨胀的树脂层被硬化，从而在树脂层中产生应力，朝向雕刻在半导体板中的凹槽的侧壁膨胀，从而防止了侧壁之间的界面发生断裂 的刻蚀在半导体板上的凹部和与侧壁接触的树脂层的表面，并且显着提高导热率以降低半导体器件的温度上升的幅度，从而防止了对于操作速度的延迟 的半导体器件。

公开(公告)号：US20060070444A1

公开(公告)日：2006-04-06

申请号：US11244041

申请日：2005-10-06

申请人： Akio Nakamura

发明人： Akio Nakamura

IPC分类号： G01P15/12 ,  H01L21/60

CPC分类号： G01P15/123 ,  G01P1/023 ,  G01P15/0802 ,  G01P15/16 ,  G01P2015/084 ,  H01L2224/05554 ,  H01L2224/45124 ,  H01L2224/48095 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2924/16152 ,  H01L2924/00

摘要： A semiconductor acceleration sensor in which a reduction in size can be achieved when electrodes are formed in a chip main body and acceleration can be measured with good sensitivity. The semiconductor acceleration sensor comprises a weight section, flexible sections which support the weight section and have measurement elements P, and a chip main body which has a front surface having chip electrodes electrically connected with the measurement elements, and support the flexible sections, wherein an additional weight, which has an inclined face which surrounds a bonding section and decreases its size toward the bonding section, is bonded on the front surface of the weight section.

摘要翻译： 一种半导体加速度传感器，其中当电极形成在芯片主体中时可以实现尺寸减小，并且可以以良好的灵敏度测量加速度。 半导体加速度传感器包括：重物部分，支撑重量部分的柔性部分并具有测量元件P;以及芯片主体，其具有与测量元件电连接的芯片电极的前表面，并且支撑柔性部分，其中 附加重量，其具有围绕结合部分并且朝向接合部分减小其尺寸的倾斜面接合在配重部分的前表面上。

公开(公告)号：US06982478B2

公开(公告)日：2006-01-03

申请号：US10615824

申请日：2003-07-10

申请人： Akio Nakamura

发明人： Akio Nakamura

IPC分类号： H01L23/495 ,  H01L23/02 ,  H01L23/48 ,  H01L23/29 ,  H01L23/04

CPC分类号： H01L25/50 ,  H01L21/6835 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/32188 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06589 ,  H01L2924/14 ,  H01L2924/18165 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device comprises a semiconductor IC chip provided with bond pads on its first surface, a wiring substrate provided with a through hole extending between the opposite surfaces thereof, conductive members electrically connecting the bond pads of the semiconductor IC chip to the conductive lines formed on the wiring substrate respectively, and a sealing resin coating coating the first surface of the semiconductor IC chip and the conductive members, and bonding the side surface of the semiconductor IC chip to the side surface of the through hole of the wiring substrate.

摘要翻译： 半导体器件包括：半导体IC芯片，其在其第一表面上设置有接合焊盘;布线基板，设置有在其相对表面之间延伸的通孔;将半导体IC芯片的接合焊盘电连接到形成在 布线基板和涂覆半导体IC芯片的第一表面和导电部件的密封树脂涂层，并且将半导体IC芯片的侧表面接合到布线基板的通孔的侧表面。