摘要:
Disclosed are an electric energy storage device having a good cycle characteristic and a temperature characteristic and a method of charging and discharging the electric energy storage device. The electric energy storage device including a capacitor and a secondary battery combined in series is provided. When the capacitor of the electric energy storage device is an electric double layer capacitor, the capacitor is used to the voltage of OV or less to increase an available energy usage. When this energy storage device is used as a power in a place where a rapid keeping and repairing is difficult such as out in the fields including in the mountain, at the sea, on the road, the cost for keeping and repairing can be largely reduced.
摘要:
Disclosed is a base pad of polishing pad, which is used in conjunction with polishing slurry during a chemical-mechanical polishing or planarizing process, and a multilayer pad using the same. Since the base pad according to the present invention does not have fine pores, it is possible to prevent premeation of polishing slurry and water and to avoid nonuniformity of physical properties. Thereby, it is possible to lengthen the lifetime of the polishing pad.
摘要:
A method and interface are provided for using a memory that distinguishes transmission data from reception data and performs a First-In-First-Out (FIFO) operation on the transmission and reception data in a communication system. In the method, a controller receives from a register a last transmission address provided for dividing one memory module having L addresses into a transmission area having M addresses according to application, where M is less than or equal to L, and a reception area having (L-M) addresses. A codec interface allocates a first address up to the last transmission address of the memory module for the transmission area. The codec interface allocates an address increased by 1 from the last transmission address up to the last address of the memory module for the reception area.
摘要:
A Schottky barrier FinFET device and a method of fabricating the same are provided. The device includes a lower fin body provided on a substrate. An upper fin body having first and second sidewalls which extend upwardly from a center of the lower fin body and face each other is provided. A gate structure crossing over the upper fin body and covering an upper surface of the upper fin body and the first and second sidewalls is provided. The Schottky barrier FinFET device includes a source and a drain which are formed on the sidewalls of the upper fin body adjacent to sidewalls of the gate structure and made of a metal material layer formed on an upper surface of the lower fin body positioned at both sides of the upper fin body, and the source and drain form a Schottky barrier to the lower and upper fin bodies.
摘要:
In a safety vent part and an electric energy storage device having the same, the safety vent part includes a plate coupled to the device, a metal sheet and a metal cap. A hole having a step portion is formed through the plate, and is in communication with an interior of the device. The metal cap having an exhaust nozzle corresponding the hole is coupled into the step portion by a tight fit. The metal sheet is disposed between a bottom surface of the step portion and the metal cap. When an internal pressure of the device is higher than a predetermined breaking pressure, the internal pressure of the device breaks the metal sheet. A gas generated abnormally in the device is exhausted through the hole and exhaust nozzle.
摘要:
Embodiments of the present invention include heterogeneous substrates, integrated circuits formed on such heterogeneous substrates, and methods of forming such substrates and integrated circuits. The heterogeneous substrates according to certain embodiments of the present invention include a first Group IV semiconductor layer (e.g., silicon), a second Group IV pattern (e.g., a silicon-germanium pattern) that includes a plurality of individual elements on the first Group IV semiconductor layer, and a third Group IV semiconductor layer (e.g., a silicon epitaxial layer) on the second Group IV pattern and on a plurality of exposed portions of the first Group IV semiconductor layer. The second Group IV pattern may be removed in embodiments of the present invention. In these and other embodiments of the present invention, the third Group IV semiconductor layer may be planarized.
摘要:
A semiconductor device includes first through fourth active fins, which extend alongside one another in a first direction; and a field insulating film that covers lower portions of the first through fourth active fins, the first and second active fins protrude from the field insulating film at a first height, the third active fin protrudes from the field insulating film at a second height different from the first height, and an interval between the first and second active fins is different from an interval between the third and fourth active fins.
摘要:
Provided are a semiconductor device and a method for fabricating the same. The semiconductor device includes a lower fin that protrudes from a substrate and extends in a first direction, an oxide film the lower fin, an upper fin that protrudes from the oxide film and that is spaced apart from the lower fin at a position corresponding to the lower fin, and a gate structure the upper fin that extends in a second direction to intersect the upper fin, wherein germanium (Ge) is included in a portion of the oxide film located between the lower fin and the upper fin.
摘要:
A method of forming a semiconductor structure can include forming a photolithography mask on a silicon fin having a hard mask layer thereon extending in a first direction. A trench can be formed through the hard mask layer into the silicon fin using the photolithography mask, where the trench extends in a second direction to separate the silicon fin into first and second fin structures extending end-to-end in the first direction. A portion of the trench formed by the hard mask layer can be widened relative to a lower portion of the trench defined by the first and second fin structures.
摘要:
Provided are a semiconductor device and a method for fabricating the same. The method for fabricating a semiconductor device comprises, providing an active fin and a field insulating film including a first trench disposed on the active fin; forming a second trench through performing first etching of the field insulating film that is disposed on side walls and a lower portion of the first trench; forming a first region and a second region in the field insulating film through performing second etching of the field insulating film that is disposed on side walls and a lower portion of the second trench, the first region is disposed adjacent to the active fin and has a first thickness, and the second region is disposed spaced apart from the active fin as compared with the first region and has a second thickness that is thicker than the first thickness; and forming a gate structure on the active fin and the field insulating film.