Abstract:
A method for measuring surface topography characterized by making multiple scans of the surface with a laser scanning unit and utilizing the multiple scans to create representations of the surface's topography. The surface topography data can also be used to calculate the compressive or tensile stress caused by a thin film applied to the surface of a semiconductor wafer. The apparatus of the present invention scans a laser beam across a surface in an x direction, and detects displacements of a reflected portion of the laser beam in a z direction. A pair of photodetectors are used to translate z direction displacements of the reflected beam into analog signals which are digitized and input into a microcomputer for analysis. The multiple scans of the surface are preferably accomplished by placing the workpiece on a pedestal which can be rotated to various angular positions.
Abstract:
An improved apparatus for CVD processing is described wherein a wafer mounted on a vertically movable susceptor beneath a gas outlet or showerhead is raised into contact with a shield ring which normally rests on a ring support in the chamber. The shield ring engages the frontside edge of the wafer, lifting the shield ring off its support, when the susceptor and the wafer 10 are raised to a deposition position in the chamber. The shield ring, by engaging the frontside edge of the wafer, shields the edge of the top surface of the wafer, as well as the end edge and the backside of the wafer, during the deposition. Matching tapered edges, respectively, on the susceptor and the shield ring permit alignment of the shield ring with respect to the susceptor, and alignment of the wafer to the susceptor and the shield ring. Alignment means are also disclosed to circularly align the shield ring to its support in the chamber. Multi-unit shield rings permit the use of wider shield rings and prevent cracking of the shield ring due to thermal stresses caused by temperature differences near and away from the wafer during processing. These shield rings may also have tapered edges to ensure alignment of the rings with respect to each other.
Abstract:
An integrated modular multiple chamber vacuum processing system is disclosed. The system includes a load lock, may include an external cassette elevator, and an internal load lock wafer elevator, and also includes stations about the periphery of the load lock for connecting one, two or several vacuum process chambers to the load lock chamber. A robot is mounted within the load lock and utilizes a concentric shaft drive system connected to an end effector via a dual four-bar link mechanism for imparting selected R-.theta. movement to the blade to load and unload wafers at the external elevator, internal elevator and individual process chambers. The system is uniquely adapted for enabling various types of IC processing including etch, deposition, sputtering and rapid thermal annealing chambers, thereby providing the opportunity for multiple step, sequential processing using different processes.
Abstract:
A wafer processing system includes an autoloader mounted within a load lock for providing batch, cassette-to-cassette automatic wafer transfer between the semiconductor processing chamber and cassette load and unload positions within the load lock. The system provides rapid, contamination-free loading and unloading of semiconductor wafers.
Abstract:
A system and method for determining the precise location of a moving object such as a semiconductor wafer relative to a destination position, using an array of optical sensors positioned along an axis generally transverse to the path of movement of the wafer. The sensor trigger points along the path of movement are used to calculate the center position of the wafer relative to the destination position.
Abstract:
A single semiconductor laser (10) is utilized in an optical system (2) to record and readback from a recording media such as a spinning disk (24). By means of a retro-reflecting light and optical system, the same optical path can be used not only for recording, but for readback of the recorded data on the recording media (24). A polarizing beam splitter (16) causes the light beam (8) to pass through an optical system whereby both focus error and tracking error as well as the data signal can be generated. By dithering the light beam across the recorded track in accordance with data signal, a tracking error signal is generated to cause the dithering motion of the galvanometer (20) to maintain its center tracking of the recorded information. By the use of a separate beam splitter (30), a focus error signal can be detected by means of error signals from complementary detectors S1, S2 to maintain accurate focus of the applied light beam on the recording media.
Abstract:
An optical disk recorder in which the optical disk, the drive spindle and the disk drive motor are moved or pivoted in an arcuate path relative to stationary laser optics. When moved in such an arcuate path, the optical disk, spindle and drive motor have a lessened movement of inertia (compared to linear movement thereof) which permits relatively fast accessing of an optical disk without a large drive motor. The accessing system can be naturally statically balanced by placing the spindle and the drive motor or opposite sides of the pivot point.
Abstract:
A facility procuring information about a distinguished property from its owner that is usable to refine an automatic valuation of the distinguished property is described. The facility displays information about the distinguished property used in the automatic valuation of the distinguished property. The facility obtains user input from the owner adjusting at least one aspect of information about the distinguished property used in the automatic valuation of the distinguished property. The facility then displays to the owner a refined valuation of the distinguished property that is based on the adjustment of the obtained user input.
Abstract:
A method and apparatus for semiconductor processing is disclosed. In one embodiment, a method of transporting a wafer within a cluster tool, comprises placing the wafer into a first segment of a vacuum enclosure, the vacuum enclosure being attached to a processing chamber and a factory interface. The wafer is transported to a second segment of the vacuum enclosure using a vertical transport mechanism, wherein the second segment is above or below the first segment.