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公开(公告)号：US20240079354A1
公开(公告)日：2024-03-07
申请号：US18271117
申请日：2021-10-29
Applicant: BOE Technology Group Co., Ltd.
Inventor： Yingwei Liu , Ke Wang , Zhanfeng Cao , Qi Yao , Guangcai Yuan , Yuelei Xiao , Yue Li
IPC: H01L23/64 , H01L23/00 , H01L23/498 , H01L23/522
CPC classification number: H01L23/642 , H01L23/49822 , H01L23/5227 , H01L24/30 , H01L2224/30505 , H01L2224/30515 , H01L2924/1205 , H01L2924/1206
Abstract: The present disclosure provides a base plate integrating passive devices and a method for manufacturing the same, which relate to the technical field of radio frequency devices. The base plate integrating passive devices of the present disclosure includes a substrate base plate and the passive devices disposed on the substrate base plate, the passive devices including at least an inductor, the inductor including a plurality of open ring portions arranged and connected in sequence in a direction away from the base plate, wherein an interlayer dielectric layer is disposed between the open ring portions disposed adjacently, and the open ring portions disposed adjacently are electrically connected through a first via hole penetrating the interlayer dielectric layer; orthographic projections of any two of the open ring portions on the substrate base plate at least partially overlap.
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公开(公告)号：US11869897B2
公开(公告)日：2024-01-09
申请号：US17057546
申请日：2020-03-24
Applicant: BOE Technology Group Co., Ltd.
Inventor： Ke Wang , Muxin Di , Zhiwei Liang , Guoqiang Wang , Renquan Gu , Xiaoxin Song , Xiaoyan Zhu , Yingwei Liu , Zhanfeng Cao
IPC: H01L27/12
CPC classification number: H01L27/124 , H01L27/127 , H01L27/1251
Abstract: An array substrate including a display area having a plurality of subpixels is provided. The plurality of subpixels includes a plurality of first subpixels in a display-bonding sub-area and a plurality of second subpixels in a regular display sub-area. The array substrate includes a plurality of thin film transistors on a first side of the base substrate and respectively in the plurality of subpixels. A respective one of the plurality of first subpixels includes a bonding pad on a second side of a base substrate; a lead line electrically connecting a respective one of a plurality of thin film transistors to the bonding pad; and a via extending through the base substrate. The lead line is unexposed in the array substrate. The lead line extends from the first side to the second side of the base substrate through the via, to connect to the bonding pad.
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公开(公告)号：US11728352B2
公开(公告)日：2023-08-15
申请号：US17354007
申请日：2021-06-22
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Xinhong Lu , Fangzhen Zhang , Guangcai Yuan , Zhanfeng Cao , Jiushi Wang , Ke Wang , Xiaoyan Zhu , Qi Qi , Jingshang Zhou , Zhaohui Qiang , Zhiwei Liang
CPC classification number: H01L27/124 , H01L25/167 , H01L27/1248 , H01L27/1259 , H01L27/1218
Abstract: The present disclosure provides a driving substrate including: a flexible substrate base, a plurality of thin film transistors on the flexible substrate base and a first conductive pattern layer on a side of the thin film transistors distal to the flexible substrate base. The first conductive pattern layer includes: a plurality of first connection terminals in the display region and a plurality of signal supply lines in the bendable region. A first number of first connection terminals are electrically coupled to first electrodes of the plurality of thin film transistors. The plurality of signal supply lines are coupled to a second number of first connection terminals other than the first number of first connection terminals. At least one inorganic insulating layer including a hollowed-out pattern in the bendable region is between the first conductive pattern layer and the flexible substrate base.
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公开(公告)号：US11728202B2
公开(公告)日：2023-08-15
申请号：US16758074
申请日：2019-01-29
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Yingwei Liu , Zhanfeng Cao , Muxin Di , Ke Wang , Zhiwei Liang , Renquan Gu
IPC: B32B43/00 , H01L21/683 , H01L21/677 , H01L33/62
CPC classification number: H01L21/6838 , H01L21/67742 , H01L33/62 , B32B43/006 , Y10T156/1168 , Y10T156/19
Abstract: The present disclosure relates to an element pickup device, a method for manufacturing the same and a method for using the same. The element pickup device includes: a first substrate and a second substrate oppositely disposed; a spacing part located between the first substrate and the second substrate, wherein the spacing part is spaced apart from each other to define a flow channel for liquid; and an element pickup part including an opening located in the second substrate and in communication with the flow channel.
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公开(公告)号：US11650637B2
公开(公告)日：2023-05-16
申请号：US16643919
申请日：2019-08-14
Applicant: BOE Technology Group Co., Ltd.
