公开(公告)号：US07323416B2

公开(公告)日：2008-01-29

申请号：US11196876

申请日：2005-08-04

申请人： Feng Q. Liu ,  Tianbao Du ,  Alain Duboust ,  Yan Wang ,  Yongqi Hu ,  Stan D. Tsai ,  Liang-Yuh Chen ,  Wen-Chiang Tu ,  Wei-Yung Hsu

发明人： Feng Q. Liu ,  Tianbao Du ,  Alain Duboust ,  Yan Wang ,  Yongqi Hu ,  Stan D. Tsai ,  Liang-Yuh Chen ,  Wen-Chiang Tu ,  Wei-Yung Hsu

IPC分类号： H01L21/302

CPC分类号： B23H5/08 ,  B24B37/042 ,  C25F3/02 ,  H01L21/32125 ,  H01L21/6875 ,  H01L21/7684

摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a method is provided for processing a substrate to remove conductive material disposed over narrow feature definitions formed in a substrate at a higher removal rate than conductive material disposed over wide feature definitions formed in a substrate by an electrochemical mechanical polishing technique, and then polishing the substrate by at least a chemical mechanical polishing technique.

摘要翻译： 提供了抛光组合物和从衬底表面去除导电材料的方法。 在一个方面，提供了一种处理衬底以除去布置在形成于衬底中的窄特征定义上的导电材料的方法，该导电材料以比通过电化学机械抛光技术在衬底中形成的宽特征定义上布置的导电材料更高的去除速率除去，以及 然后用至少一种化学机械抛光技术研磨衬底。

公开(公告)号：US07276743B2

公开(公告)日：2007-10-02

申请号：US11127790

申请日：2005-05-11

申请人： Antoine P. Manens ,  Suresh Shrauti ,  Alain Duboust ,  Yan Wang ,  Liang-Yuh Chen

发明人： Antoine P. Manens ,  Suresh Shrauti ,  Alain Duboust ,  Yan Wang ,  Liang-Yuh Chen

IPC分类号： H01L29/74 ,  H01L31/111

CPC分类号： B23H5/08 ,  B24B37/32

摘要： A retaining ring for use with electrochemical mechanical processing is described. The retaining ring has a generally annular body formed with a conductive portion and a non-conductive portion. The non-conductive portion contacts the substrate during polishing. The conductive portion is electrically biased during polishing to reduce the edge effect that tends to occur with conventional electrochemical mechanical processing systems.

摘要翻译： 描述了一种用于电化学机械加工的保持环。 保持环具有形成有导电部分和非导电部分的大致环形体。 非导电部分在抛光期间接触基板。 导电部分在抛光期间被电偏置以减少常规电化学机械处理系统倾向于发生的边缘效应。

公开(公告)号：US07128825B2

公开(公告)日：2006-10-31

申请号：US10378097

申请日：2003-02-26

申请人： Feng Q. Liu ,  Stan D. Tsai ,  Yongqi Hu ,  Siew S. Neo ,  Yan Wang ,  Alain Duboust ,  Liang-Yuh Chen

发明人： Feng Q. Liu ,  Stan D. Tsai ,  Yongqi Hu ,  Siew S. Neo ,  Yan Wang ,  Alain Duboust ,  Liang-Yuh Chen

IPC分类号： C25F3/00

CPC分类号： H01L21/32125 ,  B23H3/08 ,  B23H5/08 ,  B24B37/0056 ,  B24B37/044 ,  B24B37/046 ,  C09G1/02 ,  C09G1/04 ,  C25F3/02 ,  H01L21/32134

摘要： Polishing compositions and methods for removing conductive materials from a substrate surface are provided. In one aspect, a composition includes an acid based electrolyte system, one or more chelating agents, one or more corrosion inhibitors, one or more inorganic or organic acid salts, one or more pH adjusting agents to provide a pH between about 3 and about 10, a polishing enhancing material selected from the group of abrasive particles, one or more oxidizers, and combinations thereof, and a solvent. The composition may be used in an conductive material removal process including disposing a substrate having a conductive material layer formed thereon in a process apparatus comprising an electrode, providing the composition between the electrode and substrate, applying a bias between the electrode and the substrate, and removing conductive material from the conductive material layer.

公开(公告)号：US20050056537A1

公开(公告)日：2005-03-17

申请号：US10972884

申请日：2004-10-25

申请人： Liang-Yuh Chen ,  Wei-Yung Hsu ,  Alain Duboust ,  Ratson Morad ,  Daniel Carl

发明人： Liang-Yuh Chen ,  Wei-Yung Hsu ,  Alain Duboust ,  Ratson Morad ,  Daniel Carl

IPC分类号： B24B37/00 ,  B23H5/08 ,  B24B37/04 ,  H01L21/304 ,  H01L21/316 ,  B23H5/00

CPC分类号： B23H5/08

摘要： A method and apparatus are provided for planarizing a material layer on a substrate. In one aspect, a method is provided for processing a substrate including forming a passivation layer on a substrate surface, polishing the substrate in an electrolyte solution, applying an anodic bias to the substrate surface, and removing material from at least a portion of the substrate surface. In another aspect, an apparatus is provided which includes a partial enclosure, polishing article, a cathode, a power source, a substrate carrier movably disposed above the polishing article, and a computer based controller to position a substrate in an electrolyte solution to form a passivation layer on a substrate surface, to polish the substrate in the electrolyte solution with the polishing article, and to apply an anodic bias to the substrate surface or polishing article to remove material from at least a portion of the substrate surface.

