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公开(公告)号：US20200294891A1
公开(公告)日：2020-09-17
申请号：US16891916
申请日：2020-06-03
Applicant: InnoLux Corporation
Inventor： Ming-Yen WENG , Ker-Yih KAO , Chia-Chi HO , Tsutomu SHINOZAKI , Cheng-Chi WANG , I-Yin LI
IPC: H01L23/485 , H01L21/311 , H01L23/66 , H01L25/065 , H01L21/48 , H01Q1/38
Abstract: A high-frequency device manufacturing method is provided. The method includes providing a substrate; forming a conductive material on the substrate; standing the substrate and the conductive material for a first time duration; forming a conductive layer by sequentially repeating the steps of forming the conductive material and standing at least once; and patterning the conductive layer. The thickness of the conductive layer is in a range from 0.9 μm to 10 μm. A high-frequency device is also provided.
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公开(公告)号：US20200251812A1
公开(公告)日：2020-08-06
申请号：US16732701
申请日：2020-01-02
Applicant: InnoLux Corporation
Inventor： Chia-Ping TSENG , Ker-Yih KAO , Chia-Chi HO , Ming-Yen WENG , Hung-I TSENG , Shu-Ling WU , Huei-Ying CHEN
Abstract: An antenna device is provided. The antenna device includes a first substrate, a multilayer electrode, a second substrate, and a liquid-crystal layer. The multilayer electrode is disposed on the first substrate, and the multilayer electrode includes a first conductive layer, a second conductive layer, and a third conductive layer. The second conductive layer is disposed on the first conductive layer. The third conductive layer is disposed on the second conductive layer. The liquid-crystal layer is disposed between the first substrate and the second substrate. In addition, the third conductive layer includes a first portion that extends beyond the second conductive layer.
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公开(公告)号：US20200235261A1
公开(公告)日：2020-07-23
申请号：US16726285
申请日：2019-12-24
Applicant: InnoLux Corporation
Inventor： Shun-Yuan HU , Chin-Lung TING , Ker-Yih KAO , Li-Wei MAO
Abstract: Some embodiments of the present disclosure provide a light-emitting diode package. The light-emitting diode package includes a transparent substrate. The light-emitting diode package also includes a first light-emitting diode which is disposed on the transparent substrate and has a first multiple quantum well structure. The light-emitting diode package further includes a second light-emitting diode which is disposed on the transparent substrate and has a second multiple quantum well structure. The first multiple quantum well structure and the second multiple quantum well structure are disposed to emit lights with different wavelengths.
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公开(公告)号：US20190386089A1
公开(公告)日：2019-12-19
申请号：US16407398
申请日：2019-05-09
Applicant: InnoLux Corporation
Inventor： Yi-Hua HSU , Ker-Yih KAO
Abstract: A tiled electronic device includes a plurality of display panels, and at least one of the display panels includes a flexible substrate, a pixel, and two signal wires. The flexible substrate has a display portion and a bent portion connected to the display portion. The pixel is disposed on the display portion. The signal wires are disposed on the flexible substrate, and electrically connected to the pixel. Each of the signal wires has a first segment disposed on the display portion, and a second segment disposed on the bent portion. The two first sections have a first pitch, and the two second sections have a second pitch. The first pitch is different than the second pitch.
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Patent Agency Ranking
公开(公告)号：US20180375202A1
公开(公告)日：2018-12-27
申请号：US15906126
申请日：2018-02-27
Applicant: InnoLux Corporation
Inventor： I-Yin LI , Yi-Hung LIN , Chia-Chi HO , Li-Wei SUNG , Ming-Yen WENG , Hung-I TSENG , Kuo-Chun LO , Charlene SU , Ker-Yih KAO
CPC classification number: H01Q1/40 , G02F1/1313 , H01Q1/2266 , H01Q1/2275 , H01Q1/2283 , H01Q1/24 , H01Q1/241 , H01Q1/38 , H01Q1/50 , H01Q3/44 , H01Q9/0407 , H01Q9/0457 , H01Q13/10
Abstract: A microwave modulation device includes a first radiator, a second radiator and a modulation structure. The first radiator includes a substrate; a metal layer disposed on the substrate; a protective layer disposed on at least a portion of the metal layer and including a through hole overlapping with at least a portion of the metal layer; and an etch stop layer disposed between the metal layer and the protective layer. The second radiator disposed corresponding to the first radiator. The modulation structure is disposed between the first radiator and the second radiator.
