摘要:
The present invention relates to a coating composition which contains a one- or two-component binder and, in addition,a) 0.1 to 15.0% by weight, based on the weight of the binder, of at least one coupling agent based on a chemically modified, amorphous polyolefin having an average molecular weight of 10,000 to 100,000, a non-uniformity of 1.0 to 6.5, a chlorine content of 2.5 to 50% by weight and a total content of nitrogen, oxygen, sulfur and silicon, in the form of chemically incorporated functional groups, of about 2.5 to 15% by weight, andb) 2.5 to 50% by weight, based on the weight of the amorphous polyolefin, of a bisphenol derivative corresponding to the formula ##STR1## The present invention also relates to a process for coating plastic substrates with this coating composition and to the coated plastics obtained therefrom.
摘要:
The invention relates to a process for antistatic treatment or pretreatment for subsequent surface-coating of materials based on polyamides, polyimides or polyamideimides, where the molded articles of the material are treated with a solution of salt mixtures comprising(a) halides of elements of main groups 1 and/or 2 of the periodic system, in particular CaCl.sub.2, MgCl.sub.2, LiCl, NaCl and/or KCl and(b)(1) salts of weak inorganic bases with strong inorganic acids, in particular AlCl.sub.3, FeCl.sub.3, TiCl.sub.4, SbCl.sub.5, CaCl.sub.2, FeCl.sub.2, CuCl.sub.2, ZnCl.sub.2 and/or MoCl.sub.5(2) and/or the chelate complexes of (b1) with Schiff bases, amines, carboxylic acids, diketones, .alpha.,.beta.-unsaturated ketones and phosphines,(c) in a non-corrosive, organic swelling agent or solvent for the materials mentioned, where appropriate with the addition of water, preferably in an alcohol, at temperatures up to the boiling point of the solvents, preferably at temperatures of from -15.degree. C. to +60.degree. C., for from 0.5 to 30 minutes, and the molded articles are washed with water or solvents and subsequently dried.Antistatic molded articles treated by the process and molded articles pretreated for subsequent surface-coating, and the use thereof, are furthermore claimed.
摘要:
Composite materials are formed by subjecting a highly elastic material to a plasma treatment and then allowing a polyurethane foam forming mixture to foam on the plasma treated surface. These composites are particularly useful as shoe soles and as insulating materials.
摘要:
For the electroless metallization of base carriers for the manufacture of printed circuit boards, those carrier materials are outstandingly suitable on which complex compounds are built up in which the ligands and the ions to be complexed have entered a "host-guest interrelationship". Examples of such activator compounds are complexes of crown ethers, cryptands and the like. The resulting printed circuit boards are distinguished by the high adhesive strengths of the metals deposited on them.
摘要:
A mild activation process for the electroless metallization of polyamide mouldings comprises treating the mouldings with a solution of a mixture of halides of elements of the 1st and 2nd main group of the Periodic Table (for example CaCl.sub.2) with salts of weak inorganic bases and strong inorganic acids (for example AlCl.sub.3) in a swelling agent or solvent for polyamides and with a metal-organic complex compound of elements of the 1st or 8th sub-group of the Periodic Table. The sequence is here immaterial.
摘要:
The firmly adhesive metallization, in particular partial metallization, of the surface of semiconductors is possible, without pickling, by carrying out the activation with organometallic compounds of metals of the IB and VIIIB Groups of the Periodic Table of Elements, then reducing in a conventional manner and metallizing without current.