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公开(公告)号：US20160220158A1
公开(公告)日：2016-08-04
申请号：US15092655
申请日：2016-04-07
Applicant: General Electric Company
Inventor： Jason Harris Karp , Christopher James Kapusta , Paul Jeffrey Gillespie , Christopher Fred Keimel , Jeffrey Michael Ashe , James Enrico Sabatini
IPC: A61B5/1455 , A61B5/00
CPC classification number: A61B5/14552 , A61B5/0002 , A61B5/029 , A61B5/0816 , A61B5/6826 , A61B5/742 , A61B2562/0238 , A61B2562/046 , A61B2562/12 , A61B2562/164 , A61B2562/222 , A61B2562/227 , H01L25/0753 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H01L2224/92247 , H01L2924/181 , H05K1/189 , H05K2201/10106 , H05K2201/10151 , Y10T29/49139 , H01L2924/00014 , H01L2924/00012
Abstract: An array of emitters includes a device substrate having first and second sides, a thermally and electrically conductive layer disposed on the first side of the device substrate, and an interconnect layer disposed on a first plurality of portions of the second side of the device substrate. The array of the emitters further includes a plurality of emitters disposed in a second plurality of portions of the device substrate, where the plurality of emitters is electrically coupled to the thermally and electrically conductive layer. Also, the array of the emitters includes a plurality of wirebond contacts configured to electrically couple a portion of the interconnect layer to a corresponding emitter of the plurality of emitters, and a plurality of encapsulations, where one or more encapsulations of the plurality of encapsulations are disposed on at least a portion of a corresponding wirebond contact of the plurality of wirebond contacts.
Abstract translation: 发射体阵列包括具有第一和第二侧的器件衬底，设置在器件衬底的第一侧上的导热层和布置在器件衬底的第二侧的第一多个部分上的互连层。 发射器的阵列还包括设置在器件衬底的第二多个部分中的多个发射器，其中多个发射极电耦合到导热层和导电层。 此外，发射器的阵列包括多个引线键合触点，其被配置为将互连层的一部分电耦合到多个发射体中的对应的发射极，以及多个封装，其中多个封装的一个或多个封装是 设置在所述多个引线接触件的对应的引线接合的至少一部分上。
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52.发明申请ARRAYS OF EMITTERS FOR PULSE OXIMETRY DEVICES AND METHODS OF MAKING THE SAME 审中-公开脉冲氧化装置的发射体阵列及其制造方法公开(公告)号：US20150133753A1
公开(公告)日：2015-05-14
申请号：US14079660
申请日：2013-11-14
Applicant: General Electric Company
Inventor： Jason Harris Karp , Christopher James Kapusta , Paul Jeffrey Gillespie , Christopher Fred Keimel , Jeffrey Michael Ashe , James Enrico Sabatini
IPC: A61B5/1455 , H05K3/32
CPC classification number: A61B5/14552 , A61B5/0002 , A61B5/029 , A61B5/0816 , A61B5/6826 , A61B5/742 , A61B2562/0238 , A61B2562/046 , A61B2562/12 , A61B2562/164 , A61B2562/222 , A61B2562/227 , H01L25/0753 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H01L2224/92247 , H01L2924/181 , H05K1/189 , H05K2201/10106 , H05K2201/10151 , Y10T29/49139 , H01L2924/00014 , H01L2924/00012
Abstract: An array of emitters includes a device substrate having first and second sides, a thermally and electrically conductive layer disposed on the first side of the device substrate, and an interconnect layer disposed on a first plurality of portions of the second side of the device substrate. The array of the emitters further includes a plurality of emitters disposed in a second plurality of portions of the device substrate, where the plurality of emitters is electrically coupled to the thermally and electrically conductive layer. Also, the array of the emitters includes a plurality of wirebond contacts configured to electrically couple a portion of the interconnect layer to a corresponding emitter of the plurality of emitters, and a plurality of encapsulations, where one or more encapsulations of the plurality of encapsulations are disposed on at least a portion of a corresponding wirebond contact of the plurality of wirebond contacts.