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公开(公告)号：US20180206334A1
公开(公告)日：2018-07-19
申请号：US15853517
申请日：2017-12-22
Applicant: InnoLux Corporation
Inventor： I-Yin LI , Chia-Chi HO , Yi-Hung LIN , Chen-Shuo HSIEH , Ker-Yih KAO
CPC classification number: H05K1/0243 , H01P3/082 , H01P11/003 , H01Q1/38 , H05K1/0271 , H05K3/0058
Abstract: A metal-laminated structure is provided. The metal-laminated structure includes a substrate, a compressive stress layer disposed on the substrate, and at least one metal layer disposed on the compressive stress layer, wherein the thickness ratio of the metal layer to the compressive stress layer is in a range from 1 to 30. A high-frequency device including the metal-laminated structure is also provided.
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公开(公告)号：US20180204785A1
公开(公告)日：2018-07-19
申请号：US15844907
申请日：2017-12-18
Applicant: InnoLux Corporation
Inventor： Ming-Yen WENG , Ker-Yih KAO , Chia-Chi HO , Tsutomu SHINOZAKI , Cheng-Chi WANG , I-Yin LI
IPC: H01L23/485 , H01L21/311 , H01L21/48 , H01L25/065 , H01L23/66
Abstract: A high-frequency device manufacturing method is provided. The method includes providing a substrate; forming a conductive material on the substrate; standing the substrate and the conductive material for a first time duration; forming a conductive layer by sequentially repeating the steps of forming the conductive material and standing at least once; and patterning the conductive layer. The thickness of the conductive layer is in a range from 0.9 μm to 10 μm. A high-frequency device is also provided.
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公开(公告)号：US20160054617A1
公开(公告)日：2016-02-25
申请号：US14931275
申请日：2015-11-03
Inventor： Hsin-Yu LEE , Ching-Che YANG , Ker-Yih KAO , Yu-Ju CHEN
IPC: G02F1/1333 , G02F1/1337 , G02F1/1343
CPC classification number: G02F1/133345 , G02F1/133707 , G02F1/13439 , G02F1/136286 , H01L33/42
Abstract: A liquid crystal display device includes: a first substrate; a second substrate spaced apart from the first substrate; and a plurality of liquid crystal molecules disposed between the first and second substrates. The first substrate includes a transparent substrate, an insulator layer formed on a surface of the transparent substrate and formed with a plurality of grooves, and a pixel electrode formed on a surface of the insulator layer and formed with a plurality of electrode slits.
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公开(公告)号：US20140368748A1
公开(公告)日：2014-12-18
申请号：US14281276
申请日：2014-05-19
Applicant: InnoLux Corporation
Inventor： Ker-Yih KAO , Tsan-Jen CHEN , Chen-Kuan KAO , Chien-Hsing LEE
IPC: G03F7/20
CPC classification number: G03F7/201
Abstract: A light exposure system executes a light exposure process to an assembly cell, which includes a first substrate, a second substrate and a liquid crystal layer disposed between the first and second substrates. The light exposure system comprises a transmission device, two moving stages and a light source module. The moving stages are disposed on the transmission device and at least one of the moving stages carries the assembly cell. The light source module includes at least a light emitting element. The transmission device moves at least one of the moving stages carrying the assembly cell or the light source module and the light emitting element emits the light to the assembly cell. A light exposure process applied to the light exposure system is also disclosed.
Abstract translation: 曝光系统对包括第一基板，第二基板和设置在第一和第二基板之间的液晶层的组装单元执行曝光处理。 曝光系统包括传输装置，两个移动台和光源模块。 移动台设置在传动装置上，并且至少一个移动台承载组装单元。 光源模块至少包括发光元件。 传输装置移动承载组装单元或光源模块的移动台中的至少一个，并且发光元件将光发射到组装单元。 还公开了应用于曝光系统的曝光过程。
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