摘要翻译： 提供了一种用于平坦化衬底上的材料层的方法和装置。 在一个方面，提供一种用于处理衬底的方法，包括在衬底表面上形成钝化层，在电解质溶液中抛光衬底，向衬底表面施加阳极偏压，以及从衬底的至少一部分去除材料 表面。 在另一方面，提供了一种装置，其包括部分外壳，抛光制品，阴极，电源，可移动地设置在抛光制品上方的基板载体，以及基于计算机的控制器，以将基板定位在电解质溶液中以形成 在衬底表面上的钝化层，用抛光制品抛光电解质溶液中的衬底，并将阳极偏压施加到衬底表面或抛光制品上以从衬底表面的至少一部分去除材料。

公开(公告)号：US20070084729A1

公开(公告)日：2007-04-19

申请号：US11251581

申请日：2005-10-14

申请人： Antoine Manens ,  Alain Duboust ,  Paul Butterfield ,  Ricardo Martinez ,  Yan Wang ,  Jose Salas-Vernis

发明人： Antoine Manens ,  Alain Duboust ,  Paul Butterfield ,  Ricardo Martinez ,  Yan Wang ,  Jose Salas-Vernis

IPC分类号： C25D21/06

CPC分类号： C25F7/00 ,  B23H5/08 ,  B24B37/16 ,  B24B53/017

摘要： Embodiments of the invention generally provide a method and apparatus for cleaning an electrical contact in an electrochemical mechanical planarizing apparatus. In one embodiment, a method for cleaning a contact assembly in an electroprocessing apparatus includes the steps of draining electrolyte from the contact assembly and flowing a rinsing fluid into the contact assembly. In another embodiment, a method for cleaning a contact assembly in an electroprocessing apparatus includes the steps of preventing fluid from passing between an interface of the contact assembly and a pad disposed outward thereof, flowing a rinsing fluid into the contact assembly and draining fluid flowing out of the contact assembly.

摘要翻译： 本发明的实施例通常提供一种用于清洁电化学机械平面化装置中的电接触的方法和装置。 在一个实施例中，用于在电加工设备中清洁接触组件的方法包括以下步骤：从接触组件排出电解液并将冲洗流体流动到接触组件中。 在另一个实施例中，用于清洁电加工设备中的接触组件的方法包括以下步骤：防止流体在接触组件的界面和设置在其外部的垫片之间通过，将冲洗流体流动到接触组件中并排出流出的流体 的接触组件。

公开(公告)号：US07608173B2

公开(公告)日：2009-10-27

申请号：US11003083

申请日：2004-12-02

申请人： Antoine P. Manens ,  Feng Q Liu ,  Paul D. Butterfield ,  Alain Duboust ,  Rashid Mavliev

发明人： Antoine P. Manens ,  Feng Q Liu ,  Paul D. Butterfield ,  Alain Duboust ,  Rashid Mavliev

IPC分类号： C25F7/00 ,  B23H5/06 ,  B23H3/00 ,  C25F3/02

CPC分类号： B24B37/32 ,  C25F3/02 ,  C25F7/00

摘要： A retaining ring for electrochemical mechanical processing is described. The ring has a conductive portion having an upper surface and a lower surface and an insulating portion. The insulating portion has one or more openings extending therethrough, exposing the lower surface of the conductive portion. An upper surface of the insulating portion contacts the lower surface of the conductive portion. In an electrochemical mechanical polishing process, the retaining ring can be biased separately from a substrate being polished.

摘要翻译： 描述了用于电化学机械加工的保持环。 环具有导电部分，具有上表面和下表面以及绝缘部分。 绝缘部分具有延伸穿过其中的一个或多个开口，露出导电部分的下表面。 绝缘部的上表面与导电部的下表面接触。 在电化学机械抛光工艺中，保持环可以与被抛光的基板分开偏置。

公开(公告)号：US20070187258A1

公开(公告)日：2007-08-16

申请号：US11355769

申请日：2006-02-15

申请人： Tianbao Du ,  Feng Liu ,  Alain Duboust ,  Wei-Yung Hsu ,  Liang-Yuh Chen

发明人： Tianbao Du ,  Feng Liu ,  Alain Duboust ,  Wei-Yung Hsu ,  Liang-Yuh Chen

IPC分类号： B23H5/00

CPC分类号： B23H5/08 ,  B24B37/042 ,  C25F3/02 ,  H01L21/32125

摘要： Methods are provided for removing conductive materials from a substrate surface. In one aspect, a method includes providing a substrate comprising dielectric feature definitions formed between substrate field regions, a barrier material disposed in the feature definitions and on the substrate field regions, and a conductive material disposed on the barrier material, polishing the substrate to substantially remove a bulk portion of the conductive material with a direct current bias, and polishing the substrate to remove a residual portion of the conductive material with a pulse bias.

