公开(公告)号：US20150317553A1

公开(公告)日：2015-11-05

申请号：US14697664

申请日：2015-04-28

Applicant: Infineon Technologies AG

Inventor： Frank Pueschner ,  Thomas Spoettl ,  Jens Pohl ,  Gottfried Beer

IPC: G06K19/077 ,  H01L25/00 ,  G06K19/07

CPC classification number: G06K19/07705 ,  G06K19/0716 ,  G06K19/077 ,  G06K19/07749 ,  G06K19/07754 ,  H01L21/48 ,  H01L23/488 ,  H01L25/50 ,  H01L2224/16225 ,  H01L2224/16238

Abstract: In various embodiments, a smart card module is provided. The smart card module includes a carrier having a first main surface and a second main surface opposite the first main surface. The carrier has at least one plated-through hole. The smart card module further includes a contact array arranged above the first main surface of the carrier and having a plurality of electrical contacts. At least one electrical contact of the plurality of electrical contacts is electrically connected to the plated-through hole. The smart card module further includes a chip arranged above the second main surface. The chip is electrically coupled to at least one electrical contact of the plurality of electrical contacts by the plated-through hole. The smart card module further includes at least one optoelectronic component arranged above the second main surface and electrically conductively connected to the chip.

Abstract translation: 在各种实施例中，提供智能卡模块。 智能卡模块包括具有第一主表面和与第一主表面相对的第二主表面的载体。 载体具有至少一个电镀通孔。 智能卡模块还包括布置在载体的第一主表面上方并具有多个电触点的接触阵列。 多个电触点中的至少一个电接触电连接到电镀通孔。 智能卡模块还包括布置在第二主表面上方的芯片。 芯片通过电镀通孔与多个电触点的至少一个电接触电耦合。 所述智能卡模块还包括布置在所述第二主表面上方并与所述芯片导电连接的至少一个光电子部件。

公开(公告)号：US20140175625A1

公开(公告)日：2014-06-26

申请号：US14189304

申请日：2014-02-25

Applicant: Infineon Technologies AG

Inventor： Thorsten Meyer ,  Jens Pohl

IPC: H01L23/498

CPC classification number: H01L21/56 ,  H01L21/561 ,  H01L21/563 ,  H01L21/568 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/28 ,  H01L23/31 ,  H01L23/3107 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/3192 ,  H01L23/488 ,  H01L23/49861 ,  H01L23/50 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/14 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L2221/68327 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2224/24195 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/30107 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2224/05099

Abstract: A semiconductor device includes a chip, at least one element electrically coupled to the chip, an adhesive at least partially covering the at least one element, and a mold material at least partially covering the chip and the adhesive.

Abstract translation: 半导体器件包括芯片，至少一个元件，电耦合到芯片，至少部分覆盖至少一个元件的粘合剂，以及至少部分地覆盖芯片和粘合剂的模具材料。

公开(公告)号：US20140097514A1

公开(公告)日：2014-04-10

申请号：US13647740

申请日：2012-10-09

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Klaus Elian ,  Jens Pohl ,  Horst Theuss ,  Renate Hofmann ,  Alexander Glas ,  Carsten Ahrens

IPC: H01L27/08 ,  H01L21/78

CPC classification number: H01L23/295 ,  H01F2017/0066 ,  H01F2017/0086 ,  H01L21/568 ,  H01L23/49816 ,  H01L23/5227 ,  H01L23/5389 ,  H01L23/645 ,  H01L24/19 ,  H01L24/96 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/73267 ,  H01L2224/94 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/19042 ,  H01L2924/19104 ,  H01L2224/03 ,  H01L2924/00

Abstract: A semiconductor package includes a semiconductor chip, an inductor applied to the semiconductor chip. The inductor includes at least one winding. A space within the at least one winding is filled with a magnetic material.

Abstract translation: 半导体封装包括半导体芯片，施加到半导体芯片的电感器。 电感器包括至少一个绕组。 至少一个绕组内的空间填充有磁性材料。