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公开(公告)号：US11335712B2
公开(公告)日：2022-05-17
申请号：US16755652
申请日：2019-05-13
发明人： Zhiwei Liang , Muxin Di , Ke Wang , Yingwei Liu , Xiaoyan Zhu , Zhanfeng Cao , Guangcai Yuan
摘要： An array substrate is provided. The array substrate includes a base substrate; a first bonding pad layer including a plurality of first bonding pads on a first side of the base substrate; a second bonding pad layer including a plurality of second bonding pads on a second side of the base substrate, wherein the second side is opposite to the first side; and a plurality of signal lines on a side of the second bonding pad layer away from the base substrate. A respective one of the plurality of second bonding pads extends through the base substrate to electrically connect to a respective one of the plurality of first bonding pads. The respective one of the plurality of first bonding pads includes a protruding portion protruding away from the first side of the base substrate along a direction from the second side to the first side.
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公开(公告)号：US20210319725A1
公开(公告)日：2021-10-14
申请号：US17218462
申请日：2021-03-31
发明人： Xiaoyan Zhu
摘要： A flexible display panel, a manufacturing method for the flexible display panel, and a display device are provided. The flexible display panel includes a packaging layer, a driving circuit layer and an insulation layer. The insulation layer serves as a base of the flexible display panel and is located at a side of the driving circuit layer distal to the packaging layer, each of a CTE and a light transmittance of the insulation layer is within a respective predetermined range, the CTE of the insulation layer is smaller than a first threshold, the light transmittance of the insulation layer is greater than a second threshold, the first threshold is within a range of 5 to 15, and the second threshold is within a range of 90% to 99%.
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公开(公告)号：US09780257B1
公开(公告)日：2017-10-03
申请号：US15224234
申请日：2016-07-29
发明人： Xiaona Xu , Tian Yang , Biao Tian , Zhao Kang , Xiaoyan Zhu , Ning Chen , Xiang Zhou
CPC分类号： H01L33/06 , H01L33/44 , H01L33/62 , H01L51/502 , H01L51/5253 , H01L2933/0025 , H01L2933/0033 , H01L2933/0066
摘要： A method of preparing a quantum dot layer, including: placing an anodic aluminum oxide sheet with a plurality of through holes on a substrate; dispersing quantum dots into the plurality of through holes of the anodic aluminum oxide sheet; and removing the anodic aluminum oxide sheet to form a quantum dot layer.
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公开(公告)号：US11539008B2
公开(公告)日：2022-12-27
申请号：US16652580
申请日：2019-04-16
发明人： Xiaoyan Zhu , Hua Huang , Weikang Xiao , Tian Yang
摘要： The present disclosure relates to a multi-layer film. The multi-layer film may include a first region and a second region. The first region may include a first bonding layer and a first planarization layer directly contacted with each other. The second region includes a second bonding layer, a second planarization layer, and an intervention layer between the second bonding layer and the second planarization layer.
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公开(公告)号：US20220336426A1
公开(公告)日：2022-10-20
申请号：US17760627
申请日：2021-05-18
发明人： Xiaoyan Zhu , Xinhong Lu , Jinnv Liu
IPC分类号： H01L25/075 , H01L33/62
摘要： Provided are a driving substrate, a light emitting apparatus and a manufacturing method therefor, which relate to the technical field of display. According to the present disclosure, a rigid substrate, a debonding layer, a first buffer layer, an organic material layer, a second buffer layer and a wiring layer are sequentially arranged in layer configuration in a component disposing area and a circuit board binding area, and the first buffer layer, an overlapping electrode layer, the organic material layer and the second buffer layer are sequentially arranged in layer configuration in a bending area. Two ends of the overlapping electrode layer respectively extend to the component disposing area and the circuit board binding area, and the wiring layer of the component disposing area and the wiring layer of the circuit board binding area are respectively connected to the overlapping electrode layer through via holes.
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公开(公告)号：US20220199650A1
公开(公告)日：2022-06-23
申请号：US17057546
申请日：2020-03-24
发明人： Ke Wang , Muxin Di , Zhiwei Liang , Guoqiang Wang , Renquan Gu , Xiaoxin Song , Xiaoyan Zhu , Yingwei Liu , Zhanfeng Cao
IPC分类号： H01L27/12
摘要： An array substrate including a display area having a plurality of subpixels is provided. The plurality of subpixels includes a plurality of first subpixels in a display-bonding sub-area and a plurality of second subpixels in a regular display sub-area. The array substrate includes a plurality of thin film transistors on a first side of the base substrate and respectively in the plurality of subpixels. A respective one of the plurality of first subpixels includes a bonding pad on a second side of a base substrate; a lead line electrically connecting a respective one of a plurality of thin film transistors to the bonding pad; and a via extending through the base substrate. The lead line is unexposed in the array substrate. The lead line extends from the first side to the second side of the base substrate through the via, to connect to the bonding pad.
