公开(公告)号：US10527790B2

公开(公告)日：2020-01-07

申请号：US15841005

申请日：2017-12-13

Applicant: Cisco Technology, Inc.

Inventor： Kumar Satya Harinadh Potluri ,  Ashley J. Maker ,  Vipulkumar Patel

IPC: G02B6/12 ,  G02B6/122 ,  G02B6/32 ,  G02B6/38 ,  G02B6/42 ,  G02B6/36 ,  G02B6/30

Abstract: Embodiments herein describe a fiber array unit (FAU) configured to couple a photonic chip with a plurality of optical fibers. Epoxy can be used to bond the FAU to the photonic chip. However, curing the epoxy between the FAU and the photonic chip is difficult. As such, the FAU can include one or more optical windows etched into a non-transparent layer that overlap with epoxy wells in the photonic chip. Moreover, the FAU may include a transparent substrate on which the non-transparent layer is disposed that permits UV light to pass therethrough. As such, during curing, UV light can be pass through the transparent substrate and through the optical windows in the non-transparent layer to cure the epoxy disposed between the FAU and the photonic chip.

公开(公告)号：US10461495B2

公开(公告)日：2019-10-29

申请号：US15910852

申请日：2018-03-02

Applicant: Cisco Technology, Inc.

Inventor： Dominic F. Siriani ,  Sean P. Anderson ,  Vipulkumar Patel

IPC: H01S5/00 ,  H01S5/02 ,  H01S5/323 ,  H01S5/20 ,  H01S5/30 ,  H01S5/34 ,  H01S5/343

Abstract: A method of creating a laser, comprising: bonding a III-V semiconductor material with a silicon substrate; removing excess III-V semiconductor material bonded with the substrate to leave a III-V semiconductor material base layer of a predetermined thickness bonded with the substrate; and after removing the excess III-V semiconductor material, epitaxially growing at least one layer on the III-V semiconductor material base layer, the at least one layer comprising a quantum dot layer.

公开(公告)号：US10175448B2

公开(公告)日：2019-01-08

申请号：US14331315

申请日：2014-07-15

Applicant: Cisco Technology, Inc.

Inventor： Mary Nadeau ,  Vipulkumar Patel ,  Prakash Gothoskar ,  John Fangman ,  John Matthew Fangman ,  Mark Webster

IPC: G02B7/02 ,  H01L23/544 ,  G02B6/42 ,  G02B7/00 ,  H01L23/34 ,  H01L23/00

Abstract: An arrangement for improving adhesive attachment of micro-components in an assembly utilizes a plurality of parallel-disposed slots formed in the top surface of the substrate used to support the micro-components. The slots are used to control the flow and “shape” of an adhesive “dot” so as to quickly and accurately attach a micro-component to the surface of a substrate. The slots are formed (preferably, etched) in the surface of the substrate in a manner that lends itself to reproducible accuracy from one substrate to another. Other slots (“channels”) may be formed in conjunction with the bonding slots so that extraneous adhesive material will flow into these channels and not spread into unwanted areas.

公开(公告)号：US20160223750A1

公开(公告)日：2016-08-04

申请号：US14613025

申请日：2015-02-03

Applicant: Cisco Technology, Inc.

Inventor： Kalpendu Shastri ,  Ravi Sekhar Tummidi ,  Vipulkumar Patel

IPC: G02B6/30

CPC classification number: G02B6/30 ,  G02B6/2821 ,  G02B6/305 ,  G02B6/4291

Abstract: An optical coupler may include a fiber optic structure that has a portion of an outer surface that extends in a longitudinal direction of the fiber optic structure. The longitudinal outer surface portion may be optically coupled with a waveguide core of an optical integrated circuit. The fiber optic structure may also include a second outer surface that extends transverse to the longitudinal direction of the fiber optic structure. The fiber optic structure may also include a third outer surface portion that is butt coupled to an end of an optical fiber to optically couple the third outer surface portion with the optical fiber.

Abstract translation: 光耦合器可以包括具有在光纤结构的纵向方向上延伸的外表面的一部分的光纤结构。 纵向外表面部分可以与光学集成电路的波导芯光学耦合。 光纤结构还可以包括横向于光纤结构的纵向方向延伸的第二外表面。 光纤结构还可以包括第三外表面部分，其与光纤的端部对接，以将第三外表面部分与光纤光学耦合。

公开(公告)号：US09031107B2

公开(公告)日：2015-05-12

申请号：US14510654

申请日：2014-10-09

Applicant: Cisco Technology, Inc.

Inventor： Kalpendu Shastri ,  Soham Pathak ,  Vipulkumar Patel ,  Bipin Dama ,  Kishor Desai

IPC: H01S3/04 ,  H01S5/00 ,  H01S5/024 ,  H01S5/022 ,  H01S5/40

CPC classification number: H01S5/02415 ,  G02B6/42 ,  G02B6/4273 ,  H01S5/005 ,  H01S5/0064 ,  H01S5/02248 ,  H01S5/024 ,  H01S5/02469 ,  H01S5/4025

Abstract: An interposer (support substrate) for an opto-electronic assembly is formed to include a thermally-isolated region where temperature-sensitive devices (such as, for example, laser diodes) may be positioned and operate independent of temperature fluctuations in other areas of the assembly. The thermal isolation is achieved by forming a boundary of dielectric material through the thickness of the interposer, the periphery of the dielectric defining the boundary between the thermally isolated region and the remainder of the assembly. A thermo-electric cooler can be used in conjunction with the temperature-sensitive device(s) to stabilize the operation of these devices.

Abstract translation: 形成用于光电组件的插入器（支撑衬底），以包括热隔离区域，其中可以将温度敏感器件（例如激光二极管）定位并独立于其中的温度波动 部件。 通过形成介电材料的边界通过插入件的厚度来实现热隔离，绝缘体的外围限定了热隔离区域和组件的其余部分之间的边界。 热电冷却器可与温度敏感设备结合使用，以稳定这些设备的运行。