摘要翻译： 提供了从衬底表面去除导电材料的方法。 在一个方面，一种方法包括提供包括在衬底场区域之间形成的介电特征定义的衬底，设置在特征定义中的衬底场区域上的阻挡材料和设置在阻挡材料上的导电材料， 以直流偏压去除导电材料的主体部分，并抛光衬底以用脉冲偏压去除导电材料的剩余部分。

公开(公告)号：US20070066200A9

公开(公告)日：2007-03-22

申请号：US11418557

申请日：2006-05-05

申请人： Shijian Li ,  Liang-Yuh Chen ,  Alain Duboust

发明人： Shijian Li ,  Liang-Yuh Chen ,  Alain Duboust

IPC分类号： H01L21/306 ,  B24D11/00

CPC分类号： B24B37/24 ,  B23H5/08 ,  B24B57/02

摘要： Methods, articles of manufacture, and apparatus are provided for depositing and planarizing one or more layers of material on a substrate, or combinations thereof, are disclosed. In one embodiment, an article of manufacture is provided for polishing a substrate, comprising a polishing article having a polishing surface, a plurality of perforations formed in at least a portion of the polishing article for flow of material therethrough, and a plurality of grooves disposed in the polishing surface. The article of manufacture may be used in a method for processing a substrate, comprising positioning the substrate in an electrolyte solution containing a polishing article, optionally depositing a material on the substrate by an electrochemical deposition method, and polishing the substrate with the polishing article.

摘要翻译： 提供了方法，制品和装置，用于沉积和平坦化衬底上的一层或多层材料，或其组合。 在一个实施例中，提供了用于抛光衬底的制品，其包括具有抛光表面的抛光制品，在抛光制品的至少一部分中形成的用于材料流动的多个穿孔，以及多个槽， 在抛光面上。 制造物品可以用于处理基材的方法，包括将基底定位在含有抛光制品的电解质溶液中，任选地通过电化学沉积方法将材料沉积在基底上，并用抛光制品抛光基底。

公开(公告)号：US07029365B2

公开(公告)日：2006-04-18

申请号：US10744904

申请日：2003-12-23

申请人： Shou-Sung Chang ,  Stan D Tsai ,  Donald J. K. Olgado ,  Liang-Yuh Chen ,  Alain Duboust ,  Ralph M. Wadensweiler

发明人： Shou-Sung Chang ,  Stan D Tsai ,  Donald J. K. Olgado ,  Liang-Yuh Chen ,  Alain Duboust ,  Ralph M. Wadensweiler

IPC分类号： B24D11/02 ,  C25F3/00 ,  C25D17/00 ,  C25C7/04

CPC分类号： B24B37/22 ,  B23H5/06 ,  B23H5/08 ,  B23H5/10 ,  B24B37/046 ,  B24B37/11 ,  B24B37/24 ,  B24B37/26 ,  B24B49/16 ,  B24B53/017 ,  C25D17/10 ,  H01L21/32125

摘要： Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer. The upper surface of the electrode is at least partially exposed to the working surface to provide an electrolyte pathway between the upper surface of the electrode and the working surface.

公开(公告)号：US06811680B2

公开(公告)日：2004-11-02

申请号：US10038066

申请日：2002-01-03

申请人： Liang-Yuh Chen ,  Wei-Yung Hsu ,  Alain Duboust ,  Ratson Morad ,  Daniel A. Carl

发明人： Liang-Yuh Chen ,  Wei-Yung Hsu ,  Alain Duboust ,  Ratson Morad ,  Daniel A. Carl

IPC分类号： B23H506

CPC分类号： B23H5/08

摘要： A method and apparatus are provided for planarizing a material layer on a substrate. In one aspect, a method is provided for processing a substrate including forming a passivation layer on a substrate surface, polishing the substrate in an electrolyte solution, applying an anodic bias to the substrate surface, and removing material from at least a portion of the substrate surface. In another aspect, an apparatus is provided which includes a partial enclosure, polishing article, a cathode, a power source, a substrate carrier movably disposed above the polishing article, and a computer based controller to position a substrate in an electrolyte solution to form a passivation layer on a substrate surface, to polish the substrate in the electrolyte solution with the polishing article, and to apply an anodic bias to the substrate surface or polishing article to remove material from at least a portion of the substrate surface.

摘要翻译： 提供了一种用于平坦化衬底上的材料层的方法和装置。 在一个方面，提供一种用于处理衬底的方法，包括在衬底表面上形成钝化层，在电解质溶液中抛光衬底，向衬底表面施加阳极偏压，以及从衬底的至少一部分去除材料 表面。 在另一方面，提供了一种装置，其包括部分外壳，抛光制品，阴极，电源，可移动地设置在抛光制品上方的基板载体，以及基于计算机的控制器，以将基板定位在电解质溶液中以形成 在衬底表面上的钝化层，用抛光制品抛光电解质溶液中的衬底，并将阳极偏压施加到衬底表面或抛光制品上以从衬底表面的至少一部分去除材料。