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公开(公告)号：US20210408052A1
公开(公告)日：2021-12-30
申请号：US16755652
申请日：2019-05-13
发明人： Zhiwei Liang , Muxin Di , Ke Wang , Yingwei Liu , Xiaoyan Zhu , Zhanfeng Cao , Guangcai Yuan
摘要： An array substrate is provided. The array substrate includes a base substrate; a first bonding pad layer including a plurality of first bonding pads on a first side of the base substrate; a second bonding pad layer including a plurality of second bonding pads on a second side of the base substrate, wherein the second side is opposite to the first side; and a plurality of signal lines on a side of the second bonding pad layer away from the base substrate. A respective one of the plurality of second bonding pads extends through the base substrate to electrically connect to a respective one of the plurality of first bonding pads. The respective one of the plurality of first bonding pads includes a protruding portion protruding away from the first side of the base substrate along a direction from the second side to the first side.
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公开(公告)号：US11137631B2
公开(公告)日：2021-10-05
申请号：US15989388
申请日：2018-05-25
发明人： Xiaoyan Zhu , Hua Huang , Changhan Xie , Weikang Xiao
IPC分类号： G02F1/1333 , G02F1/1335 , G02F1/1362 , G02F1/1339
摘要： A fabrication method of a display panel, a display panel and a display device are provided. The method includes: forming a piezoelectric sensing layer on a first substrate; forming a surface acoustic wave driver to excite a surface acoustic wave on the piezoelectric sensing layer; forming a passivation layer on the piezoelectric sensing layer where the surface acoustic wave driver has been formed; forming grooves in the passivation layer; dropping polymer material into the passivation layer; driving the polymer material into the grooves by the surface acoustic wave; performing a first curing, so that the polymer material is fixedly connected with the grooves; and cell-assembling the first substrate and a second substrate.
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9.发明公开公开(公告)号：US20240136336A1
公开(公告)日：2024-04-25
申请号：US17769825
申请日：2021-06-24
发明人： Xinhong Lu , Xiaoyan Zhu , Chao Liu , Shuilang Dong , Jiushi Wang , Liuqing Li
IPC分类号： H01L25/075 , H01L25/16 , H01L33/62
CPC分类号： H01L25/0753 , H01L25/167 , H01L33/62 , H01L2933/0066
摘要： A driving substrate, a light-emitting apparatus and a manufacturing method thereof, a splicing display apparatus, the driving substrate includes: a device disposing area, a bending area and a bonding area, the bending area is located between the device disposing area and the bonding area; the driving substrates located in the device disposing area, the bending area, and the bonding area include a buffer layer, a first conductive layer and a flexible dielectric layer that are stacked in sequence; the driving substrates located in the device disposing area and the bonding area further include a base plate disposed at a side of the buffer layer away from the first conductive layer, and a second conductive layer disposed at a side of the flexible dielectric layer away from the first conductive layer; and the driving substrate located in the bending area is configured to be able to bend along a bending axis.
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公开(公告)号：US20240088170A1
公开(公告)日：2024-03-14
申请号：US18518526
申请日：2023-11-23
发明人： Ke Wang , Muxin Di , Zhiwei Liang , Guoqiang Wang , Renquan Gu , Xiaoxin Song , Xiaoyan Zhu , Yingwei Liu , Zhanfeng Cao
IPC分类号： H01L27/12
CPC分类号： H01L27/124 , H01L27/1251 , H01L27/127
摘要： An array substrate including a display area having a plurality of subpixels is provided. The plurality of subpixels includes a plurality of first subpixels in a display-bonding sub-area and a plurality of second subpixels in a regular display sub-area. The array substrate includes a plurality of thin film transistors on a first side of the base substrate and respectively in the plurality of subpixels. A respective one of the plurality of first subpixels includes a bonding pad on a second side of a base substrate; a lead line electrically connecting a respective one of a plurality of thin film transistors to the bonding pad; and a via extending through the base substrate. The lead line is unexposed in the array substrate. The lead line extends from the first side to the second side of the base substrate through the via, to connect to the bonding pad.
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