Inventor： Haixu Li , Zhanfeng Cao , Ke Wang , Jianguo Wang
Abstract: The present disclosure provides a wiring structure, a preparation method thereof, and a display device. The wiring structure includes a substrate; a pre-arranged layer located on the substrate; and an electrode wiring covering the pre-arranged layer; wherein in the direction perpendicular to an extending direction of the electrode wiring and parallel to a plane on which the substrate is located, an orthographic projection of the pre-arranged layer on the substrate is located within an orthographic projection of the electrode wiring on the substrate, and a side surface of the pre-arranged layer is inclined relative to the plane on which the substrate is located.
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Patent Agency Ranking
公开(公告)号：US11568673B2
公开(公告)日：2023-01-31
申请号：US17256678
申请日：2020-05-26
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Qingzhao Liu , Ke Wang , Guoqiang Wang , Shuilang Dong
IPC: H01L27/32 , G06V40/13 , H01L51/52 , H01L51/56 , G06V10/141 , H01L27/146
Abstract: An array substrate and a method for manufacturing the same, a method and assembly for detecting light, and a display device are provided. The array substrate includes: a base substrate having a pixel region; a light detecting unit, a switch unit, and a light emitting unit that are located in the pixel region, where the light emitting unit and the light detecting unit share the switch unit.
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公开(公告)号：US11532686B2
公开(公告)日：2022-12-20
申请号：US16330719
申请日：2018-09-11
Applicant: BOE Technology Group Co., Ltd.
Inventor： Xinhong Lu , Ke Wang , Hehe Hu , Ce Ning , Wei Yang
IPC: H01L29/78 , H01L27/32 , H01L29/786
Abstract: An array substrate includes a base substrate; a first thin film transistor on the base substrate and including a first active layer, a first gate electrode, a first source electrode and a first drain electrode; a second thin film transistor on the base substrate and including a second active layer, a second gate electrode, a second source electrode and a second drain electrode; a first gate insulating layer between the first active layer and the first gate electrode; and a second gate insulating layer between the second active layer and the second gate electrode, the second gate insulating layer being different from the first gate insulating layer. The first source electrode, the first drain electrode, and the second gate electrode are in a same layer. The first source electrode and the first drain electrode are on a side of the second gate insulating layer distal to the base substrate.
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公开(公告)号：US11532264B2
公开(公告)日：2022-12-20
申请号：US17081834
申请日：2020-10-27
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Ke Wang , Zhanfeng Cao
Abstract: A driving backplane includes a base, electroplating electrodes and driving electrodes. The base has first through holes in a sub-pixel region. The electroplating electrodes are disposed in the sub-pixel region, and at least a portion of each electroplating electrode is disposed within a respective one of the first through holes. The driving electrodes are disposed in the sub-pixel region and on a first side of the base, and each driving electrode is connected to a respective one of the electroplating electrodes.
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公开(公告)号：US11488987B2
公开(公告)日：2022-11-01
申请号：US16650690
申请日：2019-10-08
Applicant: BOE Technology Group Co., Ltd.
Inventor： Yingwei Liu , Shuang Liang , Zhiwei Liang , Muxin Di , Ke Wang , Zhanfeng Cao
IPC: H01L27/12 , H01L25/065 , H01L25/16 , H01L27/15 , H01L25/075
Abstract: The disclosure relates to the technical field of display devices and discloses a display substrate, a splicing screen and a manufacturing method thereof. The display substrate includes a flexible substrate; a plurality of signal lines located at one side of the flexible substrate; a plurality of plating electrodes located at one side of the signal lines toward the flexible substrate and electrically connected to the signal lines in one-to-one correspondence; a plurality of first through holes in one-to-one correspondence to the plating electrodes and penetrating the flexible substrate and exposing the plating electrodes, the first through roles being filled with a conductive material inside; and a plurality of binding electrodes located at one side of the flexible substrate away from the signal lines and in one-to-one correspondence to the first through holes, the binding electrodes being electrically connected to corresponding plating electrode through conductive material in corresponding first through hole.
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公开(公告)号：US11437265B2
公开(公告)日：2022-09-06
申请号：US16770655
申请日：2019-06-13
Applicant: BOE Technology Group Co., Ltd.
Inventor： Xue Dong , Guangcai Yuan , Zhijun Lv , Haixu Li , Zhiwei Liang , Huijuan Wang , Ke Wang , Zhanfeng Cao , Hsuanwei Mai
IPC: H01L21/683 , H01L25/075 , H01L33/62
Abstract: The present disclosure discloses a mass transfer method and system for micro light emitting diodes, wherein the mass transfer method includes: providing a component substrate on which a plurality of micro light emitting diodes are formed; picking up the micro light emitting diodes on the component substrate at least once by a plurality of bonding structures on a first medium load substrate, and transferring micro light emitting diodes picked up every time to a second medium load substrate; and transferring the micro light emitting diodes on the second medium load substrate into corresponding sub-pixels on a target substrate at one time, wherein one of the micro light emitting diodes on the second medium load substrate corresponds to one of the sub-pixels on the target substrate.
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