Abstract translation: 发射体阵列包括具有第一和第二侧的器件衬底，设置在器件衬底的第一侧上的导热层和布置在器件衬底的第二侧的第一多个部分上的互连层。 发射器的阵列还包括设置在器件衬底的第二多个部分中的多个发射器，其中多个发射极电耦合到导热层和导电层。 此外，发射器的阵列包括多个引线键合触点，其被配置为将互连层的一部分电耦合到多个发射体中的对应的发射极，以及多个封装，其中多个封装的一个或多个封装是 设置在所述多个引线接触件的对应的引线接合的至少一部分上。
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公开(公告)号：US20130344653A1
公开(公告)日：2013-12-26
申请号：US13969965
申请日：2013-08-19
Applicant: General Electric Company
Inventor： James Sabatini , Christopher James Kapusta , Glenn Forman
IPC: H01L25/00
CPC classification number: H01L25/50 , H01L23/5385 , H01L23/5389 , H01L24/19 , H01L24/82 , H01L25/0657 , H01L25/16 , H01L2224/04105 , H01L2224/24137 , H01L2224/73267 , H01L2224/82039 , H01L2224/92144 , H01L2225/0652 , H01L2225/06524 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15192 , H01L2924/15311 , H01L2924/15331 , H01L2924/18162 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/00
Abstract: An electronic package includes a first layer having a first surface, the first layer includes a first device having a first electrical node, and a first contact pad in electrical communication with the first electrical node and positioned within the first surface. The package includes a second layer having a second surface and a third surface, the second layer includes a first conductor positioned within the second surface and a second contact pad positioned within the third surface and in electrical communication with the first conductor. A first anisotropic conducting paste (ACP) is positioned between the first contact pad and the first conductor to electrically connect the first contact pad to the first conductor such that an electrical signal may pass therebetween.
Abstract translation: 电子封装包括具有第一表面的第一层，第一层包括具有第一电节点的第一器件和与第一电节点电连通且位于第一表面内的第一接触焊盘。 封装包括具有第二表面和第三表面的第二层，第二层包括位于第二表面内的第一导体和位于第三表面内且与第一导体电连通的第二接触垫。 第一各向异性导电膏（ACP）位于第一接触焊盘和第一导体之间，以将第一接触焊盘电连接到第一导体，使得电信号可以在其间通过。
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54.发明授权公开(公告)号：US11824030B2
公开(公告)日：2023-11-21
申请号：US17806132
申请日：2022-06-09
Applicant: General Electric Company
Inventor： Christopher James Kapusta , Youichi Nishihara
Abstract: An electronics package includes an electrically insulating substrate having a first surface and a second surface, an adhesive layer positioned on the first surface of the electrically insulating substrate, and an electrical component having a top surface coupled to the adhesive layer on a surface thereof opposite the electrically insulating substrate, the electrical component having contact pads on the top surface. Vias are formed through the electrically insulating substrate and the adhesive layer at locations corresponding to the contact pads by way of a mechanical punching operation, with each of the vias having a via wall extending from the second surface of the electrically insulating substrate to a respective contact pad. At each via, the electrically insulating substrate comprises a protrusion extending outwardly from the first surface thereof so as to cover at least part of the adhesive layer in forming part of the via wall.
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公开(公告)号：US11499545B2
公开(公告)日：2022-11-15
申请号：US16517071
申请日：2019-07-19
Applicant: General Electric Company
Abstract: A sensor system for monitoring a condition of a piston rod includes an interrogator system having a first coil winding coupled to a housing and radially spaced from the piston rod such that a gap is defined between the first coil winding and the piston rod. A second coil winding is coupled to the piston rod and is inductively coupled to the first coil winding. The second coil winding is configured to communicate with the first coil winding through a range of linear movement of the piston rod relative to the housing. A sensor is coupled to the second coil winding. The sensor is configured to measure a characteristic associated with the piston rod and generate a current in the second coil winding to transmit, via the inductive coupling with the first coil winding, an electrical output signal associated with the characteristic to the interrogator system.
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Patent Agency Ranking
公开(公告)号：US20210104812A1
公开(公告)日：2021-04-08
申请号：US16713488
申请日：2019-12-13
Applicant: General Electric Company
Inventor： Christopher James Kapusta , Joseph Alfred Iannotti , Stanton Earl Weaver , Glen Peter Koste
IPC: H01Q1/24 , H01Q21/06 , H01L23/66 , G02B6/42 , H01L23/538 , H01L25/16 , H01L23/15 , H01L23/498 , H01L33/62 , H01L21/48 , G02B6/43
Abstract: A wireless access point is disclosed. The wireless access point includes a substrate, an antenna structure disposed on the substrate and configured to transmit and receive wireless electromagnetic communication signals, and a fiber-optic interface disposed on the substrate and communicatively coupled to the antenna structure and a fiber-optic cable. The fiber-optic interface is configured to transmit and receive optical communication signals through the fiber-optic cable.
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公开(公告)号：US20210017979A1
公开(公告)日：2021-01-21
申请号：US16517071
申请日：2019-07-19
Applicant: General Electric Company
Abstract: A sensor system for monitoring a condition of a piston rod includes an interrogator system having a first coil winding coupled to a housing and radially spaced from the piston rod such that a gap is defined between the first coil winding and the piston rod. A second coil winding is coupled to the piston rod and is inductively coupled to the first coil winding. The second coil winding is configured to communicate with the first coil winding through a range of linear movement of the piston rod relative to the housing. A sensor is coupled to the second coil winding. The sensor is configured to measure a characteristic associated with the piston rod and generate a current in the second coil winding to transmit, via the inductive coupling with the first coil winding, an electrical output signal associated with the characteristic to the interrogator system.
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58.发明授权公开(公告)号：US10804115B2
公开(公告)日：2020-10-13
申请号：US15668502
申请日：2017-08-03
Applicant: General Electric Company
Inventor： Christopher James Kapusta , Raymond Albert Fillion , Risto Ilkka Sakari Tuominen , Kaustubh Ravindra Nagarkar
IPC: H01L21/48 , H01L21/56 , H01L21/52 , H01L23/31 , H01L23/28 , H01L23/16 , H01L23/00 , H01L23/538 , H01L23/50
Abstract: An electronics package includes an insulating substrate, an electrical component having an active surface coupled to a first surface of the insulating substrate, and an insulating structure disposed adjacent the electrical component on the first surface of the insulating substrate. A first wiring layer is formed on a top surface of the insulating structure and extends down at least one sloped side surface of the insulating structure. A second wiring layer is formed on a second surface of the insulating substrate. The second wiring layer extends through a plurality of vias in the insulating substrate to electrically couple at least one contact pad on the active surface of the electrical component to the first wiring layer.
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59.发明授权公开(公告)号：US10607929B2
公开(公告)日：2020-03-31
申请号：US16229049
申请日：2018-12-21
Applicant: General Electric Company
Inventor： Christopher James Kapusta , Kaustubh Ravindra Nagarkar , Arun Virupaksha Gowda , James Wilson Rose
IPC: H01L23/498 , H01L21/48 , H01L23/00 , H05K1/18 , H01L23/538
Abstract: An electronics package includes an interconnect assembly comprising a first insulating substrate, a first wiring layer formed on a lower surface of the first insulating substrate, and at least one through hole extending through the first insulating substrate and the first wiring layer. The electronics package also includes an electrical component assembly comprising an electrical component having an active surface coupled to an upper surface of the first insulating substrate opposite the lower surface. The active surface of the electrical comprises at least one metallic contact pad. At least one conductive stud is coupled to the at least one metallic contact pad and is positioned within the at least one through hole. A conductive plug contacts the first wiring layer and extends into the at least one through hole to at least partially surround the at least one conductive stud.
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公开(公告)号：US10605785B2
公开(公告)日：2020-03-31
申请号：US15616105
申请日：2017-06-07
Applicant: General Electric Company
Inventor： Joseph Iannotti , Christopher James Kapusta , David Richard Esler
Abstract: A system includes a structure configured to have a structure bonding layer disposed on a surface of the structure. The structure bonding layer is a metallic alloy. The system includes a sensor configured to have a sensor bonding layer disposed on a surface of the sensor. The sensor bonding layer is a metallic alloy. The sensor bonding layer is configured to be coupled to the structure bonding layer via a metallic joint in order for the sensor to sense data of the structure through the metallic joint, the structure bonding layer, and the sensor bonding layer.
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